Abstract: Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light emitting device package including the same may have superior luminescence characteristics and improved temperature stability by selecting composition ratios of each ingredients included in a composition formula and ions and thereby minimizing lattice defects in a crystal structure: AaBbOcNdGe:REh??[Formula 1] wherein A is at least one selected from the group consisting of Be, Mg, Ca, Sr, Ba and Ra elements, B is at least one selected from the group consisting of Si, Ge and Sn elements, O means oxygen, N means nitrogen, G is any one of C, Cl, F and Br elements, C means Carbon, RE is at least one selected from the group consisting of Eu, Ce, Sm, Er, Yb, Dy, Gd, Tm, Lu, 0<a?15, 0<b?15, 0<c?15, 0<d?20, 0<e?10, and 0<h?10.

Abstract: Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light emitting device package including the same may have improved luminescence characteristics and properties due to influence of cations and anions included in a composition formula: AaBbOcNdGeDfEg:REh??[Formula 1] wherein A is at least one selected from the group consisting of Be, Mg, Ca, Sr, Ba and Ra elements, B is at least one selected from the group consisting of Si, Ge and Sn elements, G is any one of C, Cl, F and Br elements, D is one element or a mixture type of two or more elements selected from Li, Na and K, E is at least one selected from the group consisting of P, As, Bi, Sc, Y and Lu, RE is at least one selected from the group consisting of Eu, Ce, Sm, Er, Yb, Dy, Gd, Tm, Lu, Pr, Nd, Pm and Ho, 0<a?15, 0<b?15, 0<c?15, 0<d?20, 0<e?10, 0<f?6, 0<g?6, and 0<h?10.

Abstract: Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light emitting device package including the same may have superior luminesence characteristics and improved temperature stability by selecting composition ratios of each ingredients included in a composition formula and ions and thereby minimizing lattice defects in a crystal structure: AaBbOcNdCe:REh??[Formula 1] wherein A is at least one selected from the group consisting of Be, Mg, Ca, Sr, Ba and Ra elements, B is at least one selected from the group consisting of Si, Ge and Sn elements, C is any one of C, Cl, F and Br elements, RE is at least one selected from the group consisting of Eu, Ce, Sm, Er, Yb, Dy, Gd, Tm, Lu, 0<a?15, 0<b?15, 0<c?15, 0<d?20, 0<e?10, and 0<h?10.

Abstract: A package substrate includes a core layer having a first surface and a second surface which are opposite to each other, a ball land pad disposed on the first surface of the core layer, an opening that penetrates the core layer to expose the ball land pad, and a dummy ball land disposed on the second surface of the core layer to surround the opening. The dummy ball land includes at least one sub-pattern and at least one vent hole. Related semiconductor packages and related methods are also provided.

Abstract: Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light emitting device package including the same may have improved luminescence characteristics and properties due to influence of cations and anions included in a composition formula: AaBbOcNdCeDfEg:REh??[Formula 1] wherein A is at least one selected from the group consisting of Be, Mg, Ca, Sr, Ba and Ra elements, B is at least one selected from the group consisting of Si, Ge and Sn elements, C is any one of C, Cl, F and Br elements, D is one element or a mixture type of two or more elements selected from Li, Na and K, E is at least one selected from the group consisting of P, As, Bi, Sc, Y and Lu, RE is at least one selected from the group consisting of Eu, Ce, Sm, Er, Yb, Dy, Gd, Tm, Lu, Pr, Nd, Pm and Ho, 0<a?15, 0<b?15, 0<c?15, 0<d?20, 0<e?10, 0<f?6, 0<g?6, and 0<h?10.

Abstract: A package substrate includes a core layer having a first surface and a second surface which are opposite to each other, a ball land pad disposed on the first surface of the core layer, an opening that penetrates the core layer to expose the ball land pad, and a dummy ball land disposed on the second surface of the core layer to surround the opening. The dummy ball land includes at least one sub-pattern and at least one vent hole. Related semiconductor packages and related methods are also provided.

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.