Abstract: The present disclosure provides an ultra-high color rendering white light-emitting device including a semiconductor LED chip that emits a violet wavelength range of light with an emission peak at 380 nm to 430 nm, and a phosphor layer distributed in a transparent resin layer that emits light when excited by an excitation wavelength of the violet LED chip, wherein the phosphor layer includes a first phosphor having an emission peak at 450-470 nm, a second phosphor having an emission peak at 510-550 nm, a third phosphor having an emission peak at 550-590 nm, a fourth phosphor having an emission peak at 630-660 nm, and a fifth phosphor having an emission peak at 660-730 nm, and the ultra-high color rendering white light-emitting device has Ra that is equal to or higher than 98 and less than 100.

Abstract: The present disclosure provides an ultra-high color rendering white light-emitting device including a semiconductor LED chip that emits a violet wavelength range of light with an emission peak at 380 nm to 430 nm, and a phosphor layer distributed in a transparent resin layer that emits light when excited by an excitation wavelength of the violet LED chip, wherein the phosphor layer includes a first phosphor having an emission peak at 450-470 nm, a second phosphor having an emission peak at 510-550 nm, a third phosphor having an emission peak at 550-590 nm, a fourth phosphor having an emission peak at 630-660 nm, and a fifth phosphor having an emission peak at 660-730 nm, and the ultra-high color rendering white light-emitting device has Ra that is equal to or higher than 98 and less than 100.

Abstract: An LED package having a plurality of light emitting regions includes a plurality of LED chips. The LED package further includes a plurality of electrode portions on which each of the plurality of LED chips is mounted, and a package mold portion having a plurality of openings formed on one surface thereof so as to each emit light by the plurality of LED chips.

Abstract: An LED package having a plurality of light emitting regions includes a plurality of LED chips. The LED package further includes a plurality of electrode portions on which each of the plurality of LED chips is mounted, and a package mold portion having a plurality of openings formed on one surface thereof so as to each emit light by the plurality of LED chips.

Abstract: Provided is a white light emitting diode, which has excellent characteristics by using a UV chip of a specific wavelength band, and red, green blue and yellow phosphors.