Abstract: The present disclosure relates to a method for establishing an ESG database including: parsing an ESG document subject to structuring; screening whether the parsed ESG document includes items corresponding to at least one of the pre-stored plurality of ESG management items; specifying a selection status for items in the ESG document based on whether an item corresponding to the ESG management item is included in the document; activating or deactivating input fields for final input field values for the pre-stored plurality of ESG management items according to the designation result of the selection status; and generating structured data by obtaining the content of items corresponding to ESG management items determined to be included in the document, and an ESG service providing system performing the same.

Abstract: A refrigerator capable of detecting a stored item having a higher-than-ambient temperature and accordingly directing a cool airflow thereto for rapid cooling. The refrigerator includes a thermal image capturing unit for sensing a temperature of the item, a position sensing unit for locating the item in the storage space. A control unit can control a temperature and/or a direction of the cool air discharged from a cool air discharge unit via a fan unit based on the sensed temperature and position of the item.

Abstract: In the case of the heating device and a packing band manufacturing apparatus including the same, since it is possible to heat, cool, and heat a band stock without cooling the inside of the housing in one heating device, it is unnecessary to provide a plurality of heating devices to reheat the band stock and it is possible to omit a pressing device for catching the band stock in order not to allow the band stock between the heating devices to droop, thereby simplifying equipment.

Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.

Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.

Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.

Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.

Abstract: Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.