Abstract: According to the present disclosure, provided is a method for determining phase transition temperature using electrical conductivity. More specifically, according to the present disclosure, there is provided a method for determining phase transition temperature using electrical conductivity, including preparing a graph of the change in electrical conductivity of molten salts according to temperature, and performing at least one mathematical analysis of (i) performing a first-order differential on the graph, (ii) performing a second-order differential on the graph; and (iii) determining the number (n) of data and resolution (AT) based on the graph to derive Tn by Equation (1) below and performing linear regression analysis on a linear section to detect an outlier based on a distance from the linear regression equation, T n = T max - ? ? T × n Equation ? ( 1 ) where n denotes the number of data, and ?T denotes an interval of measurement temperature and means resolution.

Abstract: Exemplary substrate processing chambers may include a chamber body defining a processing region. The chambers may include a backing plate disposed atop the chamber body, a diffuser above the processing region and supported by the backing plate, and a cooling frame disposed between the backing plate and the diffuser. The cooling frame may be coupled with the diffuser. The cooling frame may include a body having one or more fluid inlets and one or more fluid outlets. The body may define an opening. The fluid inlets may be in fluid communication with the one or more fluid outlets via one or more fluid lumens that each extend at least partially about a periphery of the opening. The fluid inlets may be in fluid communication with one or more fluid supply lumens. The fluid outlets may be in fluid communication with one or more fluid return lumens.

Abstract: Embodiments of the present disclosure provide methods for forming sub circuits (e.g., sub-pixel circuits). One example sub circuit generally includes a backplane layer disposed over a substrate, a pixel defining layer (PDL) disposed over the backplane layer, the PDL exposing anodes disposed over the backplane layer and the substrate, and a plurality of walls disposed over the PDL, wherein the plurality of walls define a plurality of gaps, wherein the plurality of walls and the plurality of gaps define one or more unit pixels, and wherein the one or more unit pixels each comprise a sub-pixel. Each sub-pixel may include an anode defined by the PDL, an organic light-emitting diode (OLED) material disposed over the anode, and a cathode disposed over the OLED material and the plurality of walls.

Abstract: Exemplary diffusers for a substrate processing chamber may include a diffuser body that is characterized by a first surface on an inlet side of the diffuser body and a second surface on an outlet side of the diffuser body. The diffuser body may define a plurality of apertures through a thickness of the diffuser body. The first surface may not be anodized. The second surface may be anodized.

Abstract: A coil component includes a body having one surface and the other surface, opposing each other, and both end surfaces, opposing each other, a support substrate disposed inside the body, and including a core portion, and a support portion connected to the core portion, a coil portion disposed on the core portion, and a lead portion disposed on the support portion and connected to the coil portion to be exposed to one surface of the body. The support portion is disposed to be more adjacent to the one surface of the body than the core portion.

Abstract: Embodiments described herein relate to process systems for cleaning semiconductor process chamber components. The process systems include a process chamber having process chamber components. The process chamber components include a substrate support disposed within a chamber volume of the process chamber. A gas distribution assembly faces the substrate support. A gas baffle is fluidly coupled to the gas distribution assembly. A sensor system is coupled to the process chamber and is configured to monitor at least one characteristic of the volume of the process chamber. A dynamic gas assist is fluidly coupled to the gas baffle and is communicatively coupled to the sensor.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a laminate body including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and including a dielectric layer, and a first internal electrode and a second internal electrode stacked in the third direction with the dielectric layer interposed therebetween, a first and a second margin portion; a first connection portion and a second connection portion. The first connection portion includes a first lead electrode connected to the first internal electrode, and the second connection portion includes a second lead electrode connected to the second internal electrode.

Abstract: Embodiments described herein relate to process systems for cleaning semiconductor process chamber components. The process systems include a process chamber having process chamber components. The process chamber components include a substrate support disposed within a chamber volume of the process chamber. A gas distribution assembly faces the substrate support. A gas baffle is fluidly coupled to the gas distribution assembly. A sensor system is coupled to the process chamber and is configured to monitor at least one characteristic of the volume of the process chamber. A dynamic gas assist is fluidly coupled to the gas baffle and is communicatively coupled to the sensor.

Abstract: A touch sensing device includes: a force sensing unit including a sensing coil; and a metal portion. At least a portion of the metal portion is in contact with the force sensing unit, and the touch sensing device is configured such that a region of the metal portion overlapping with the sensing coil changes in response to a touch being applied to the touch sensing device.

