Patents by Inventor Jong Yeun KIM

Jong Yeun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-hardness, high-strength thermoplastic elastomer with good abrasion resistance and diaphragm including the same
    Patent number: 9534113
    Abstract: A thermoplastic elastomer includes (A) a hydrogenated triblock copolymer, (B) a non-aromatic oil, (C) a polyolefin resin, (D) an inorganic filler, (E) a polyphenylene ether resin, and (F) a silicone resin. The thermoplastic elastomer can have good abrasion resistance and antimicrobial activity while possessing low hardness and high strength. Also provided is a molded article using the thermoplastic elastomer.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: January 3, 2017
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Bum Seok Youn, Kang Yeol Park, Jong Yeun Kim, Jung Wook Kim
  • Low-Hardness, High-Strength Thermoplastic Elastomer with Good Abrasion Resistance and Diaphragm Including the Same
    Publication number: 20130289158
    Abstract: A thermoplastic elastomer includes (A) a hydrogenated triblock copolymer, (B) a non-aromatic oil, (C) a polyolefin resin, (D) an inorganic filler, (E) a polyphenylene ether resin, and (F) a silicone resin. The thermoplastic elastomer can have good abrasion resistance and antimicrobial activity while possessing low hardness and high strength. Also provided is a molded article using the thermoplastic elastomer.
    Type: Application
    Filed: June 24, 2013
    Publication date: October 31, 2013
    Inventors: Bum Seok YOUN, Kang Yeol PARK, Jong Yeun KIM, Jung Wook KIM
  • Polyamide Based Resin Composition Having Excellent Whiteness, Thermal Conductivity, and Extruding Moldability
    Publication number: 20110155948
    Abstract: The present invention provides a polyamide resin composition that can have good whiteness, thermal conductivity and extrusion molding properties, which includes (A) polyamide resin; (B) heat conductive filler; (C) filler; and (D) thermoplastic resin which is miscible with the polyamide resin and has a weight average molecular weight of about 500,000 to about 5,000,000.
    Type: Application
    Filed: December 30, 2010
    Publication date: June 30, 2011
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Han Namkung, Chan Gyun Shin, Young Sik Ryu, Bum Seok Youn, Jong Yeun Kim, Jong Cheol Lim
  • Polycarbonate Resin Composition with Good Flame Retardancy and Light Stability
    Publication number: 20090239975
    Abstract: Disclosed herein is a polycarbonate resin composition having good flame retardancy and light stability which can be useful for a LCD backlight component comprising: about 60 to about 95 parts by weight of a thermoplastic polycarbonate resin, and about 5 to about 40 parts by weight of a polyethylene naphthalate-terephthalate copolymer, about 5 to about 50 parts by weight of titanium dioxide based on about 100 parts by weight of a base resin comprising the thermoplastic polycarbonate resin and the polyethylene naphthalate-terephthalate copolymer, about 0.1 to about 10 parts by weight of an organosiloxane polymer based on about 100 parts by weight of a base resin comprising the thermoplastic polycarbonate resin and the polyethylene naphthalate-terephthalate copolymer, and about 0.05 to about 5 parts by weight of a fluorinated polyolefin resin based on about 100 parts by weight of a base resin comprising the thermoplastic polycarbonate resin and the polyethylene naphthalate-terephthalate copolymer.
    Type: Application
    Filed: June 5, 2009
    Publication date: September 24, 2009
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Hyuk Jin JUNG, Jong Cheol LIM, Sang Hwa LEE, Jong Yeun KIM