Patents by Inventor Jong-woo Shin
Jong-woo Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250051525Abstract: The present invention relates to a hydroxylphenyl-terminated polysiloxane, a polysiloxane-polycarbonate copolymer comprising the same as repeating unit, and a method for preparing the copolymer, and more specifically, a polysiloxane of a specific structure having terminal silane unit comprising optionally substituted hydroxylphenyl group, and a polysiloxane-polycarbonate copolymer which comprises the polysiloxane and a polycarbonate block as repeating units, and thereby shows the same or more excellent transparency and significantly further improved flame retardancy as compared with the level of conventional polysiloxane-polycarbonate copolymer, and a method for preparing the same.Type: ApplicationFiled: July 4, 2022Publication date: February 13, 2025Applicant: SAMYANG CORPORATIONInventors: Seong Hyen HEO, Mi Ran KIM, Kyung Moo SHIN, Yun Ju CHANG, Seung Pil JUNG, Jin Sik CHOI, YU IL KIM, Jong Yoon KIM, Seong Woo SEO
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Publication number: 20240399410Abstract: A slurry supply device includes a slurry tank for storing slurry; a temperature controller for supplying hot or cold water to the slurry tank to control the temperature of the slurry; and a double pipe for supplying the slurry to the slurry tank while being connected to the slurry tank and for allowing hot or cold water to move to control the temperature of the slurry.Type: ApplicationFiled: September 30, 2022Publication date: December 5, 2024Applicant: LG Energy Solution, Ltd.Inventors: Hyung-Woo Choi, Sung-Mo Kang, Sang-Min Kim, Kyoung-Rok Mun, Jong-Goo Park, Jong-Woo Shin, Do-Young Ahn, Jae-Pil Lee, Shin-wook Jeon, Sang-Hoon Choy
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Publication number: 20240246106Abstract: A system for depositing a material is provided. The system includes a die for extruding the material along a principal deposition direction through an opening of the die. The die includes a cavity fluidly connected to the opening, and a flow guide extending through the cavity towards the opening for shaping a flow of the material extruded via the opening and flowing past a side of the flow guide in the cavity. The side of the flow guide comprises a widening side portion of which a width of the widening side portion increases along the principal deposition direction towards the opening.Type: ApplicationFiled: February 17, 2023Publication date: July 25, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Jong Goo PARK, Ki Hun KIM, Kyoung Rok MUN, Jong Woo SHIN, Sung Mo KANG, Jae Pil LEE
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Patent number: 11791287Abstract: A semiconductor device includes a peripheral circuit region on a lower substrate, and including circuit elements, memory cell regions including memory cells on each of a first upper substrate and a second upper substrate, which are on the lower substrate, at least one cutting region between the first upper substrate and the second upper substrate, and at least one semiconductor pattern between the first upper substrate and the second upper substrate, and adjacent to the at least one cutting region.Type: GrantFiled: August 31, 2021Date of Patent: October 17, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Geun Won Lim, Seok Cheon Baek, Ji Sung Cheon, Jong Woo Shin, Bong Hyun Choi
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Publication number: 20210398915Abstract: A semiconductor device includes a peripheral circuit region on a lower substrate, and including circuit elements, memory cell regions including memory cells on each of a first upper substrate and a second upper substrate, which are on the lower substrate, at least one cutting region between the first upper substrate and the second upper substrate, and at least one semiconductor pattern between the first upper substrate and the second upper substrate, and adjacent to the at least one cutting region.Type: ApplicationFiled: August 31, 2021Publication date: December 23, 2021Inventors: Geun Won Lim, Seok Cheon Baek, Ji Sung Cheon, Jong Woo Shin, Bong Hyun Choi
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Patent number: 11133267Abstract: A semiconductor device includes a peripheral circuit region on a lower substrate, and including circuit elements, memory cell regions including memory cells on each of a first upper substrate and a second upper substrate, which are on the lower substrate, at least one cutting region between the first upper substrate and the second upper substrate, and at least one semiconductor pattern between the first upper substrate and the second upper substrate, and adjacent to the at least one cutting region.Type: GrantFiled: December 20, 2018Date of Patent: September 28, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Geun Won Lim, Seok Cheon Baek, Ji Sung Cheon, Jong Woo Shin, Bong Hyun Choi
