Abstract: A vinyl acetate-ethylene copolymer emulsion and method of making the same. The vinyl acetate-ethylene copolymer emulsion is prepared by using a redox initiator. Where the redox initiator includes a salt of at least one metal selected from the group consisting of silver (Ag), platinum (Pt), copper (Cu), mercury (Hg), zinc (Zn), tin (Sn), lead (Pb), bismuth (Bi), cadmium (Cd) and chromium (Cr). The emulsion further includes an oligomer of a monocarboxylic acid selected from the group consisting of C1-C14 aliphatic monocarboxylic acid and C6-C14 aromatic monocarboxylic acid.

Abstract: A vinyl acetate-ethylene copolymer emulsion and method of making the same. The vinyl acetate-ethylene copolymer emulsion is prepared by using a redox initiator. Where the redox initiator includes a salt of at least one metal selected from the group consisting of silver (Ag), platinum (Pt), copper (Cu), mercury (Hg), zinc (Zn), tin (Sn), lead (Pb), bismuth (Bi), cadmium (Cd) and chromium (Cr). The emulsion further includes an oligomer of a monocarboxylic acid selected from the group consisting of C1-C14 aliphatic monocarboxylic acid and C6-C14 aromatic monocarboxylic acid.

Abstract: A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.

Abstract: The invention relates to a dye-sensitized solar cell and a module using the same and more particularly, to a dye-sensitized solar cell in which a photoelectrode substrate and a catalyst electrode substrate are spaced apart from each other by a separating space and coupled together by an encapsulating material and the separating space is filled with an electrolyte, characterized in that the electrolyte contains optical beads, and a module using the same. Thus, light passing through the photoelectrode substrate is refracted or reflected by the optical beads, and irradiated onto the photoelectrode substrate, thereby to improve the efficiency of the solar cell. Particularly, the efficiency of a dye-sensitized solar cell for a BIPV system is more effectively improved, said solar cell not having a separate scattering layer for maintaining the translucency thereof.

Abstract: A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.

Abstract: A liquid crystal display apparatus includes a first display substrate, a second display substrate and a liquid crystal layer disposed therebetween. The first and second display substrates include first and second vertical inorganic alignment layers, respectively, to vertically align liquid crystal molecules of the liquid crystal layer. The first and second vertical inorganic alignment layers each include a silicon carbide and are formed on the first and second display substrates, respectively, by a chemical vapor deposition method or a sputtering method. Thus, processes for the vertical inorganic alignment layer may be simplified, thereby improving manufacturing productivity of the liquid crystal display apparatus.

Abstract: In a method of manufacturing a display substrate, a color filter is formed on a first substrate including a switching element. A pixel electrode is formed on the first substrate including the color filter. An inorganic alignment layer including an inorganic compound is formed on the first substrate including the pixel electrode. Thus, impurities generated from the color filter may be blocked from flowing into a liquid crystal layer, and liquid crystal molecules of the liquid crystal layer may be aligned by the inorganic layer.

Abstract: A polishing pad cleaner of a chemical mechanical polishing apparatus throughly and efficiently cleans the polishing pad of the apparatus. The head of the polishing pad cleaner includes a nozzle support plate, a plurality of nozzles mounted to the nozzle support plate, and extending from the bottom of the nozzle support plate, and partitions interposed between the nozzles. The head is placed over the polishing pad. Subsequently, the polishing pad is roated relative to the nozzles, and cleaning agent is ejected from the nozzles. The partitions help maintain the pressure of the cleaning agent as the agent flows from the nozzles to the polishing pad. Also, different types of cleaning agents can be simultaneously ejected from the nozzles, respectively, onto the polishing pad. Specifically, a high pressure gas and a cleaning solution can be directed onto the same region of the pad one after the other.

Abstract: An alignment layer for an LCD includes a thin layer of silicon oxide SiOx. The silicon oxide layer horizontally aligns liquid crystals thereon when the value of x is in the range from about 1.0 to about 1.5, but vertically aligns the liquid crystals when the value of x is in a range from about 1.5 to about 2.0. The alignment layer is readily formed on a large area of the substrate through chemical vapor deposition or evaporation deposition. Because the alignment layer is thermally and physically stable, the operational characteristics of the liquid crystal display employing this alignment layer are improved. In addition, the alignment layer has a thickness of about 500 to about 3000 angstroms thereby improving light transmittance of the LCD having the alignment layer.

Abstract: A liquid crystal display apparatus includes a first display substrate, a second display substrate and a liquid crystal layer disposed therebetween. The first and second display substrates include first and second vertical inorganic alignment layers, respectively, to vertically align liquid crystal molecules of the liquid crystal layer. The first and second vertical inorganic alignment layers each include a silicon carbide and are formed on the first and second display substrates, respectively, by a chemical vapor deposition method or a sputtering method. Thus, processes for the vertical inorganic alignment layer may be simplified, thereby improving manufacturing productivity of the liquid crystal display apparatus.

