Abstract: A manufacturing method of a semiconductor device may include: forming a stack comprising first material layers and second material layers that are alternately stacked; forming an opening in the stack; forming a first seed layer in the opening; forming a first buffer layer by surface-treating the first seed layer; and forming a blocking layer by oxidizing the first seed layer through the first buffer layer.

Abstract: A stainless steel with a yield strength of 2,200 MPa or more is disclosed through the generation of the strain-induced martensite phase and the increase of the martensite phase strength. A high strength stainless steel according to an embodiment of present disclosure includes, in percent (%) by weight of the entire composition, C: 0.14 to 0.20%, Si: 0.8 to 1.0%, Mn: more than 0 and 0.5% or less, Cr: 15.0 to 17.0%, Ni: 4.0 to 5.0%, Mo: 0.6 to 0.8%, Cu: 0.5% or less, N: 0.05 to 0.11%, the remainder of iron (Fe) and other inevitable impurities, and C+N: 0.25% or more and Md30 value satisfies 40° C. or more.

Abstract: The present disclosure provides a method for producing a cell-culturing polyvinyl alcohol-based nanofiber structure, the method comprising: electrospinning an electrospun solution to form a nanofiber mat, wherein the electrospun solution contains polyvinyl alcohol (PVA), polyacrylic acid (PA) and glutaraldehyde (GA); crosslinking the nanofiber mat via a hydrochloric acid (HCl) vapor treatment; and treating the crosslinked nanofiber mat with dimethylformamide (DMF) solvent to crystallize the nanofiber mat.

Abstract: An inductor includes a first magnetic body having a toroidal shape and having a ferrite; and a second magnetic body configured to be different from the first magnetic body and including a metal ribbon, wherein the second magnetic body includes an outer magnetic body disposed on an outer circumferential surface of the first magnetic body and an inner magnetic body disposed on an inner circumferential surface of the first magnetic body, and each of the outer magnetic body and inner magnetic body is wound in a plurality of layers in a circumferential direction of the first magnetic body.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.

Abstract: A vehicle lamp for emitting light at various locations adjacent to a vehicle while having a simplified configuration is provided. A vehicle lamp includes a light-emitting unit that emits light to form a road surface pattern, and a movable unit on which the light-emitting unit is mounted. The light generated by the light-emitting unit enables the road surface pattern to be formed on different locations of a road surface adjacent to the vehicle as the movable unit rotates.

Abstract: A semiconductor device including: a first transistor which include a first gate stack on a substrate; and a second transistor which includes a second gate stack on the substrate, wherein the first gate stack includes a first ferroelectric material layer disposed on the substrate, a first work function layer disposed on the first ferroelectric material layer and a first upper gate electrode disposed on the first work function layer, wherein the second gate stack includes a second ferroelectric material layer disposed on the substrate, a second work function layer disposed on the second ferroelectric material layer and a second upper gate electrode disposed on the second work function layer, wherein the first work function layer includes the same material as the second work function layer, and wherein an effective work function of the first gate stack is different from an effective work function of the second gate stack.

Abstract: A system for manufacturing edible food products according to the present disclosure includes a first food ingredient supply apparatus configured to separate a single sheet of a first food ingredient from a first food ingredient stack including a plurality of stacked first food ingredients and supply the single sheet of first food ingredient, a second food ingredient supply apparatus configured to separate a single sheet of a second food ingredient from a second food ingredient stack including a plurality of stacked second food ingredients and supply the single sheet of second food ingredient, and a pressing device configured to form an edible food product by pressing a semi-finished product formed by seating the supplied single sheet of the first food ingredient on the supplied single sheet of the second food ingredient.

Abstract: An apparatus for supplying food ingredients according to the present disclosure includes a food ingredient lifting part configured to separate and move upward a food ingredient stack from a food ingredient cassette on which food ingredients including a plurality of stacked food ingredients are seated, a food ingredient separation part configured to suck and move upward a single sheet of a food ingredient from the food ingredient stack moved upward by the food ingredient lifting part, and a horizontal movement part configured to transfer forward the single sheet of the food ingredient moved upward by the food ingredient separation part.

Abstract: The embodiments disclosed herein provide an electrocardiogram data processing server, an electrocardiogram data processing method, and a computer program. The embodiments disclosed herein further provide an electrocardiogram data processing server, an electrocardiogram data processing method, and a computer program, the electrocardiogram data processing server configured to determine whether analysis is required while segmenting an electrocardiogram signal into signal segments with variable window sizes, for instance, by changing a window size of a signal segment according to whether analysis of a previous signal segment is required.

Abstract: A semiconductor device includes a first interlayer insulating film disposed on a substrate and having a first trench. A first lower conductive pattern fills the first trench and includes first and second valley areas that are spaced apart from each other in a first direction parallel to an upper surface of the substrate. The first and second valley areas are recessed toward the substrate. A second interlayer insulating film is disposed on the first interlayer insulating film and includes a second trench that exposes at least a portion of the first lower conductive pattern. An upper conductive pattern fills the second trench and includes an upper barrier film and an upper filling film disposed on the upper barrier film. The upper conductive pattern at least partially fills the first valley area.

Abstract: The present disclosure is to provide a shape of a surface mount type optical module to be mounted on a surface of a system board or package submount, and is to provide a compact and lightweight optical module attachment/detachment apparatus that performs the mounting (attachment) and separation of the optical module in a confined space by automatically performing optical module loading/unloading, optical module alignment, and laser soldering to facilitate attachment and detachment of the optical module. The attachment/detachment apparatus includes a body frame; a fixing part for fixing the body frame to the board; a gripper for gripping the optical module; an aligning part for aligning the position of the optical module with respect to the board; and a laser part which irradiates a laser for non-contact bonding between the optical module and the board.

Abstract: Provided is a method performed in a terminal for processing an interest message. The method includes receiving a message from a message server after a login event for a user of the terminal occurs, wherein the login event is related to a message service provided by the message server; storing, in response to determining that the received message corresponds to an interest message of the user, the received message in a local storage of the terminal; receiving a search request for the interest message of the user; and searching and providing the interest message of the user through the local storage of the terminal in response to the search request.

Abstract: A method for decoding an image based on an intra prediction, comprising: obtaining a first prediction pixel of a first region in a current block by using a neighboring pixel adjacent to the current block; obtaining a second prediction pixel of a second region in the current block by using the first prediction pixel of the first region; and decoding the current block based on the first and the second prediction pixels.

Abstract: A cutting apparatus according to the present disclosure includes a cutting roller including a cutting body having a cylindrical shape and configured to rotate about an axis defined in a leftward/rightward direction, and cutting blades protruding outward in a radial direction of the cutting body further than a surface of the cutting body to cut an edible food product provided in a forward/rearward direction, and a cutting base part disposed at a position facing the cutting roller based on the edible food product to support the edible food product to be cut by the cutting roller.

Abstract: The present invention relates to an OLED pixel compensation circuit for removing a substrate effect. The pixel compensation circuit according to the present invention uses six transistors and two storage batteries to fix both a source voltage and a body voltage of a driving transistor that drives an OLED, thereby having the effects of eliminating errors due to a substrate effect and presenting more accurate pixel compensation results.