Patents by Inventor Jong Yun Lee
Jong Yun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240118149Abstract: A stretchable strain sensor includes a light-emitting element, an optical structure, and a photo-detective element. The stretchable strain sensor is located in a path of light emitted from the light-emitting element. The optical structure is configured to have optical properties that change in response to stretching of at least a portion of the stretchable strain sensor. The photo-detective element is configured to detect light transmitted through the optical structure or reflected through the optical structure.Type: ApplicationFiled: December 11, 2023Publication date: April 11, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Gae Hwang LEE, Youngjun YUN, Jong Won CHUNG, Yeongjun LEE, Won-Jae JOO, Yasutaka KUZUMOTO
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Patent number: 9986640Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.Type: GrantFiled: October 29, 2015Date of Patent: May 29, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Jin Hyuck Yang, Jong Yun Lee, Won Chul Sim
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Patent number: 9899141Abstract: Disclosed herein are a method of manufacturing a common mode filter forming a coil electrode by directly patterning metal layers laminated on both surfaces of a core insulating layer while not using a build-up process, and the common mode filter manufactured according to the method.Type: GrantFiled: December 23, 2013Date of Patent: February 20, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Yun Lee, Sung Kwon Wi
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Publication number: 20170294262Abstract: A method of manufacturing an inductor includes forming a step portion having a high-resolution pattern by using a photosensitive layer with photosensitive characteristics, and forming a low-resistance coil pattern by filling the step portion with a metal paste having a lower resistance than a photosensitive metal paste.Type: ApplicationFiled: March 30, 2017Publication date: October 12, 2017Inventors: Jong Yun LEE, Hye Won BANG, Jin Hyuck YANG, Young Seuck YOO
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Publication number: 20170179913Abstract: A common mode filter includes: a coil part including a plurality of coil layers, each coil layer having at least one coil and a lead terminal connected to a first end of the coil, and a conductive via connecting the lead terminals to each other; a first magnetic layer disposed on the coil part; a second magnetic layer disposed below the coil part; and external electrodes connected to the lead terminals and exposed to the surface of the common mode filter.Type: ApplicationFiled: August 26, 2016Publication date: June 22, 2017Inventors: Ha Yoon SONG, Jong Yun LEE, Sung Ryong MA, Won Chul SIM, Young Seuck YOO, Byoung Hwa LEE, Young Jae KIM, Tae Chul HA, Hye Won BANG
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Patent number: 9520223Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.Type: GrantFiled: March 24, 2014Date of Patent: December 13, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Seuck Yoo, Kang Heon Hur, Jin Hyuck Yang, Sung Kwon Wi, Jong Yun Lee, Young Do Kweon
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Publication number: 20160217905Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.Type: ApplicationFiled: October 29, 2015Publication date: July 28, 2016Inventors: Ju Hwan YANG, Jin Hyuck YANG, Jong Yun LEE, Won Chul SIM
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Publication number: 20160055957Abstract: A common mode filter and a method of manufacturing the same are disclosed. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer comprising a coil and an insulation layer and formed on the substrate to remove a signal noise; a magnetic compound layer laminated on the filter layer; an electrostatic electrode pattern formed on the magnetic compound layer to remove static electricity and having one portion thereof exposed to a lateral surface of the magnetic compound layer; a sealing layer laminated on the electrostatic electrode pattern so as to seal the electrostatic electrode pattern; and a lateral surface electrode connected with the exposed portion of the electrostatic electrode pattern and formed in a longitudinal direction between the sealing layer and the substrate.Type: ApplicationFiled: March 19, 2015Publication date: February 25, 2016Inventors: Seung-Wook PARK, Won-Chul SIM, Jong-Yun LEE
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Patent number: 9240274Abstract: Disclosed herein is a common mode filter, including: an external magnetic layer; an insulating layer formed on the external magnetic layer and having coil electrodes therein; a protecting layer formed on the insulating layer; an internal magnetic layer formed inside an opening part formed in one surface of the protecting layer; and external electrode terminals passing through the protecting layer and connected with end portions of the coil electrodes, so that there can be provided a common mode filter having excellent durability, moisture resistance, and heat resistance.Type: GrantFiled: December 23, 2013Date of Patent: January 19, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Yun Lee, Sung Kwon Wi
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Publication number: 20160012956Abstract: Disclosed herein are a thin-type common mode filter and a manufacturing method thereof. According to an exemplary embodiment of the present invention, a thin-type common mode filter includes: a ferrite substrate having an upper surface on which irregular surface roughness is formed; an insulating layer formed on the upper surface of the ferrite substrate; and a conductive coil pattern formed in the insulating layer to be spaced apart from the upper surface of the ferrite substrate. Further, a manufacturing method of a thin-type common mode filter is proposed.Type: ApplicationFiled: July 11, 2014Publication date: January 14, 2016Inventors: Ju Hwan YANG, Young Seuck YOO, Geon Se JANG, Jong Yun LEE, Young Do KWEON, Sung Kwon WI
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Patent number: 9230727Abstract: Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.Type: GrantFiled: March 14, 2013Date of Patent: January 5, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Seuck Yoo, Kang Heon Hur, Sung Kwon Wi, Ho Jin Yun, Jong Yun Lee, Ju Hwan Yang, Jin Hyuck Yang, Young Do Kweon, Eun Ha Kim
