Patents by Inventor Jonghun YI

Jonghun YI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250092527
    Abstract: The present invention relates to a method for preparing a metamaterial in the form of a film having high visible light transmittance and excellent radiative cooling characteristics even with a small thickness by powder coating. In the present invention, a metamaterial in the form of a highly transparent film can be prepared by powder coating of aerogel particles, an optical modulator, and a base resin. The metamaterial formed according to the present invention can exhibit excellent visible light transmittance and heat dissipation characteristics and, since a powder coating process is used, a metamaterial coating can be formed regardless of the shape of an object and the coating can be thin and uniform.
    Type: Application
    Filed: December 29, 2022
    Publication date: March 20, 2025
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Dong Rip KIM, Kang Won LEE, Jonghun YI, Yale JEON
  • Publication number: 20250066567
    Abstract: The present invention relates to a metamaterial composition having excellent radiative cooling characteristics and a film prepared from same. The metamaterial of the present invention comprises a base material, aerogel particles and optical control agent, and thus can exhibit high visible light transmittance and excellent infrared emissivity even with a thin thickness. Therefore, the metamaterial of the present invention can be used as a radiative cooling film requiring transparency, and can be usefully applied to, especially, a cover window for a display.
    Type: Application
    Filed: December 30, 2022
    Publication date: February 27, 2025
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Dong Rip KIM, Kang Won LEE, Jonghun YI, Yale JEON