Patents by Inventor Jong-Woon Lee

Jong-Woon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10535575
    Abstract: An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: January 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shaofeng Ding, Kyoung-woo Lee, In-hwan Kim, Jong-woon Lee
  • Publication number: 20190131194
    Abstract: An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.
    Type: Application
    Filed: June 4, 2018
    Publication date: May 2, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shaofeng DING, Kyoung-woo LEE, In-hwan KIM, Jong-woon LEE
  • Patent number: 9373602
    Abstract: According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: June 21, 2016
    Assignees: Samsung Electronics Co., Ltd., Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Eun-kyung Lee, Byoung-lyong Choi, Won-Jae Joo, Byung-Sung Kim, Jae-Hyun Lee, Jong-Woon Lee, Dong-Mok Whang
  • Publication number: 20150061161
    Abstract: According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon.
    Type: Application
    Filed: August 25, 2014
    Publication date: March 5, 2015
    Applicant: Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Eun-kyung LEE, Byoung-lyong CHOI, Won-Jae JOO, Byung-Sung KIM, Jae-Hyun LEE, Jong-Woon LEE, Dong-Mok WHANG
  • Publication number: 20110297202
    Abstract: A thermoelectric material including: a nanostructure; a discontinuous area disposed in the nanostructure, and an uneven portion disposed on the nano structure.
    Type: Application
    Filed: May 24, 2011
    Publication date: December 8, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-kyung LEE, Byoung-lyong CHOI, Jun-ho LEE, Dong-mok WHANG, Jong-woon LEE
  • Publication number: 20110132002
    Abstract: A core-shell nanowire with an uneven surface structure can be advantageously used in thermoelectric devices. The core-shell nanowire with the uneven surface structure includes a core region and a shell region, wherein the uneven surface structure is formed in the shell region.
    Type: Application
    Filed: November 30, 2010
    Publication date: June 9, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Eun-kyung LEE, Byoung-lyong CHOI, Dongmok WHANG, Sang-jin LEE, Jong-woon LEE
  • Publication number: 20060023477
    Abstract: An electronic apparatus includes a main power supply including a main transformer and a first switching controller that switches an input power supply of the main transformer, and a standby power supply including an auxiliary transformer, a second switching controller that switches an input power supply of the auxiliary transformer, a rectifying circuit that converts an output voltage of the auxiliary transformer into a DC voltage and supplies the DC voltage as a driving power for the first switching controller, a transistor that switches a supply of the driving power from the rectifying circuit to the first switching controller, and a controller that switches the transistor. The electronic apparatus includes a semiconductor device that performs the switching operation with improved stability.
    Type: Application
    Filed: July 19, 2005
    Publication date: February 2, 2006
    Inventor: Jong-woon Lee
  • Patent number: 5917715
    Abstract: A forward converter having an improved power factor and suppressing a harmonic noise component appearing at an input current waveform. The forward converter includes a bridge diode, a first smoothing capacitor, a control circuit, a switching element, a transformer, a waveform shaper, a rectifying element, and a second smoothing capacitor. The bridge diode full-wave rectifies an AC input voltage to generate a first DC voltage. The first smoothing capacitor smooths the first DC voltage to generate a second DC voltage. The control circuit generates a switching control signal in response to an input of the second DC voltage. The switching element, which is connected between the first smoothing capacitor and a ground terminal, switches on or off in response to the switching control signal. The transformer, having a primary winding and a secondary winding, receives the second DC voltage through the primary winding when the switching element is switched on, and induces the second DC voltage to the secondary winding.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: June 29, 1999
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jong-Woon Lee