Abstract: The present application provides a method for preparing a composite material. The present application provides a method for preparing a composite material comprising a metal foam and a polymer component, wherein the polymer component is formed in an asymmetrical structure on both sides of the metal foam, and a composite material prepared in such a manner.

Abstract: A substrate supporting plate that may prevent deposition on a rear surface of a substrate and may easily unload the substrate. The substrate supporting plate may include a substrate mounting portion and a peripheral portion surrounding the substrate mounting portion. An edge portion of a top surface of the substrate mounting portion may be anodized. A central portion of the top surface of the substrate mounting portion may not be anodized.

Abstract: An apparatus for predicting performance of a wheel in a vehicle: includes a learning device that generates a latent space for a plurality of two-dimensional (2D) wheel images based on a convolutional autoencoder (CAE), extracts a predetermined number of the plurality of 2D wheel images from the latent space, and learns a dataset having the plurality of 2D wheel images and performance values corresponding to the plurality of 2D wheel images; and a controller that predicts performance for the plurality of 2D wheel images based on a performance prediction model obtained by the learning device.

Abstract: Wireless charging devices and wireless charging systems are provided. The wireless charging devices may include a receiving part coil and an electromagnetic-wave shielding sheet on the receiving part coil. The electromagnetic-wave shielding sheet may have a specific magnetic permeability of 100 or greater from 100 khz to 300 khz and may include a metal foam including a soft magnetic metal component.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.

Abstract: Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light emitting device package including the same may have superior luminescence characteristics and improved temperature stability by selecting composition ratios of each ingredients included in a composition formula and ions and thereby minimizing lattice defects in a crystal structure: AaBbOcNdGe:REh??[Formula 1] wherein A is at least one selected from the group consisting of Be, Mg, Ca, Sr, Ba and Ra elements, B is at least one selected from the group consisting of Si, Ge and Sn elements, O means oxygen, N means nitrogen, G is any one of C, Cl, F and Br elements, C means Carbon, RE is at least one selected from the group consisting of Eu, Ce, Sm, Er, Yb, Dy, Gd, Tm, Lu, 0<a?15, 0<b?15, 0<c?15, 0<d?20, 0<e?10, and 0<h?10.

Abstract: Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light emitting device package including the same may have improved luminescence characteristics and properties due to influence of cations and anions included in a composition formula: AaBbOcNdGeDfEg:REh??[Formula 1] wherein A is at least one selected from the group consisting of Be, Mg, Ca, Sr, Ba and Ra elements, B is at least one selected from the group consisting of Si, Ge and Sn elements, G is any one of C, Cl, F and Br elements, D is one element or a mixture type of two or more elements selected from Li, Na and K, E is at least one selected from the group consisting of P, As, Bi, Sc, Y and Lu, RE is at least one selected from the group consisting of Eu, Ce, Sm, Er, Yb, Dy, Gd, Tm, Lu, Pr, Nd, Pm and Ho, 0<a?15, 0<b?15, 0<c?15, 0<d?20, 0<e?10, 0<f?6, 0<g?6, and 0<h?10.

Abstract: Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light emitting device package including the same may have superior luminesence characteristics and improved temperature stability by selecting composition ratios of each ingredients included in a composition formula and ions and thereby minimizing lattice defects in a crystal structure: AaBbOcNdCe:REh??[Formula 1] wherein A is at least one selected from the group consisting of Be, Mg, Ca, Sr, Ba and Ra elements, B is at least one selected from the group consisting of Si, Ge and Sn elements, C is any one of C, Cl, F and Br elements, RE is at least one selected from the group consisting of Eu, Ce, Sm, Er, Yb, Dy, Gd, Tm, Lu, 0<a?15, 0<b?15, 0<c?15, 0<d?20, 0<e?10, and 0<h?10.

Abstract: A package substrate includes a core layer having a first surface and a second surface which are opposite to each other, a ball land pad disposed on the first surface of the core layer, an opening that penetrates the core layer to expose the ball land pad, and a dummy ball land disposed on the second surface of the core layer to surround the opening. The dummy ball land includes at least one sub-pattern and at least one vent hole. Related semiconductor packages and related methods are also provided.

Abstract: Embodiments of the present invention provide a bluish green phosphor represented by Formula 1 below. In particular, the bluish green phosphor and a light emitting device package including the same may have improved luminescence characteristics and properties due to influence of cations and anions included in a composition formula: AaBbOcNdCeDfEg:REh??[Formula 1] wherein A is at least one selected from the group consisting of Be, Mg, Ca, Sr, Ba and Ra elements, B is at least one selected from the group consisting of Si, Ge and Sn elements, C is any one of C, Cl, F and Br elements, D is one element or a mixture type of two or more elements selected from Li, Na and K, E is at least one selected from the group consisting of P, As, Bi, Sc, Y and Lu, RE is at least one selected from the group consisting of Eu, Ce, Sm, Er, Yb, Dy, Gd, Tm, Lu, Pr, Nd, Pm and Ho, 0<a?15, 0<b?15, 0<c?15, 0<d?20, 0<e?10, 0<f?6, 0<g?6, and 0<h?10.

Abstract: A package substrate includes a core layer having a first surface and a second surface which are opposite to each other, a ball land pad disposed on the first surface of the core layer, an opening that penetrates the core layer to expose the ball land pad, and a dummy ball land disposed on the second surface of the core layer to surround the opening. The dummy ball land includes at least one sub-pattern and at least one vent hole. Related semiconductor packages and related methods are also provided.

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.