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Publication number: 20190333872Abstract: A semiconductor device includes a peripheral circuit region on a lower substrate, and including circuit elements, memory cell regions including memory cells on each of a first upper substrate and a second upper substrate, which are on the lower substrate, at least one cutting region between the first upper substrate and the second upper substrate, and at least one semiconductor pattern between the first upper substrate and the second upper substrate, and adjacent to the at least one cutting region.Type: ApplicationFiled: December 20, 2018Publication date: October 31, 2019Inventors: Geun Won Lim, Seok Cheon Baek, Ji Sung Cheon, Jong Woo Shin, Bong Hyun Choi
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Patent number: 8692797Abstract: A touch recognition apparatus and method in a capacitive touch screen are provided. The touch recognition apparatus includes a touch panel and a controller. The touch panel includes a first sub panel and a second panel intersecting each other. The first sub panel includes a first electrode line and a second electrode line in X axis, and a plurality of resistors connected between the first electrode line and the second electrode line in X axis. The controller outputs scan signals to the first electrode line in X axis and the first electrode line in Y axis, receives scan sensing signals through the second electrode line in X axis and the second electrode line in Y axis, and measures delay times between the scan signals and the scan sensing signals to touched positions in X axis and Y axis, respectively.Type: GrantFiled: December 7, 2011Date of Patent: April 8, 2014Assignee: Samsung Electronics Co., Ltd.Inventor: Jong Woo Shin
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Publication number: 20120146941Abstract: A touch recognition apparatus and method in a capacitive touch screen are provided. The touch recognition apparatus includes a touch panel including a first sub panel and a second panel intersecting each other, the first sub panel including a first electrode line and a second electrode line in X axis, a plurality of resistors being connected between the first electrode line and the second electrode line in X axis, and a controller outputting scan signals to the first electrode line in X axis and the first electrode line in Y axis, receiving scan sensing signals through the second electrode line in X axis and the second electrode line in Y axis, and measuring delay times between the scan signals and the scan sensing signals to touched positions in X axis and Y axis, respectively.Type: ApplicationFiled: December 7, 2011Publication date: June 14, 2012Applicant: SAMSUNG ELECTRONICS CO. LTD.Inventor: Jong Woo SHIN
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Publication number: 20090262970Abstract: A headset having ferrite beads for improving performance of an antenna provided within a cable is provided. The headset includes an ear jack, an ear jack Printed Circuit Board (PCB) connected to the ear jack, a speaker, and a cable having an antenna in which one end of the antenna is connected to the ear jack PCB, and having an audio line in which one end of the audio line is connected to the ear jack PCB through ferrite beads and the other end of the audio line is connected to the speaker. Therefore, by connecting an audio line within a cable to a PCB through ferrite beads, performance of an antenna provided within the cable may be improved.Type: ApplicationFiled: April 9, 2009Publication date: October 22, 2009Applicant: SAMSUNG ELECTRONICS CO. LTD.Inventors: Jong Woo SHIN, Yong Lae CHEONG, Ki Heung HAN
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Patent number: 7367656Abstract: In an ink-jet printhead and a method for manufacturing the same, the ink-jet printhead includes a substrate, an ink chamber to be filled with ink to be ejected formed on an upper surface of the substrate, a restrictor, which is a path through which ink is supplied from an ink reservoir to the ink chamber, perforating a bottom surface of the substrate and a bottom surface of the ink chamber, a nozzle plate, which is stacked on the upper surface of the substrate and forms an upper wall of the ink chamber, a nozzle perforating the nozzle plate at a position corresponding to a center of the ink chamber, a heater formed in the nozzle plate to surround the nozzle, and a conductor for applying a current to the heater.Type: GrantFiled: February 9, 2004Date of Patent: May 6, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Chang-ho Cho, Yong-soo Oh, Keon Kuk, Jong-woo Shin
