Abstract: A semiconductor package may include a substrate. A conductive bump may be provided on a bottom surface of the substrate. A semiconductor chip may be provided on a top surface of the substrate. A sealing material may seal the semiconductor chip on the top of the substrate. A first conductive adhesive may be provided on a top surface of the sealing material. A second conductive adhesive may be provided on a side surface of the substrate and a side surface of the sealing material.

Abstract: A semiconductor package comprises a chip having a top surface for chip pads and a bottom surface opposite the top surface. The top and bottom surfaces define side surfaces. The package further includes an adhesive layer provided within a chip-attaching area substantially defined by side surfaces of the chip and attaches a chip to, for example, a substrate having substrate pads. This prevents the contamination of the substrate pads by the adhesive layer. In one embodiment, the adhesive layer has at least one hole formed therethrough to expose a portion of the bottom surface of the chip. The adhesive layer may include at least one passage laterally connecting the hole to the outside. Alternatively, the adhesive layer has a plurality of adhesive parts separately disposed on the semiconductor chip.

Abstract: An apparatus and method for ejecting a thin IC chip from a UV-sensitive tape attached to a bottom face of a semiconductor wafer, includes a vacuum holder that partly supports the UV-sensitive tape by applying vacuum force. The apparatus further includes an ejecting block inserted in the vacuum holder and configured to move vertically relative to the vacuum holder, and a plurality of ejecting pins inserted in the ejecting block and configured to move vertically and elastically. The ejecting pins move upward from the ejecting block driven by a pin-driving plate, detaching the IC chip from the UV-sensitive tape. Then the ejecting block moves upward from the vacuum holder driven by a block-driving shaft, applying a pressure to the bottom face of the IC chip.

Abstract: A semiconductor package comprises a chip having a top surface for chip pads and a bottom surface opposite the top surface. The top and bottom surfaces define side surfaces. The package further includes an adhesive layer provided within a chip-attaching area substantially defined by side surfaces of the chip and attaches a chip to, for example, a substrate having substrate pads. This prevents the contamination of the substrate pads by the adhesive layer. In one embodiment, the adhesive layer has at least one hole formed therethrough to expose a portion of the bottom surface of the chip. The adhesive layer may include at least one passage laterally connecting the hole to the outside. Alternatively, the adhesive layer has a plurality of adhesive parts separately disposed on the semiconductor chip.