Patents by Inventor Jongchil NA

Jongchil NA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMBEDDING DIE TECHNOLOGY
    Publication number: 20170084594
    Abstract: A die can be mounted on an already made pattern. Thereafter, substrate and other metal layers can be provided so as to embed the die in the substrate. This avoids the need to form a cavity in the substrate for die placement prevalent in conventional die embedding processes. As a result, die embedding process can be simplified. Also, die misalignment can be reduced or eliminated.
    Type: Application
    Filed: September 20, 2015
    Publication date: March 23, 2017
    Inventors: Jongchil NA, Hong Bok WE, Ruey Kae ZANG