Abstract: A display device includes a substrate, pixel electrodes on the substrate, a bank in which opening areas partially exposing the pixel electrodes are defined, organic light emitting layers disposed on the pixel electrodes, a common electrode disposed on the organic light emitting layers and the bank, an encapsulation layer disposed on the common electrode, a touch electrode which is disposed on the encapsulation layer and does not overlap the opening areas in a thickness direction, a first adhesive member disposed on the touch electrode, a first light blocking layer which is disposed on the first adhesive member and does not overlap the opening areas in the thickness direction, color filters which are disposed on the first adhesive member and overlap the opening areas in the thickness direction, and a support layer which is disposed on the first light blocking layer and the color filters and includes a first organic material.

Abstract: A wireless power transmission apparatus according to various embodiments of the present invention may comprise: a power provision circuit for providing direct current (DC) power; a first conductive pattern; a second conductive pattern; multiple first switches connected to one end of the first conductive pattern and one end of the second conductive pattern; multiple second switches connected to the other end of the first conductive pattern; multiple third switches connected to the other end of the second conductive pattern; and a control circuit, wherein the control circuit controls the multiple first switches and the multiple second switches to convert the DC power into first alternating current (AC) power and apply the first AC power to the first conductive pattern and control the multiple first switches and the multiple third switches to convert the DC power into second AC power and apply the second AC power to the second conductive pattern. Various other embodiments are possible.

Abstract: Disclosed is an apparatus for transmitting wireless power including: a plurality of coils; a position-sensing circuit that determines a position of an electronic device charged by the apparatus; and a control circuit determines at least one coil corresponding to the determined position of the electronic device from among the plurality of coils and transmit wireless charging power through one coil selected from the at least one determined coil. Other embodiments can be applied.

Abstract: A wireless power transmission apparatus according to various embodiments of the present invention may comprise: a power provision circuit for providing direct current (DC) power; a first conductive pattern; a second conductive pattern; multiple first switches connected to one end of the first conductive pattern and one end of the second conductive pattern; multiple second switches connected to the other end of the first conductive pattern; multiple third switches connected to the other end of the second conductive pattern; and a control circuit, wherein the control circuit controls the multiple first switches and the multiple second switches to convert the DC power into first alternating current (AC) power and apply the first AC power to the first conductive pattern and control the multiple first switches and the multiple third switches to convert the DC power into second AC power and apply the second AC power to the second conductive pattern. Various other embodiments are possible.

Abstract: A cordless charging apparatus includes a housing, a main substrate accommodated in the housing, a coil unit stacked on the main substrate, and a connection member for electrically connecting the coil unit to the main substrate. The connection member includes a connector provided on the main substrate, and a connection substrate provided at the coil unit in order to contact the connector and electrically connect with the coil unit stacked on the main substrate.

Abstract: Disclosed is an apparatus for transmitting wireless power including: a plurality of coils; a position-sensing circuit that determines a position of an electronic device charged by the apparatus; and a control circuit determines at least one coil corresponding to the determined position of the electronic device from among the plurality of coils and transmit wireless charging power through one coil selected from the at least one determined coil. Other embodiments can be applied.

Abstract: A cordless charging apparatus includes a housing, a main substrate accommodated in the housing, a coil unit stacked on the main substrate, and a connection member for electrically connecting the coil unit to the main substrate. The connection member includes a connector provided on the main substrate, and a connection substrate provided at the coil unit in order to contact the connector and electrically connect with the coil unit stacked on the main substrate.

Abstract: The present invention relates to a polyketone resin composition and a method for manufacturing the same. The polyketone resin composition is prepared by mixing a polyketone terpolymer consisting of repeating units, represented by the following general formulas (1) and (2), with ABS, a glass fiber, a sulfonamide-based plasticizer and a mineral filler, and is applicable to various industrial fields requiring oil resistance, calcium chloride resistance, impact resistance, etc.

Abstract: A semiconductor package including a sealing part which is bonded to a lead frame. The lead frame is formed to include portions of reduced thickness for purposes of providing maximum crack prevention during a singulation process involved in the manufacture of the semiconductor package. Additionally, the lead frame and the sealing part are sized and configured relative to each other so as to maximize the contact area therebetween, thus having the effect of improving the bonding strength between the lead frame and the sealing part. This increased contact area between the sealing part and the lead frame also maximizes the lengths of those passages susceptible to moisture permeation, thus minimizing such moisture permeation potential.

Abstract: A semiconductor package including a sealing part which is bonded to a lead frame. The lead frame is formed to include portions of reduced thickness for purposes of providing maximum crack prevention during a singulation process involved in the manufacture of the semiconductor package. Additionally, the lead frame and the sealing part are sized and configured relative to each other so as to maximize the contact area therebetween, thus having the effect of improving the bonding strength between the lead frame and the sealing part. This increased contact area between the sealing part and the lead frame also maximizes the lengths of those passages susceptible to moisture permeation, thus minimizing such moisture permeation potential.