Abstract: A lighting device irradiating light to different locations includes a light irradiation unit that generates light; an optical path adjustment unit that adjusts a path of the light radiated from the light irradiation unit to allow a road surface pattern to be formed at a predetermined location on a road surface around a vehicle; and a driving unit that adjusts the optical path adjustment unit to allow the road surface pattern to be formed at different locations on the road surface around the vehicle.

Abstract: A sterilization device includes a housing; a sterilization unit which emits germicidal light for sterilization of at least one target area to be sterilized; and a drive unit which moves at least a part of the sterilization unit between the outside and inside of the housing through an opening provided in the housing.

Abstract: A sterilization apparatus includes a housing; a sterilization unit for irradiating, with sterilization light, at least one region to be sterilized; and a driving unit for moving the sterilization unit into and out of the housing via an opening of the housing and rotating the sterilization unit about a rotation axis.

Abstract: Provided is a thermoelectric module. The thermoelectric module includes a thermoelectric element including a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode, a heat sink disposed on the second substrate, and an adhesive layer configured to bond the second substrate to the heat sink. The heat sink has a shape in which predetermined patterns are regularly repeated and connected. Each pattern includes a first surface disposed opposite to the second substrate, a in second surface which extends upward from one end of the first surface, a third surface which extends from the second surface to face the second substrate, and a fourth surface which extends upward from the other end opposite to the one end of the first surface and is connected to a third surface of an adjacent pattern.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: A vehicle lamp for emitting light at various locations adjacent to a vehicle while having a simplified configuration is provided. A vehicle lamp includes a light-emitting unit that emits light to form a road surface pattern, and a movable unit on which the light-emitting unit is mounted. The light generated by the light-emitting unit enables the road surface pattern to be formed on different locations of a road surface adjacent to the vehicle as the movable unit rotates.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: A method for forming a semiconductor die, includes forming an interlayer dielectric layer on a substrate having a semiconductor die region, a seal-ring region, and a scribe line region, forming a metal pad and a test pad on the interlayer dielectric layer, forming a passivation dielectric layer on the interlayer dielectric layer, the metal pad, and the test pad, first etching the passivation dielectric layer and the interlayer dielectric layer existing between the seal-ring region and the scribe line region to a predetermined depth using a plasma etching process, second etching the passivation dielectric layer to expose the metal pad and the test pad, forming a bump on the metal pad, and dicing the substrate while removing the scribe line region by mechanical sawing.

Abstract: An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.

Abstract: An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.

Abstract: According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon.

Abstract: According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon.

Abstract: A thermoelectric material including: a nanostructure; a discontinuous area disposed in the nanostructure, and an uneven portion disposed on the nano structure.

Abstract: A core-shell nanowire with an uneven surface structure can be advantageously used in thermoelectric devices. The core-shell nanowire with the uneven surface structure includes a core region and a shell region, wherein the uneven surface structure is formed in the shell region.

Abstract: An electronic apparatus includes a main power supply including a main transformer and a first switching controller that switches an input power supply of the main transformer, and a standby power supply including an auxiliary transformer, a second switching controller that switches an input power supply of the auxiliary transformer, a rectifying circuit that converts an output voltage of the auxiliary transformer into a DC voltage and supplies the DC voltage as a driving power for the first switching controller, a transistor that switches a supply of the driving power from the rectifying circuit to the first switching controller, and a controller that switches the transistor. The electronic apparatus includes a semiconductor device that performs the switching operation with improved stability.

Abstract: A forward converter having an improved power factor and suppressing a harmonic noise component appearing at an input current waveform. The forward converter includes a bridge diode, a first smoothing capacitor, a control circuit, a switching element, a transformer, a waveform shaper, a rectifying element, and a second smoothing capacitor. The bridge diode full-wave rectifies an AC input voltage to generate a first DC voltage. The first smoothing capacitor smooths the first DC voltage to generate a second DC voltage. The control circuit generates a switching control signal in response to an input of the second DC voltage. The switching element, which is connected between the first smoothing capacitor and a ground terminal, switches on or off in response to the switching control signal. The transformer, having a primary winding and a secondary winding, receives the second DC voltage through the primary winding when the switching element is switched on, and induces the second DC voltage to the secondary winding.

Abstract: An organic light emitting display device is disclosed. One inventive aspect includes a plurality of pixels provided at a region sectioned by scan lines and data lines and an initialization power unit. The plurality of pixels are configured to control the amount of a current flowing from a first power source to a second power source through an organic light emitting diode in response to a data signal. The initialization power unit supplies initialization power to a driving transistor within each pixel circuit. The initialization power unit further controls the voltage of the initialization power supply to maintain a substantially constant voltage difference between the second power source and the initialization power.