Abstract: Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes a fluorine-containing substrate, a tie layer disposed on the fluorine-containing substrate, and a copper layer disposed on the tie layer, wherein the tie layer may be a metal layer or metal alloy layer including a metal of a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more, and the tie layer may have a thickness of about 10 nm to about 100 nm.

Abstract: Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes: a polyimide-based substrate having a fluorine layer disposed on at least one side thereof; a tie-layer disposed on the polyimide-based substrate having the fluorine layer placed thereon; and a copper layer disposed on the tie layer, wherein the tie-layer includes at least one metal element selected from among metal elements of Group 4, Group 6, Group 13, and Group 14 in the Periodic Table, and the at least one metal element may have a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more.

Abstract: A dual camera module includes a single housing accommodating a plurality of lens modules, a first actuator configured to move one of the plurality of lens modules in an optical axis direction, and a plurality of printed circuit boards attached to a lower portion of the single housing. One printed circuit board corresponding to a lens module moved by the first actuator, among the plurality of printed circuit boards, is disposed to be lower than the other printed circuit boards in the optical axis direction.

Abstract: A dual camera module includes a single housing accommodating a plurality of lens modules, a first actuator configured to move one of the plurality of lens modules in an optical axis direction, and a plurality of printed circuit boards attached to a lower portion of the single housing. One printed circuit board corresponding to a lens module moved by the first actuator, among the plurality of printed circuit boards, is disposed to be lower than the other printed circuit boards in the optical axis direction.

Abstract: A method and an apparatus for driving a sensorless DC motor having a bridge-type inductance detecting circuit. The method of driving a sensorless DC motor including a rotor having Y-winding phase coils and a plurality of magnetic poles comprises the steps of applying an alternating current voltage signal to bridge circuits coupled to the phase coils, respectively, inputting an output voltage signal of each bridge circuit as an inductance detecting signal of each phase coil, amplifying the inputted inductance detecting signal of each phase coil, comparing a value of the amplified inductance detecting signal of each phase coil to each other, and determining an initial position of the rotor for rotating the rotor, the phase coils except for a phase coil having a maximum inductance detecting signal being magnetized at the initial position. By the method, the initial position of the rotor can be precisely detected even when the rotor is rotated at a low speed or in a stop state, so the motor is reliably driven.