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Patent number: 7368063Abstract: In an ink-jet printhead and a method for manufacturing the same, the ink-jet printhead includes a substrate, an ink chamber to be filled with ink formed on a front surface of the substrate, a manifold for supplying ink to the ink chamber formed on a rear surface of the substrate, and an ink passage in flow communication with the ink chamber and the manifold formed parallel to the front surface of the substrate; a nozzle plate including a plurality of passivation layers formed of an insulating material on the front surface of the substrate, a heat dissipating layer formed of a metallic material, and a nozzle in flow communication with the ink chamber; and a heater and a conductor, the heater being positioned on the ink chamber and heating ink in the ink chamber, and the conductor for applying a current to the heater.Type: GrantFiled: March 6, 2006Date of Patent: May 6, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Min-soo Kim, Su-ho Shin, Yong-soo Oh, Hyung-taek Lim, Jong-woo Shin, Seog-soon Baek
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Patent number: 7334335Abstract: A monolithic ink-jet printhead, and a method of manufacturing the same, includes a substrate having an ink chamber, an ink channel, and a manifold, a nozzle plate formed on the substrate, a nozzle, a heater, and a conductor. The ink chamber includes sidewalls formed to a predetermined depth from the front surface of the substrate for defining side surfaces of the ink chamber and a bottom wall formed parallel to the front surface of the substrate at the predetermined depth from the front surface of the substrate for defining a bottom surface of the ink chamber. The nozzle plate includes a plurality of passivation layers, a heat dissipating layer being stacked on the passivation layers, and the nozzle for ejecting ink out of the printhead. The heater is positioned above the ink chamber and heats ink in the ink chamber and the conductor delivers a current to the heater.Type: GrantFiled: December 29, 2006Date of Patent: February 26, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Su-ho Shin, Seog-soon Baek, Seung-joo Shin, Yong-soo Oh, Jong-woo Shin, Chang-seung Lee, Ki-deok Bae
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Patent number: 7226148Abstract: An ink-jet printhead, and a method of manufacturing the same, includes a substrate, an ink chamber, a manifold, and an ink channel formed between the ink chamber and the manifold to provide flow communication between the ink chamber and the manifold, a substantially flat nozzle plate formed on the upper surface of the substrate, the nozzle plate including a plurality of passivation layers, a heat dissipation layer disposed on the plurality of passivation layers, the heat dissipation layer formed of a thermally conductive material and including a first thermally conductive layer formed on the plurality of passivation layers and a second thermally conductive layer formed on the first thermally conductive layer, and a nozzle extending through the nozzle plate in flow communication with the ink chamber, and a heater and a conductor, the heater heating ink filled in the ink chamber and the conductor applying current to the heater.Type: GrantFiled: July 27, 2004Date of Patent: June 5, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Hoon Song, Yong-soo Oh, Jong-woo Shin, Hyung-taek Lim
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Publication number: 20070109357Abstract: A monolithic ink-jet printhead, and a method of manufacturing the same, includes a substrate having an ink chamber, an ink channel, and a manifold, a nozzle plate formed on the substrate, a nozzle, a heater, and a conductor. The ink chamber includes sidewalls formed to a predetermined depth from the front surface of the substrate for defining side surfaces of the ink chamber and a bottom wall formed parallel to the front surface of the substrate at the predetermined depth from the front surface of the substrate for defining a bottom surface of the ink chamber. The nozzle plate includes a plurality of passivation layers, a heat dissipating layer being stacked on the passivation layers, and the nozzle for ejecting ink out of the printhead. The heater is positioned above the ink chamber and heats ink in the ink chamber and the conductor delivers a current to the heater.Type: ApplicationFiled: December 29, 2006Publication date: May 17, 2007Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Su-ho Shin, Seog-soon Baek, Seung-joo Shin, Yong-soo Oh, Jong-woo Shin, Chang-seung Lee, Ki-deok Bae
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Patent number: 7178905Abstract: A monolithic ink-jet printhead, and a method of manufacturing the same, includes a substrate having an ink chamber, an ink channel, and a manifold, a nozzle plate formed on the substrate, a nozzle, a heater, and a conductor. The ink chamber includes sidewalls formed to a predetermined depth from the front surface of the substrate for defining side surfaces of the ink chamber and a bottom wall formed parallel to the front surface of the substrate at the predetermined depth from the front surface of the substrate for defining a bottom surface of the ink chamber. The nozzle plate includes a plurality of passivation layers, a heat dissipating layer being stacked on the passivation layers, and the nozzle for ejecting ink out of the printhead. The heater is positioned above the ink chamber and heats ink in the ink chamber and the conductor delivers a current to the heater.Type: GrantFiled: June 7, 2004Date of Patent: February 20, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Su-ho Shin, Seog-soon Baek, Seung-joo Shin, Yong-soo Oh, Jong-woo Shin, Chang-seung Lee, Ki-deok Bae
