Abstract: Disclosed are an electrostatic chuck capable of precisely controlling the temperature of a peripheral area of a substrate and a plasma processing apparatus including the same. The electrostatic chuck configured to support a substrate in a plasma processing apparatus includes a plate configured to support the substrate using electrostatic force and having a disc shape, a first partition wall formed in an annular shape on a peripheral portion of the plate, a second partition wall formed in an annular shape at a position farther inward than the first partition wall on the peripheral portion of the plate, and a connection partition wall configured to interconnect the first partition wall and the second partition wall to partition the peripheral portion of the plate into a plurality of peripheral areas.

Abstract: Disclosed are an electrostatic chuck capable of preventing deformation of a bonding layer and damage to a lift pin, a method of manufacturing the electrostatic chuck, and a plasma processing apparatus. The electrostatic chuck configured to support a substrate and to receive a lift pin so that the lift pin is ascendable and descendable therein includes at least one pin hole formed vertically therethrough to allow the lift pin to ascend and descend along the pin hole, a ceramic puck configured to allow the substrate to be seated thereon, a base plate configured to support the ceramic puck, a bonding layer configured to bond the ceramic puck to the base plate, and an insulating pipe mounted on an inner side wall of the pin hole. The insulating pipe includes an upper insulating pipe bonded to the ceramic puck and a lower insulating pipe adhered to the base plate.

Abstract: An electrostatic chuck of the present invention includes a top block and a bottom block bonded by a bonding layer. The top block has a first plate on which a chucking electrode and a heater are installed, and the bottom block is provided with a cooling member. A second plate made of a material having lower heat transfer rate than the first plate is disposed between the first plate and the bottom block. Accordingly, when the heater is heated at a high temperature, it is possible to prevent the bonding layer from being damaged by thermal impact.