Patents by Inventor Jong Cheol Yun

Jong Cheol Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131462
    Abstract: An air-cleaning filter includes a non-woven fabric for dust collection and a non-woven fabric for deodorization having activated carbon particles combined therewith. By adjusting the particle diameter and content of the activated carbon particles and laminating with a non-woven fabric coated with an absorber for other gases, a dust collecting function and a deodorizing function can be imparted at the same time while also creating a structure with a low differential pressure.
    Type: Application
    Filed: January 27, 2022
    Publication date: April 25, 2024
    Applicant: COWAY Co., Ltd.
    Inventors: Hyun Jun YUN, Byong Hyoek LEE, Jong Cheol KIM
  • Publication number: 20240128510
    Abstract: The present invention relates to a novel electrolyte and a secondary battery including the same. The present invention has an effect of providing a secondary battery having improved charging efficiency and output due to reduced charging resistance and having excellent long-term lifespan and high-temperature capacity retention rate.
    Type: Application
    Filed: December 24, 2021
    Publication date: April 18, 2024
    Inventors: Ji Young CHOI, Min Goo KIM, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Min Jung JANG
  • Publication number: 20240105991
    Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.
    Type: Application
    Filed: January 21, 2022
    Publication date: March 28, 2024
    Inventors: Min Jung JANG, Min Goo KIM, Young Rok LIM, Ji Young CHOI, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Hee Jeong RYU, Jae Won CHUNG
  • Publication number: 20240097190
    Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.
    Type: Application
    Filed: January 21, 2022
    Publication date: March 21, 2024
    Inventors: Min Jung JANG, Min Goo KIM, Young Rok LIM, Ji Young CHOI, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Hee Jeong RYU, Jae Won CHUNG
  • Publication number: 20240097189
    Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.
    Type: Application
    Filed: January 21, 2022
    Publication date: March 21, 2024
    Inventors: Min Jung JANG, Min Goo KIM, Young Rok LIM, Ji Young CHOI, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Hee Jeong RYU, Jae Won CHUNG
  • Publication number: 20240097188
    Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.
    Type: Application
    Filed: January 21, 2022
    Publication date: March 21, 2024
    Inventors: Min Jung JANG, Min Goo KIM, Young Rok LIM, Ji Young CHOI, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Hee Jeong RYU, Jae Won CHUNG
  • Publication number: 20240030490
    Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention rate by suppressing increase in thickness.
    Type: Application
    Filed: June 12, 2023
    Publication date: January 25, 2024
    Inventors: Jong Cheol YUN, Min Goo KIM, Sang Ho LEE, Ji Seong HAN, Min Jung JANG
  • Patent number: 11035050
    Abstract: The present invention relates to a electroplating composition and an electroplating method using the same.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 15, 2021
    Inventors: Jong Cheol Yun, Wan Joong Kim, Hee Jeong Ryu, Seung Min Park
  • Publication number: 20210062353
    Abstract: The present invention relates to a A copper plating composition, comprising a metal ion supply source, an electrolyte, and a leveling agent comprising a thioamide compound that comprises at least one of a homocyclic aromatic ring and a heterocyclic aromatic ring. Excellently smooth plated surfaces with minimized defects can be obtained when a feature formed on a substrate are plated by using the copper plating composition.
    Type: Application
    Filed: November 10, 2020
    Publication date: March 4, 2021
    Inventors: Jong Cheol YUN, Wan Joong KIM, Hee Jeong RYU
  • Patent number: 10760174
    Abstract: The present invention relates to a leveling agent and electroplating composition comprising the same. When features are plated using the electroplating composition of the present invention, excellently leveled plated surfaces with minimized defects may be obtained.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: September 1, 2020
    Inventors: Min Jung Jang, Jong Cheol Yun, Wan Joong Kim, Hee Jeong Ryu, Seung Min Park
  • Publication number: 20200123671
    Abstract: The present invention relates to a electroplating composition and an electroplating method using the same.
    Type: Application
    Filed: December 19, 2018
    Publication date: April 23, 2020
    Inventors: Jong Cheol YUN, Wan Joong KIM, Hee Jeong RYU, Seung Min PARK
  • Publication number: 20190186032
    Abstract: The present invention relates to a composition for cobalt plating and a method for forming metal wiring using the same, and more particularly, a composition for cobalt plating comprising a cobalt salt; a chloride or a hydrochloric acid; boric acid; a carbonaceous material; and other additives, and a method for forming a metal wiring using the same, in which the composition for cobalt plating is plated onto a substrate to suppress the thermal expansion of the metal caused by high-temperature processes to achieve excellent high-temperature stability, thereby resulting in prevention of deformation of a substrate even in the absence of any structural modification of the substrate or additional processing.
    Type: Application
    Filed: December 12, 2018
    Publication date: June 20, 2019
    Inventors: Hee Jeong RYU, Wan Joong KIM, Jong Cheol YUN, Min Jung JANG
  • Publication number: 20190161878
    Abstract: The present invention relates to a leveling agent and electroplating composition comprising the same. When features are plated using the electroplating composition of the present invention, excellently leveled plated surfaces with minimized defects may be obtained.
    Type: Application
    Filed: November 15, 2018
    Publication date: May 30, 2019
    Inventors: Min Jung JANG, Jong Cheol YUN, Wan Joong KIM, Hee Jeong RYU, Seung Min PARK
  • Publication number: 20190161877
    Abstract: The present invention relates to a additives for electroplating and a copper plating composition comprising the same. Excellently smooth plated surfaces with minimized defects can be obtained when a feature formed on a substrate are plated by using the copper plating composition.
    Type: Application
    Filed: July 19, 2018
    Publication date: May 30, 2019
    Inventors: Jong Cheol YUN, Wan Joong KIM, Hee Jeong RYU
  • Patent number: 6285340
    Abstract: A helical antenna having a simple structure and being made of cheap conductor to reduce the manufacturing cost, and a manufacturing method thereof. A helical antenna comprises a dielectric core, a conductive strip, a feeding conductor, and an external circuit. The dielectric core has a substantially cylindrical shape with an outer circumferential surface on which a spiral groove is formed. The conductive strip is deposited on the groove of the dielectric core. The feeding conductor is placed under the dielectric core and provides an electrical connection between the conductive strip and an external circuit. The antenna cover encloses the dielectric core and the feeding conductor.
    Type: Grant
    Filed: June 9, 1999
    Date of Patent: September 4, 2001
    Assignee: Ace Technology
    Inventors: Duck Jae Park, Jong Cheol Yun, Ki Duk Koo, Kyu Bok Lee, Jae Suk Sung