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Patent number: 7169539Abstract: A monolithic ink-jet printhead includes a substrate having an ink chamber, a manifold, and an ink channel in flow communication, a nozzle plate including a plurality of passivation layers stacked on the substrate and a heat dissipating layer stacked on the passivation layers, a nozzle for ejecting ink penetrating the nozzle plate, a heater provided between adjacent passivation layers above the ink chamber, and a conductor between adjacent passivation layers, the conductor being electrically connected to the heater, wherein the heat dissipating layer is made of a thermally conductive metal for dissipating heat from the heater, the lower part of the nozzle is formed by penetrating the plurality of passivation layers, and the upper part of the nozzle is formed by penetrating the heat dissipating layer in a tapered shape in which a cross-sectional area thereof decreases gradually toward an exit thereof.Type: GrantFiled: March 21, 2005Date of Patent: January 30, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Hyung-taek Lim, Jong-woo Shin, Hoon Song, Yong-soo Oh, Chang-seung Lee
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Publication number: 20060290743Abstract: A monolithic ink-jet printhead includes a substrate which has an ink chamber to be supplied with ink, a manifold for supplying ink to the ink chamber, and an ink channel for providing communication between the ink chamber and the manifold, a nozzle plate including a plurality of passivation layers sequentially stacked on the substrate, a metal layer formed on the passivation layers, and a nozzle, through which ink is ejected from the ink chamber, that penetrates the nozzle plate, a heater provided between adjacent passivation layers, the heater being located above the ink chamber for heating ink within the ink chamber, a conductor provided between adjacent passivation layers, the conductor being electrically connected to the heater for applying a current to the heater, and a hydrophobic coating layer formed exclusively on an outer surface of the metal layer.Type: ApplicationFiled: August 30, 2006Publication date: December 28, 2006Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hoon Song, Yong-soo Oh, Jong-woo Shin, Chang-seung Lee, Hyung-taek Lim
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Patent number: 7104632Abstract: A monolithic ink-jet printhead includes a substrate which has an ink chamber to be supplied with ink, a manifold for supplying ink to the ink chamber, and an ink channel for providing communication between the ink chamber and the manifold, a nozzle plate including a plurality of passivation layers sequentially stacked on the substrate, a metal layer formed on the passivation layers, and a nozzle, through which ink is ejected from the ink chamber, that penetrates the nozzle plate, a heater provided between adjacent passivation layers, the heater being located above the ink chamber for heating ink within the ink chamber, a conductor provided between adjacent passivation layers, the conductor being electrically connected to the heater for applying a current to the heater, and a hydrophobic coating layer formed exclusively on an outer surface of the metal layer.Type: GrantFiled: December 4, 2003Date of Patent: September 12, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Hoon Song, Yong-soo Oh, Jong-woo Shin, Chang-seung Lee, Hyung-taek Lim
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Publication number: 20060146102Abstract: In an ink-jet printhead and a method for manufacturing the same, the ink-jet printhead includes a substrate, an ink chamber to be filled with ink formed on a front surface of the substrate, a manifold for supplying ink to the ink chamber formed on a rear surface of the substrate, and an ink passage in flow communication with the ink chamber and the manifold formed parallel to the front surface of the substrate; a nozzle plate including a plurality of passivation layers formed of an insulating material on the front surface of the substrate, a heat dissipating layer formed of a metallic material, and a nozzle in flow communication with the ink chamber; and a heater and a conductor, the heater being positioned on the ink chamber and heating ink in the ink chamber, and the conductor for applying a current to the heater.Type: ApplicationFiled: March 6, 2006Publication date: July 6, 2006Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Min-soo Kim, Su-ho Shin, Yong-soo Oh, Hyung-taek Lim, Jong-woo Shin, Seog-soon Baek