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Patent number: 9153957Abstract: The present invention relates to an electrostatic discharge protection device. The electrostatic discharge protection device in accordance with an embodiment of the present invention includes a substrate, an electrostatic discharge absorbing layer having a plating film formed on the substrate, electrodes disposed on the substrate to be spaced apart from each other by a predetermined interval with the electrostatic discharge absorbing layer interposed therebetween, and an insulating layer for covering the substrate and the electrodes.Type: GrantFiled: March 14, 2013Date of Patent: October 6, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Hyuck Yang, Young Seuck Yoo, Sung Kwon Wi, Geon Se Chang, Ju Hwan Yang, Young Do Kweon, Jong Yun Lee
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Patent number: 9093736Abstract: Disclosed herein are a common mode filter and a method for manufacturing the same. The common mode filter includes a first insulator sheet; a first circuit layer having a first-layered first coil and a first-layered second coil alternately and separately arranged; a second insulator sheet laminated on the first circuit layer; and a second circuit layer having a second-layered first coil and a second-layered second coil alternately and separately arranged, the second-layered first coil being connected to the first-layered first coil and the second-layered second coil being connected to the first-layered second coil through the plurality of penetration holes.Type: GrantFiled: May 15, 2012Date of Patent: July 28, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Gu Kim, Jong Yun Lee, Young Do Kweon, Chang Bae Lee, Young Seuck Yoo
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Publication number: 20150135102Abstract: A method of managing digital images is disclosed. The method includes displaying images that a user may select; setting, by selection from images displayed on a display unit, a representative image and subsidiary images based on user input; creating a file including the representative image and the subsidiary images; and managing a plurality of images included in the file, based on the representative image corresponding to the created file.Type: ApplicationFiled: October 28, 2014Publication date: May 14, 2015Inventors: Jong-soo Sung, Jong-yun Lee
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Patent number: 9009950Abstract: Disclosed herein is a method for manufacturing a high frequency inductor, the method including; forming a primary coil for manufacturing the high frequency inductor on a wafer; coating a primary PSV on the wafer on which the primary coil is formed; forming a secondary coil for manufacturing the high frequency inductor, after the coating of the primary PSV; coating a secondary PSV, after the forming of the secondary coil; forming a barrier layer on an electrode portion to be exposed of the high frequency inductor, after the coating of the secondary PSV; filling and curing an insulating resin on the wafer, after the forming of the barrier layer; and polishing the cured resin up to the barrier layer to expose the electrode.Type: GrantFiled: March 14, 2013Date of Patent: April 21, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sang Moon Lee, Young Seuck Yoo, Jong Yun Lee, Young Do Kweon, Sung Kwon Wi
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Publication number: 20140320251Abstract: Disclosed herein is a thin film chip device, including: a substrate; a circuit layer disposed on the substrate and having coil patterns; and a functional layer formed on the circuit layer and having an embossed shape.Type: ApplicationFiled: April 23, 2014Publication date: October 30, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Hyuck YANG, Young Seuck YOO, Jeong Min CHO, Ji Hoon PARK, Kyong Bok MIN, Young Do KWEON, Jong Yun LEE
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Publication number: 20140285304Abstract: Disclosed herein is an inductor including: a core layer having a conductive pattern formed on a surface thereof and having a through-hole formed at a region in which the conductive pattern is not formed; and a magnetic layer covering the core layer, wherein the magnetic layer includes: a filled part filled in the through-hole and having high magnetic material filling density; and a cover part covering the surface of the core layer and having magnetic material filling density lower than that of the filled part.Type: ApplicationFiled: October 15, 2013Publication date: September 25, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Seuck YOO, Young Do KWEON, Kang Heon HUR, Jin Hyuck YANG, Sung Kwon WI, Jong Yun LEE
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Publication number: 20140285305Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.Type: ApplicationFiled: March 24, 2014Publication date: September 25, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Seuck YOO, Kang Heon HUR, Jin Hyuck YANG, Sung Kwon WI, Jong Yun LEE, Young Do KWEON
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Publication number: 20140184377Abstract: Disclosed herein is an inductor including: a substrate; an insulating part provided on the substrate; and a conductive pattern part provided in the insulating part, wherein the insulating part includes first and second insulating parts that are provided at regions physically separated from each other, the first and second insulating parts being made of materials of which at least one of dielectric constant and heat resistance are different. In the inductor according to the present invention, high Q and L values may be implemented, and deformation by heat treatment may also be decreased, thereby making it possible to improve reliability.Type: ApplicationFiled: December 27, 2013Publication date: July 3, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Suk KIM, Sung Kwon WI, Jong Yun LEE, Jin Woo HAHN, Young Seuck YOO
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Patent number: D756250Type: GrantFiled: November 6, 2014Date of Patent: May 17, 2016Assignee: Zikto CorporationInventor: Jong Yun Lee