Abstract: Embodiments of the present disclosure relate to a shadow frame support with one or more flow controllers and a method of controlling the flow of gases through the shadow frame support. The shadow frame support includes a body coupled to walls of a chamber such that a top surface of the shadow frame support is horizontally disposed in the chamber. The body has a plurality of channels disposed therethrough. Each channel includes a flow controller. The flow controller may be adjusted in real-time to change the open ratio of the flow controller.

Abstract: A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed to an external surface of the body, and a protrusion embedded in the body to be connected to the lead-out portion, and spaced apart from the external surface of the body and each of the coil portion.

Abstract: A touch sensing module includes a sensing coil, a metal portion disposed to be spaced apart from the sensing coil, and a first bracket having one surface, on which the metal portion is disposed, and an other surface, opposing the one surface, on which a pad having a capacitance, configured to vary as a touch is applied, is disposed.

Abstract: A display substrate including a base substrate, a first thin film transistor disposed on the base substrate and including a first gate electrode and a first semiconductor active layer; a second thin film transistor electrically connected to the first thin film transistor, the second thin film transistor including a second gate electrode and a second semiconductor active layer; and an organic light emitting device electrically connected to the second thin film transistor. The first semiconductor active layer includes a first material and the second semiconductor active layer includes a second material different from the first material.

Abstract: An apparatus that detects a rotor input is provided. The apparatus includes a rotor comprising at least a portion which is configured to rotate around an axis of rotation; a reactance element disposed in the rotor, a sensing medium member disposed in the rotor, and a motion conversion member configured to move in the rotor based on a rotation of the portion of the rotor, and configured to move together with the sensing medium member to change a reactance of the reactance element according to the rotation of the portion of the rotor.

Abstract: A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed from a surface of the body, and a connection portion including a plurality of connecting conductors each having a bent portion to increase lengths of the plurality of connecting conductors embedded in the body, the plurality of connecting conductors being spaced apart from each other, the connection portion connecting an end of the coil portion to the lead-out portion to each other.

Abstract: An apparatus with rotor input detection includes: a first reactance element disposed at a rotor configured such that at least a part of the rotor rotates around a rotation axis, and disposed at the rotor such that reactance of the first reactance element varies depending on relative rotation between a first portion of the rotor and a second portion of the rotor; and a second reactance element disposed at the rotor such that reactance of the second reactance element varies depending on a contact or a force applied to a side surface of the rotor. The first and second reactance elements are configured to detect inputs of different areas of the rotor.

Abstract: A memory device includes a gate electrode, a gate insulating layer formed on the gate electrode, a tunneling insulating layer stacked on the gate insulating layer, a channel layer stacked on the tunneling insulating layer, and a source electrode and a drain electrode formed on the channel layer to be spaced apart from each other. The tunneling insulating layer suppresses tunneling of charges from any one of the channel layer and the gate electrode by a voltage applied to each of the gate electrode and the drain electrode, and a density of tunneled charges is set according to the voltage applied to the drain electrode to output and store multiple current levels.

Abstract: Embodiments of the present disclosure relate to a shadow frame support with one or more flow controllers and a method of controlling the flow of gases through the shadow frame support. The shadow frame support includes a body coupled to walls of a chamber such that a top surface of the shadow frame support is horizontally disposed in the chamber. The body has a plurality of channels disposed therethrough. Each channel includes a flow controller. The flow controller may be adjusted in real-time to change the open ratio of the flow controller.

Abstract: A device with touch sensing. The device includes a first sensor configured to detect a touch and to provide a first sensing signal, a second sensor configured to detect another touch and to provide a second sensing signal, a threshold generator configured to set a first threshold by a reflecting of an amount of change of the second sensing signal to an initial threshold, and a sensor circuit configured to generate a first differential signal based on the first sensing signal, and to determine a first touch based on a consideration of the first threshold with respect to a first signal generated based on the first differential signal and the first sensing signal.

Abstract: A touch sensing module includes: a first sensing coil and a second sensing coil, each having inductance varying in response to an applied force touch; a first pad having capacitance varying in response to an applied contact touch, disposed closer to the second sensing coil than to the first sensing coil, and electrically connected to the first sensing coil to constitute a first resonance circuit; and a second pad having capacitance varying in response to the applied contact touch, disposed closer to the first sensing coil than to the second sensing coil, and electrically connected to the second sensing coil to constitute a second resonance circuit.