Abstract: An evaporation device includes a first deposition source, a second deposition source in a first direction together with the first deposition source, a body part spaced apart from the first and second deposition sources in a second direction intersecting the first direction and including a first portion and a second portion in the second direction, a nozzle body part on the body part, a first pipe connected to a side surface of the first deposition source facing the body part and the nozzle body part and a lower end of the first portion, a second pipe connected to a side surface of the second deposition source facing the body part and the nozzle body part and a lower end of the second portion, a first nozzle protruding upward from the nozzle body part, and a second nozzle protruding upward from the nozzle body part.

Abstract: A deposition apparatus includes: a vaporization portion to vaporize a first material, a second material, and a third material different from each other; and a first nozzle portion connected adjacent to the vaporization portion. The first nozzle portion includes: a first nozzle hole to discharge the first material; a second nozzle hole adjacent to the first nozzle hole and to discharge the second material; and a third nozzle hole adjacent to the first nozzle hole and the second nozzle hole and to discharge the third material.

Abstract: An embodiment provides a deposition apparatus including a chamber; and a deposition source disposed in the chamber and including a plurality of nozzles arranged in a first direction. Each of the plurality of nozzles includes at least one first nozzle including a first nozzle hole spraying a first deposition material and a second nozzle hole spraying a second deposition material, and the deposition source further includes at least one angle controlling structure surrounding the at least one first nozzle.

Abstract: A deposition apparatus includes: a vaporization portion to vaporize a first material, a second material, and a third material different from each other; and a first nozzle portion connected adjacent to the vaporization portion. The first nozzle portion includes: a first nozzle hole to discharge the first material; a second nozzle hole adjacent to the first nozzle hole and to discharge the second material; and a third nozzle hole adjacent to the first nozzle hole and the second nozzle hole and to discharge the third material.

Abstract: An embodiment provides a deposition apparatus, including: a process chamber; a residual gas analyzer connected to the process chamber; a cleansing gas supplier connected to the process chamber; and a driver that is connected to the residual gas analyzer and the cleansing gas supplier and controls the residual gas analyzer and the cleansing gas supplier.

Abstract: An apparatus for manufacturing a display apparatus includes a deposition source, a nozzle head, a substrate fixer, and a deposition preventer. The deposition source is outside the chamber and vaporizes or sublimates a deposition material. The nozzle head is in the chamber, is connected to the at least one deposition source, and simultaneously sprays the deposition material onto an entire surface of a display substrate. The substrate fixer is connected to the chamber and moves linearly, with the display apparatus is mounted on the substrate fixer. The deposition preventer is in the chamber surrounding an edge portion of the nozzle head and an edge portion of the substrate fixer. The deposition preventer is heated during a deposition process.

Abstract: An apparatus for manufacturing a display apparatus includes a deposition source, a nozzle head, a substrate fixer, and a deposition preventer. The deposition source is outside the chamber and vaporizes or sublimates a deposition material. The nozzle head is in the chamber, is connected to the at least one deposition source, and simultaneously sprays the deposition material onto an entire surface of a display substrate. The substrate fixer is connected to the chamber and moves linearly, with the display apparatus is mounted on the substrate fixer. The deposition preventer is in the chamber surrounding an edge portion of the nozzle head and an edge portion of the substrate fixer. The deposition preventer is heated during a deposition process.