Patents by Inventor Jong-Sup Song
Jong-Sup Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10205074Abstract: A semiconductor light emitting device package includes a semiconductor light emitting device including a plurality of electrodes, a circuit board including a mounting region, the semiconductor light emitting device being positioned on the mounting region of the circuit board, and a plurality of electrode pads on the circuit board, the plurality of electrode pads being electrically connected to the plurality of electrodes, wherein each of the plurality of electrode pads includes a first region and a second region, the first region overlapping the mounting region, and the second region excluding the first region, and wherein the plurality of electrode pads is arranged in a shape of rotational symmetry around a pivot point of the mounting region.Type: GrantFiled: August 9, 2016Date of Patent: February 12, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Jong Sup Song
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Publication number: 20180366621Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: ApplicationFiled: August 22, 2018Publication date: December 20, 2018Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong YUN, Jong Sup SONG
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Publication number: 20180366615Abstract: A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.Type: ApplicationFiled: December 14, 2017Publication date: December 20, 2018Inventors: Chi-Goo Kang, Sun-Woo KIM, Jong-Sup SONG, Ho-Young SONG
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Patent number: 10121934Abstract: There is provided a method for manufacturing a semiconductor light emitting device package including steps of disposing a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, shaping a mixture containing a wavelength conversion material and a glass composition on the plurality of light emitting structures, sintering the mixture to form a wavelength conversion part, removing the support substrate, and cutting the plurality of light emitting structures into individual device units.Type: GrantFiled: December 9, 2015Date of Patent: November 6, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Jong Sup Song
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Publication number: 20180315912Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: ApplicationFiled: October 27, 2017Publication date: November 1, 2018Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
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Patent number: 10084118Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: GrantFiled: December 31, 2015Date of Patent: September 25, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong Yun, Jong Sup Song
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Patent number: 10014454Abstract: A light-emitting device includes a light-emitting structure, a lens, and a reflective layer. The light-emitting structure includes a light-emitting stack structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, which are stacked, a first electrode layer electrically connected to the first-conductivity-type semiconductor layer, and a second electrode layer electrically connected to the second-conductivity-type semiconductor layer. The lens is located on the light-emitting structure. The reflective layer is located on the lens.Type: GrantFiled: January 23, 2017Date of Patent: July 3, 2018Assignee: Samsung Electronics CO., Ltd.Inventors: Kyung-wook Hwang, Min-gyeong Gwon, Sae-sil Kim, Eun-joo Shin, Yu-ri Jung, Won-soo Ji, Jong-sup Song
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Publication number: 20180087751Abstract: There are provided a lighting lens, a lighting lens array, and a lighting apparatus. The lighting lens may include an incidence part to receive light from a light source and an emission part to emit light provided from the incidence part. The incidence part may have a concave region that contains a light source and a first protrusion at a rear side of the light source that protrudes downwards from a top surface of the concave region. The emission part may include a dome-shaped part that encloses the incidence part and a second protrusion at the rear side of the light source that protrudes upwards from a top surface of the dome-shaped part. A lowermost portion of the emission part may be formed at a first plane, and an angle between an outer surface of the emission part and the first plane is an obtuse angle.Type: ApplicationFiled: September 22, 2017Publication date: March 29, 2018Inventors: Seung-gyun JUNG, Won-soo JI, Jong-sup SONG, Sang-woo HA
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Patent number: 9897266Abstract: A light source module includes a light source, a light guide plate on the light source and including at least one recess portion in an upper surface thereof, and a filter sheet on an upper surface of the light guide plate and having a pattern. The pattern may be configured to partially reflect and partially transmit light emitted from the light source through the light guide plate.Type: GrantFiled: September 29, 2016Date of Patent: February 20, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: Kyung Mi Moon, Sang Woo Ha, Jong Sup Song, Tetsuo Ariyoshi, Jun Cho, Won Soo Ji
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Publication number: 20170324011Abstract: A light-emitting device includes a light-emitting structure, a lens, and a reflective layer. The light-emitting structure includes a light-emitting stack structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, which are stacked, a first electrode layer electrically connected to the first-conductivity-type semiconductor layer, and a second electrode layer electrically connected to the second-conductivity-type semiconductor layer. The lens is located on the light-emitting structure. The reflective layer is located on the lens.Type: ApplicationFiled: January 23, 2017Publication date: November 9, 2017Inventors: Kyung-wook Hwang, Min-gyeong Gwon, Sae-sil Kim, Eun-joo Shin, Yu-ri Jung, Won-soo Ji, Jong-sup Song
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Publication number: 20170261161Abstract: A light source module includes a light source, a light guide plate on the light source and including at least one recess portion in an upper surface thereof, and a filter sheet on an upper surface of the light guide plate and having a pattern. The pattern may be configured to partially reflect and partially transmit light emitted from the light source through the light guide plate.Type: ApplicationFiled: September 29, 2016Publication date: September 14, 2017Applicant: Samsung Electronics Co., Ltd.Inventors: Kyung Mi MOON, Sang Woo HA, Jong Sup SONG, Tetsuo ARIYOSHI, Jun CHO, Won Soo JI
