Patents by Inventor Jong Woong Kim
Jong Woong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136674Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.Type: ApplicationFiled: January 19, 2022Publication date: April 25, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Jong-Sik PARK, Jae-Won LIM, Yu-Sung CHOE, Hak-Kyun KIM, Je-Jun LEE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Pil-Kyu PARK, Kwang-Su HWANGBO, Do-Gyun KIM, Geon-Woo MIN, Hae-Jin LIM, Min-Ki JO, Su-Ji CHOI, Bo-Hyun KANG, Jae-Woong KIM, Ji-Min JUNG, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI
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Publication number: 20240125334Abstract: An air compressor according to an aspect of the present invention comprises: a housing; a rotating shaft which is disposed in the housing; a compression unit which is connected to the rotating shaft to compress and discharge inlet air; a motor unit which drives the rotating shaft; a control board which controls the motor unit; and a filter unit which filters out noise from external power and supplies the external power to the control board, wherein the housing includes a first cooling flow channel for cooling the motor unit and a second cooling flow channel for cooling the filter unit, and the first cooling flow channel communicates with the second cooling flow channel.Type: ApplicationFiled: March 30, 2022Publication date: April 18, 2024Inventors: Kyu Sung CHOI, Hyun Chil KIM, Gun Woong PARK, Min Gyu PARK, Chi Yong PARK, Yeol Woo SUNG, Hyun Sup YANG, Jong Sung LEE
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Publication number: 20240128517Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.Type: ApplicationFiled: January 19, 2022Publication date: April 18, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Hae-Jin LIM, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Geon-Woo MIN, Min-Ki JO, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Jae-Woong KIM, Jong-Sik PARK, Yu-Sung CHOE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Bo-Hyun KANG, Pil-Kyu PARK
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Patent number: 11962803Abstract: The multi sample prediction method of the present invention comprises the steps of: determining a sample group consisting of a plurality of samples inside a decoding target block; determining a representative position corresponding to the sample group, inside the decoding target block; determining a representative prediction value for the sample group, on the basis of the determined representative position; and determining the determined representative prediction value as the final prediction value for each of the plurality of samples making up the sample group. The present invention enhances efficiency in encoding/decoding and reduces complexity thereof.Type: GrantFiled: May 31, 2023Date of Patent: April 16, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Jin Ho Lee, Hui Yong Kim, Sung Chang Lim, Jong Ho Kim, Ha Hyun Lee, Jin Soo Choi, Jin Woong Kim
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Publication number: 20240120292Abstract: A stack package includes a first die stack including first dies, a second die stack including second dies, and an insert die between the first die stack and the second die stack, wherein the insert die is thicker than each of the first and second dies.Type: ApplicationFiled: March 20, 2023Publication date: April 11, 2024Applicant: SK hynix Inc.Inventors: Jin Woong KIM, Jong Yeon KIM
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Publication number: 20240107002Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Applicants: Electronics and Telecommunications Research Institute, University-Industry Cooperation Group of Kyung Hee UniversityInventors: Se Yoon JEONG, Hui Yong KIM, Sung Chang LIM, Jin Ho LEE, Ha Hyun LEE, Jong Ho KIM, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Gwang Hoon PARK, Kyung Yong KIM, Tae Ryong KIM, Han Soo LEE
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Publication number: 20240088163Abstract: A display device includes a pixel component including scan lines, data lines, and pixels electrically connected to the scan lines and the data lines, and defining pixel columns and pixel rows, a data driver disposed on a side of the pixel component, and a scan driver disposed on the side of the pixel component. The pixel component includes sub-scan lines, and dummy lines. Each scan line may be electrically connected to the sub-scan lines by contacts. The contacts are divided into contact groups having a same arrangement. The pixel component is divided into pixel blocks corresponding to the contact groups. Each pixel block includes first and second area divided by contact group. The first area is closer to the scan driver than the second area. The pixel component further includes supplementary power lines spaced apart from the respective sub-scan lines.Type: ApplicationFiled: April 3, 2023Publication date: March 14, 2024Applicant: Samsung Display Co., LTD.Inventors: Do Yeong PARK, Kyung Bae KIM, Jong Woong CHANG
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Publication number: 20240073416Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, Universily-lndustry Cooperation Group of Kyung Hee UniversityInventors: Sung Chang LIM, Ha Hyun LEE, Se Yoon JEONG, Hui Yong KIM, Suk Hee CHO, Jong Ho KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Dong Gyu SIM, Seoung Jun OH, Gwang Hoon PARK, Sea Nae PARK, Chan Woong JEON
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Publication number: 20160370107Abstract: A refrigerator capable of detecting a stored item having a higher-than-ambient temperature and accordingly directing a cool airflow thereto for rapid cooling. The refrigerator includes a thermal image capturing unit for sensing a temperature of the item, a position sensing unit for locating the item in the storage space. A control unit can control a temperature and/or a direction of the cool air discharged from a cool air discharge unit via a fan unit based on the sensed temperature and position of the item.Type: ApplicationFiled: August 27, 2015Publication date: December 22, 2016Inventors: Sung Jin MOON, Seong Jin KIM, Jong Woong KIM
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Publication number: 20150367552Abstract: In the case of the heating device and a packing band manufacturing apparatus including the same, since it is possible to heat, cool, and heat a band stock without cooling the inside of the housing in one heating device, it is unnecessary to provide a plurality of heating devices to reheat the band stock and it is possible to omit a pressing device for catching the band stock in order not to allow the band stock between the heating devices to droop, thereby simplifying equipment.Type: ApplicationFiled: June 18, 2015Publication date: December 24, 2015Inventors: Jong Woong KIM, Tae Woong KIM
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Patent number: 8048793Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.Type: GrantFiled: September 3, 2008Date of Patent: November 1, 2011Assignee: Sungkyunkwan University Foundation for Corporate CollaborationInventors: Seung Boo Jung, Jong Woong Kim
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Publication number: 20090057921Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.Type: ApplicationFiled: September 3, 2008Publication date: March 5, 2009Applicant: SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATIONInventors: Seung Boo JUNG, Jong Woong KIM
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Patent number: RE48421Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.Type: GrantFiled: February 12, 2019Date of Patent: February 2, 2021Assignee: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIV.Inventors: Seung Boo Jung, Jong Woong Kim
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Patent number: RE48422Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.Type: GrantFiled: February 13, 2019Date of Patent: February 2, 2021Assignee: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIV.Inventors: Seung Boo Jung, Jong Woong Kim
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Patent number: RE49286Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.Type: GrantFiled: February 1, 2021Date of Patent: November 8, 2022Assignee: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIV.Inventors: Seung Boo Jung, Jong Woong Kim