Abstract: Disclosed are a mount control system and method for vehicles in which a camera of an electronically controlled suspension system with road preview photographs a road surface condition of a road ahead of a vehicle, a suspension controller determines a road surface state of the road based on photographed information of the camera, and a mount controller controls semi-active mounts to be in an on state or in an off state based on road surface state determination information transmitted from the suspension controller and values detected by wheel acceleration sensors mounted on wheels of the vehicle, so as to improve not only NVH performance but also driving vibration damping performance depending on the road surface state.

Abstract: A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch and a second ring oscillator connected to the first node through a second supply switch and the second node through a second ground switch, wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator.

Abstract: An apparatus for estimating biological information may include a sensor configured to detect a first light signal and a second light signal from an object of a user and a processor configured to determine whether a condition for estimating biological information is satisfied based on the detected first light signal and estimate biological information based on the second light signal, wherein the sensor includes a force sensor configured to measure a force applied to the object when the object is in contact with a cover surface of the sensor.

Abstract: A method is provided for decoding a sequence of pictures using a gradual refresh technique. In particular, all areas in one picture are gradually encoded or decoded over a plurality of pictures associated with the picture.

Abstract: An electronic device is provided, the electronic device including a communication circuit, a battery, and a processor, and the processor is configured to: obtain a strength of a communication signal received by the communication circuit; determine a magnitude of power for charging the battery based on the strength of the communication signal; and charge the battery with power of the determined magnitude.

Abstract: An electronic device is provided, the electronic device including a communication circuit, a battery, and a processor, and the processor is configured to: obtain a strength of a communication signal received by the communication circuit; determine a magnitude of power for charging the battery based on the strength of the communication signal; and charge the battery with power of the determined magnitude.

Abstract: A process chamber used in the manufacture of a semiconductor device for etching a material layer on a semiconductor wafer includes an electrostatic chuck for holding the semiconductor wafer, and an annular edge ring which surrounds the side of the semiconductor wafer on the electrostatic chuck to prevent the semiconductor wafer from departing from its original position. The annular edge ring has a first side which faces the side of the semiconductor wafer and contacts firmly with the side of the semiconductor wafer.

Abstract: A process chamber used in the manufacture of a semiconductor device for etching a material layer on a semiconductor wafer includes an electrostatic chuck for holding the semiconductor wafer, and an annular edge ring which surrounds the side of the semiconductor wafer on the electrostatic chuck to prevent the semiconductor wafer from departing from its original position. The annular edge ring has a first side which faces the side of the semiconductor wafer and contacts firmly with the side of the semiconductor wafer.

Abstract: A process chamber used in the manufacture of a semiconductor device for etching a material layer on a semiconductor wafer includes an electrostatic chuck for holding the semiconductor wafer, and an annular edge ring which surrounds the side of the semiconductor wafer on the electrostatic chuck to prevent the semiconductor wafer from departing from its original position. The annular edge ring has a first side which faces the side of the semiconductor wafer and contacts firmly with the side of the semiconductor wafer.

Abstract: A process chamber used in the manufacture of a semiconductor device for etching a material layer on a semiconductor wafer includes an electrostatic chuck for holding the semiconductor wafer, and an annular edge ring which surrounds the side of the semiconductor wafer on the electrostatic chuck to prevent the semiconductor wafer from departing from its original position. The annular edge ring has a first side which faces the side of the semiconductor wafer and contacts firmly with the side of the semiconductor wafer.

Abstract: A process chamber used in the manufacture of a semiconductor device for etching a material layer on a semiconductor wafer includes an electrostatic chuck for holding the semiconductor wafer, and an annular edge ring which surrounds the side of the semiconductor wafer on the electrostatic chuck to prevent the semiconductor wafer from departing from its original position. The annular edge ring has a first side which faces the side of the semiconductor wafer and contacts firmly with the side of the semiconductor wafer.

Abstract: A process chamber used in the manufacture of a semiconductor device for etching a material layer on a semiconductor wafer includes an electrostatic chuck for holding the semiconductor wafer, and an annular edge ring which surrounds the side of the semiconductor wafer on the electrostatic chuck to prevent the semiconductor wafer from departing from its original position. The annular edge ring has a first side which faces the side of the semiconductor wafer and contacts firmly with the side of the semiconductor wafer.

Abstract: An annular ring shaped baffle plate disposed between a process chamber and a vacuum chamber of a dry etching apparatus. A plurality of slits are formed radially along the annular ring and extend from a top surface of the annular ring to a bottom surface of the annular ring. The slits are circumferentially spaced from each other, and each of the slits has an upper section that is tapered and a lower section that has a constant width. Alternatively, the slits may be replaced by a plurality of discharging regions formed in the annular ring, with the discharging regions having a circumferential width that is greater than a radial length.