Abstract: One aspect relates to a technology in which one or more external devices are interlocked with scenario-based content executed on a main device. One embodiment includes a system for interlocking content and an external device. The system includes a main device configured to store and execute content and at least one external device connected to the main device by communication. The content may include a control signal for controlling the external device. When the content is executed on the main device, the main device may transmit the control signal included in the content to the external device and the external device may perform a specific function in accordance with the control signal.

Abstract: The present disclosure relates to a puzzle system interworking with an external device and, more specifically, to a puzzle system interworking with an external device, which outputs an event corresponding to a puzzle to arouse interest of a user when the user completes the puzzle, and also outputs an event corresponding to an image forming the puzzle to increases interest when the user clicks on the image, so that the puzzle system can used as a learning tool as well as a game tool.

Abstract: The present disclosure provides a method for manufacturing a cutlery, the method comprising: blanking a steel sheet to obtain a blank with an appearance corresponding to a desired shape of the cutlery, wherein the cutlery has head and handle portions; rolling the head portion of the blank to stretch the head portion; performing single-trimming of a combination of the stretched head portion and the handle portion; and performing single-forming of a combination of the trimmed head and handle portions.

Abstract: The present disclosure provides an ornament secured to a leather product, the ornament comprising: a fame and a metal sticker attached to the frame, wherein the frame comprises a body, an upwardly-protruding edge from a top face of the body and along an outer perimeter of the body, and a securing portion downwardly extending from a bottom face of the body and securing the body into a leather face portion of the leather product, wherein the body is formed in a predetermined shape, and the protruding edge extends along the shape, wherein the metal sticker is formed in the shape, wherein the protruding edge defines an attachment region on the top face of the body, wherein the metal sticker is attached to the body in the attachment region thereof, wherein the protruding edge has varying shapes to allow, in a combination with a shape of the metal sticker, a variety of designs for the ornament.

Abstract: The present disclosure provides a lock assembly for a bag, wherein the bag has a bag body and a bag flap, the assembly comprising: a body-side sub-assembly secured to the bag body; and a flap-side sub-assembly secured to the bag flap, wherein the body-side sub-assembly comprises: a base member having a rear portion secured to the bag body, a pair of rotation members, each rotation member including an upper grip and a lower shaft extending from the upper grip, a rotation-force transfer mechanism configured to transfer a rotation force between the pair of rotation members, wherein the rotation-force transfer mechanism employs a belt.

Abstract: The present invention relates to a puzzle system capable of cooperating with an external device. More specifically, it relates to a puzzle system capable of cooperating with an external device, whereby a user's continuous interest can be stimulated by automatically detecting a type of puzzle that includes a plurality of puzzle pieces, and expressing various implementation operations corresponding to the puzzle when the puzzle is completed.

Abstract: Provided is a method for controlling multiple devices in an automatic interworking manner, by which the multiple devices are controlled, according to a set of operation mstoringodes including combined functions of the multiple devices, through one central control device without individually controlling the functions of each of the multiple devices. The method includes an operation mode setting step for setting an operation mode in which performable functions of the electronic devices are combined and performed in a specific order and for storing the set operation mode in the central control device, an operation mode selecting step for selecting an operation mode to be executed in a plurality of set operation modes, and a controlling step for controlling the electronic devices according to the selected operation mode.

Abstract: Disclosed is a device control method which makes it possible to more easily control a variety of devices in such a way to combine a variety of control commands provided to control the functions of each device for thereby controlling such devices. The device control method configured to control a main device and one or a plurality of auxiliary devices connected to the main device by way of a wired or wireless communication, comprises preparing a command assembly unit in the main device in such a way to combine a plurality of control commands used to control the functions that the main device or auxiliary device perform; and controlling the main device or the auxiliary device by way of the command assembly unit.

Abstract: A method of manufacturing a flip chip package includes: providing a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is to be mounted, and a connection pad disposed outside the mounting region; forming a resin layer on the board; forming a trench by removing a part of the resin layer or forming an uneven portion at a portion of a surface of the resin layer; forming, on the trench or uneven portion, a dam member preventing leakage of an underfill between the mounting region and the connection pad; and mounting the electronic device on the mounting region.

Abstract: The present invention relates to a method for controlling automatic interworking of multiple devices, and more particularly, to a method for controlling automatic interworking of multiple devices, by which the multiple devices can be easily controlled according to a set operation mode by combining functions of the multiple devices through one central control device without individually controlling the functions of each of the multiple devices, that is, all operations of the multiple devices can be controlled through interworking by one command of an operation mode set in the central control device.

Abstract: A method of manufacturing a flip chip package includes: providing a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is to be mounted, and a connection pad disposed outside the mounting region; forming a resin layer on the board; forming a trench by removing a part of the resin layer or forming an uneven portion at a portion of a surface of the resin layer; forming, on the trench or uneven portion, a dam member preventing leakage of an underfill between the mounting region and the connection pad; and mounting the electronic device on the mounting region.

Abstract: There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved.

Abstract: There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. A printed circuit board, which includes an insulation layer, a circuit pattern formed on a surface of the insulation layer that includes at least one pad, and a solder resist which covers the circuit pattern, and in which an opening is formed that exposes a portion of a side and a surface of the pad, can ensure a sufficient amount of attachment area for the pads and the solder resist, to strengthen the adhesion of the pads. Also, the adhesion can be increased between the electronic components and the printed circuit board, and heat release characteristics can be improved.

Abstract: A polymer for forming an organic anti-reflective coating layer between an etching layer and a photoresist layer to absorb an exposure light in a photolithography process and a composition comprising the same are disclosed. The polymer for forming an organic anti-reflective coating layer has a repeating unit represented by wherein, R1 is hydrogen or methyl group, and R2 is a substituted or non-substituted alky group of C1 to C5. The composition for forming the organic anti-reflective coating layer includes the polymer having the repeating unit represented by above Formulas; a light absorber; and a solvent.

Abstract: Provided is an apparatus for sharing specific functions in a portable terminal capable of selectively using one of a CDMA communication system and a JCDMA communication system. The portable terminal includes a first switch unit and a second switch unit. The first switch unit selectively separates one of a CDMA RX signal and a JCDMA RX signal from a signal received through an antenna and outputs the separated signal to a low-noise amplifier. The second switch unit separates a frequency band of the selected communication system from an output signal of the LNA to select a specific-band signal and outputs the specific-band signal to a mixer.

Abstract: An apparatus for a single three-band intenna is provided. The apparatus includes a diplexer being connected to both a first-frequency communication module and a second-frequency communication module, and separating a first-frequency signal and a second-frequency signal from each other so that the two frequency signals share a single communication route; and a switch unit for performing a switching operation so as to connect a communication route either between the intenna and the diplexer, or between the intenna and a third-frequency communication module. The apparatus may include a controller for generating a control signal in order to control the switching operation of the switch unit, wherein the control signal is used to establish a first mode for transmitting/receiving the first-frequency signal or the second-frequency signal, or to establish a second mode for receiving a third-frequency signal.

Abstract: A polymer for forming an organic anti-reflective coating layer between an etching layer and a photoresist layer to absorb an exposure light in a photolithography process and a composition comprising the same are disclosed. The polymer for forming an organic anti-reflective coating layer has a repeating unit represented by wherein, R1 is hydrogen or methyl group, and R2 is a substituted or non-substituted alky group of C1 to C5. The composition for forming the organic anti-reflective coating layer includes the polymer having the repeating unit represented by above Formulas; a light absorber; and a solvent.