Abstract: A polishing pad cleaner of a chemical mechanical polishing apparatus throughly and efficiently cleans the polishing pad of the apparatus. The head of the polishing pad cleaner includes a nozzle support plate, a plurality of nozzles mounted to the nozzle support plate, and extending from the bottom of the nozzle support plate, and partitions interposed between the nozzles. The head is placed over the polishing pad. Subsequently, the polishing pad is roated relative to the nozles, and cleaning agent is ejected from the nozzles. The partitions help maintain the pressure of the cleaning agent as the agent flows from the nozzles to the polishing pad. Also, different types of cleaning agents can be simultaneously ejected from the nozzles, respectively, onto the polishing pad. Specifically, a high pressure gas and a cleaning solution can be directed onto the same region fo the pad one after the other.

Abstract: Provided is a polishing pad for a chemical mechanical polishing (CMP) apparatus, having a sealing barrier which prevents fluid leakage and moisture accumulation on a window. The polishing pad comprises an upper pad having polishing surface in contact with a wafer, a bottom pad an upper face of which is attached to a lower face of the upper pad and a lower face of which is attached to an upper face of a platen of the CMP apparatus, an aperture through the bottom pad and the upper pad, a transparent window fitted in the aperture in the upper pad, and a sealing barrier, placed between the aperture and an external face of the bottom pad in contact with a fluid, to prevent fluid leakage and accumulation of moisture derived from fluid fed on the polishing surface through the bottom pad.

Abstract: The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.

Abstract: Disclosed is a device for treating a semiconductor substrate. The device comprises a rotational support plate in which at least one mounting recess is formed at the periphery thereof, and support blocks disposed on the periphery of the support plate within said mounting recess for supporting the semiconductor substrate. Each of the support blocks comprises a positioning portion on which the semiconductor substrate is positioned. An insertion portion which has a shape complementary to the shape of the mounting recess is disposed under the positioning portion where it is inserted into the mounting recess.

Abstract: The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.

Abstract: A fluorene-based polymer of the following Formula (I) and electroluminescent devices using the same. wherein, R1, R2, R3 and R4 are same or different and represent hydrogen, aliphatic or alicyclic alkyl or alkoxy groups containing 1 to 22 carbon atoms, aryl or aryloxy group containing 6 to 18 carbon atoms, cyano, cyanoethyl, or an alkyl or aryl derivative of silicon, tin or germanium; X represents diacetylene, diethynyl aryl, divinylaryl group or a single bond; and n is an integer equal to or greater than 1.

Abstract: Provided is a polishing pad for a chemical mechanical polishing (CMP) apparatus, having a sealing barrier which prevents fluid leakage and moisture accumulation on a window. The polishing pad comprises an upper pad having polishing surface in contact with a wafer, a bottom pad an upper face of which is attached to a lower face of the upper pad and a lower face of which is attached to an upper face of a platen of the CMP apparatus, an aperture through the bottom pad and the upper pad, a transparent window fitted in the aperture in the upper pad, and a sealing barrier, placed between the aperture and an external face of the bottom pad in contact with a fluid, to prevent fluid leakage and accumulation of moisture derived from fluid fed on the polishing surface through the bottom pad.

Abstract: A fluorene-based polymer of the following Formula (I) and electroluminescent devices using the same.

Abstract: A method is provided for manufacturing a capacitor of a semiconductor device. First, an insulating layer, an etching barrier layer, a first material layer and a second material layer are sequentially stacked on a semiconductor substrate on which a field oxide layer and a gate electrode are formed, and predetermined portions of the stacked layers are sequentially etched to form a contact hole exposing the substrate. Then, a first conductive layer is formed on thge whole surface of the resultant structure having the contact hole. Subsequently, a storage electrode pattern is formed by patterning the first conductive layer and etching the second material layer. Then, a second conductive layer is formed on the whole surface of the resultant structure so as to cover the storage electrode pattern and the first material layer. Thereafter, the second conductive layer is etched to expose the upper surface of the storage electrode pattern.

Abstract: A method for manufacturing a capacitor of a semiconductor memory device is provided. A first insulating layer and a second insulating layer are formed in sequence on a semiconductor substrate on which a transistor including a source region, a drain region and a gate electrode, and a buried bit-line surrounded by insulating layer are formed. Then, a contact hole is formed by sequentially etching the layers stacked on the source region, by which the source region of the transistor is exposed, and a spacer made of an insulating substance is formed inside the contact hole, and a first conductive layer is formed on the whole surface of the resultant. Next, the first conductive layer and second insulating layer are etched, and a second conductive layer is formed on the whole surface of the resultant, and a storage electrode is formed by etching the second conductive layer using the first conductive layer as a mask.