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Publication number: 20170179352Abstract: A semiconductor light emitting device package includes a semiconductor light emitting device including a plurality of electrodes, a circuit board including a mounting region, the semiconductor light emitting device being positioned on the mounting region of the circuit board, and a plurality of electrode pads on the circuit board, the plurality of electrode pads being electrically connected to the plurality of electrodes, wherein each of the plurality of electrode pads includes a first region and a second region, the first region overlapping the mounting region, and the second region excluding the first region, and wherein the plurality of electrode pads is arranged in a shape of rotational symmetry around a pivot point of the mounting region.Type: ApplicationFiled: August 9, 2016Publication date: June 22, 2017Inventor: Jong Sup SONG
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Patent number: 9680074Abstract: An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising a convex curved surface. The optical device has an aspherical shape in a cross-section taken along a diagonal direction of the quadrangle and has a semicircular shape in a cross-section taken along a direction connecting a central portion of a first side of the quadrangle and a central portion of a second side opposite to the first side of the quadrangle. In a cross-sectional view of the optical device, the second surface is continuously varied between the semicircular shape of the cross-section and the aspherical shape of the cross-section.Type: GrantFiled: March 2, 2016Date of Patent: June 13, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hoon Yun, Jong Sup Song, Soo Hwan Lee, Saesil Kim, Mi Jeong Yun
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Publication number: 20160380169Abstract: An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising a convex curved surface. The optical device has an aspherical shape in a cross-section taken along a diagonal direction of the quadrangle and has a semicircular shape in a cross-section taken along a direction connecting a central portion of a first side of the quadrangle and a central portion of a second side opposite to the first side of the quadrangle. In a cross-sectional view of the optical device, the second surface is continuously varied between the semicircular shape of the cross-section and the aspherical shape of the cross-section.Type: ApplicationFiled: March 2, 2016Publication date: December 29, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hoon YUN, Jong Sup SONG, Soo Hwan LEE, Saesil KIM, Mi Jeong YUN
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Patent number: 9477032Abstract: A substrate for packaging flip-chip light emitting device (LED) includes a substrate including a chip mount region, a first metal pattern overlapping a part of the chip mount region and disposed on the substrate, a second metal pattern disposed in a region including the chip mount region that is not overlapped with the first metal pattern, at an outer side of the first metal pattern, a third metal pattern disposed at an outer side of the second metal pattern, a first isolation line defined in a boundary between the first metal pattern and the second metal pattern, a second isolation line defined in a boundary between the second metal pattern and the third metal pattern, a lower pad disposed on a bottom of the substrate, and a via disposed to connect the first and second metal patterns to the lower pad in the substrate.Type: GrantFiled: August 26, 2014Date of Patent: October 25, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jong-Sup Song, Sung-Soo Park
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Publication number: 20160240746Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: ApplicationFiled: December 31, 2015Publication date: August 18, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong YUN, Jong Sup SONG
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Publication number: 20160172533Abstract: There is provided a method for manufacturing a semiconductor light emitting device package including steps of disposing a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, shaping a mixture containing a wavelength conversion material and a glass composition on the plurality of light emitting structures, sintering the mixture to form a wavelength conversion part, removing the support substrate, and cutting the plurality of light emitting structures into individual device units.Type: ApplicationFiled: December 9, 2015Publication date: June 16, 2016Inventor: Jong Sup SONG
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Patent number: 9153759Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.Type: GrantFiled: June 20, 2014Date of Patent: October 6, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hak Hwan Kim, Min Jung Kim, Kyung Mi Moon, Jong Sup Song, Jae Sung You, Ill Heoung Choi, Cheol Jun Yoo
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Publication number: 20150187999Abstract: A substrate for packaging flip-chip light emitting device (LED) includes a substrate including a chip mount region, a first metal pattern overlapping a part of the chip mount region and disposed on the substrate, a second metal pattern disposed in a region including the chip mount region that is not overlapped with the first metal pattern, at an outer side of the first metal pattern, a third metal pattern disposed at an outer side of the second metal pattern, a first isolation line defined in a boundary between the first metal pattern and the second metal pattern, a second isolation line defined in a boundary between the second metal pattern and the third metal pattern, a lower pad disposed on a bottom of the substrate, and a via disposed to connect the first and second metal patterns to the lower pad in the substrate.Type: ApplicationFiled: August 26, 2014Publication date: July 2, 2015Inventors: Jong-Sup SONG, Sung-Soo PARK
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Patent number: 8960932Abstract: A light emitting device includes: a substrate having a bar shape; a plurality of light emitting elements separately mounted in a lengthwise direction of the substrate on an upper surface of the substrate; and a light-transmissive cover formed to be upwardly convex, having one or more localized concave portions, and installed on the substrate to cover at least two of the plurality of light emitting elements together.Type: GrantFiled: March 30, 2012Date of Patent: February 24, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Jae Sung You, Jong Sup Song