Abstract: Provided are a tungsten precursor compound to which a substituent is bonded so as to obtain thermal stability and a method of forming a tungsten-containing film using the precursor.

Abstract: The present invention relates to a tungsten precursor compound to which a substituent is bonded so as to obtain thermal stability and a tungsten-containing film in a mild condition at a high yield, and a process for producing the same. The present invention also provides a method for depositing tungsten-containing film.

Abstract: The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.

Abstract: An exemplary embodiment of the present invention relates to a conductive metal ink composition comprising a conductive metal powder; a non-aqueous solvent; an organo phosphate compound; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition.

Abstract: The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.

Abstract: An exemplary embodiment of the present invention relates to a conductive metal ink composition comprising a conductive metal powder; a non-aqueous solvent; an organo phosphate compound; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition.

Abstract: Disclosed is ink for ink jet printing, which comprises: metal nanoparticles comprising a surfactant attached to surfaces thereof; and a first solvent, wherein the metal nanoparticles are present in an amount of 50˜70 parts by weight based on 100 parts by weight of the ink, and the surfactant is present in an amount of 0.5˜5 parts by weight based on 100 parts by weight of the metal nanoparticles. Metal nanoparticles used in the ink and a method for preparing the metal nanoparticles are also disclosed. The method for preparing metal nanoparticles for use in ink for ink jet printing comprises a step of washing surplus surfactant with at least one solvent. By doing so, the surplus surfactant remaining on the surfaces of the metal nanoparticles can be minimized, resulting in a drop in viscosity of ink comprising the metal nanoparticles.

Abstract: Disclosed is ink for ink jet printing, which comprises: metal nanoparticles comprising a surfactant attached to surfaces thereof; and a first solvent, wherein the metal nanoparticles are present in an amount of 50˜70 parts by weight based on 100 parts by weight of the ink, and the surfactant is present in an amount of 0.5˜5 parts by weight based on 100 parts by weight of the metal nanoparticles. Metal nanoparticles used in the ink and a method for preparing the metal nanoparticles are also disclosed. The method for preparing metal nanoparticles for use in ink for ink jet printing comprises a step of washing surplus surfactant with at least one solvent. By doing so, the surplus surfactant remaining on the surfaces of the metal nanoparticles can be minimized, resulting in a drop in viscosity of ink comprising the metal nanoparticles.

Abstract: Disclosed is a dispersion adjuvant for metal nanoparticles, which comprises an amide derivative. Metal nanoink comprising the dispersion adjuvant is also disclosed. The dispersion adjuvant helps metal nanoparticles to be dispersed in a solvent in the presence of a dispersant, inhibits metal particles from agglomerating among themselves, and increases the content of metal nanoparticles in a solvent. Additionally, interconnection lines formed by using the nanoink have an increased content of metal per unit area, and thus provide improved conductivity.