Abstract: A mail paper sealing apparatus is provided. The apparatus includes an input part, a compression roller part, a driving unit, and a convey accelerator. The input part supplies a mail paper. The compression roller part seals the folded mail paper conveyed from the input part. The driving unit generates a rotary force. The convey accelerator is provided between the input part and the compression roller part and adds a rotation frictional force to a top surface of one side of the mail paper in a convey direction.

Abstract: Disclosed herein is a linear compressor wherein a compression unit, including a cylinder and a linear motor, is supported by a frame mounted in a hermetic container. The frame is die cast using diamagnetic zinc having a high forming accuracy, thereby preventing an electromagnetic force of the linear motor from being leaked therethrough, and enabling a reduction in the number of machining times thereof after die casting.

Abstract: Disclosed herein is a linear compressor, which is designed in such a fashion that oil is suctioned into a space between a cylinder and a piston by a low pressure produced between the cylinder and the piston when the piston moves backward, and then is discharged to the outside by a high pressure produced between the cylinder and the piston when the piston moves forward, resulting in a simplified oil pumping structure and low cost.

Abstract: A mail paper sealing apparatus is provided. The apparatus includes an input part, a compression roller part, a driving unit, and a convey accelerator. The input part supplies a mail paper. The compression roller part seals the folded mail paper conveyed from the input part. The driving unit generates a rotary force. The convey accelerator is provided between the input part and the compression roller part and adds a rotation frictional force to a top surface of one side of the mail paper in a convey direction.

Abstract: The present invention relates to a linear compressor compressing a working fluid in the cylinder such as a refrigerant and etc with the reciprocating movement of the piston in the cylinder due to the reciprocating force of the linear motor, and provides a linear compressor and the supporter for the same that the change of the lateral resonance frequency due to the lateral stiffness of the piston spring is easy as having a stub or a narrow part on the supporter preventing the increase of the mass inertia moment compared with the distance between the centroid of the supporter and the center of the piston spring sat on the supporter arm of the supporter, and capable of reducing the entire size and the manufacturing costs as raising the lateral resonance frequency easily without extending the length of the supporter arm.

Abstract: A linear compressor for multi-compression includes a stationary cylinder, a moving piston, and a stationary piston. The stationary cylinder has a first compression chamber formed therein. The stationary cylinder is provided at one side thereof with an outlet part. The moving piston is movable forward and backward by a linear motor, that compresses a fluid in the first compression chamber. The moving piston has a second compression chamber formed and is provided, at the position where the second compression chamber communicates with the first compression chamber, with a first valve. The stationary piston is fixedly disposed in the compressor. The stationary piston is fitted in the moving piston so that the fluid in the second compression chamber is compressed as the moving piston is reciprocated.

Abstract: A reciprocating compressor includes a reciprocating motor that generates a reciprocation force and a compressing unit to which a discharge pipe that discharges a compressed fluid is connected. The compressing unit compresses a fluid by receiving the reciprocation force generated by the reciprocating motor. A frame, to which the reciprocating motor and the compressing unit are fixed, is connected to a suction pipe that sucks a fluid to be compressed at one side thereof, and that contains lubricating oil therein.

Abstract: A method for fabricating a semiconductor device and forming an insulating film used therein, includes forming an isolation insulating film on a semiconductor wafer and forming gates, separated by gaps having a predetermined distance, on an active region. Next, a first interlayer dielectric film is deposited to a predetermined thickness on the semiconductor wafer having the gates, so that the gaps between the gates are not completely filled. Then, a sputtering etch is performed entirely on a surface of the first interlayer dielectric film. Thereafter, the first interlayer dielectric film is partially removed through isotropic etching. Next, a second interlayer dielectric film is deposited on the first interlayer dielectric film so that the gaps between the gates are completely filled.

Abstract: A linear compressor for multi-compression includes a stationary cylinder, a moving piston, and a stationary piston. The stationary cylinder has a first compression chamber formed therein. The stationary cylinder is provided at one side thereof with an outlet part. The moving piston is movable forward and backward by a linear motor, that compresses a fluid in the first compression chamber. The moving piston has a second compression chamber formed and is provided, at the .position where the second compression chamber communicates with the first compression chamber, with a first valve. The stationary piston is fixedly disposed in the compressor. The stationary piston is fitted in the moving piston so that the fluid in the second compression chamber is compressed as the moving piston is reciprocated.

Abstract: A method for fabricating a semiconductor device and forming an insulating film used therein, includes forming an isolation insulating film on a semiconductor wafer and forming gates, separated by gaps having a predetermined distance, on an active region. Next, a first interlayer dielectric film is deposited to a predetermined thickness on the semiconductor wafer having the gates, so that the gaps between the gates are not completely filled. Then, a sputtering etch is performed entirely on a surface of the first interlayer dielectric film. Thereafter, the first interlayer dielectric film is partially removed through isotropic etching. Next, a second interlayer dielectric film is deposited on the first interlayer dielectric film so that the gaps between the gates are completely filled.

Abstract: A method for fabricating a semiconductor device and forming an insulating film used therein, includes forming an isolation insulating film on a semiconductor wafer and forming gates, separated by gaps having a predetermined distance, on an active region. Next, a first interlayer dielectric film is deposited to a predetermined thickness on the semiconductor wafer having the gates, so that the gaps between the gates are not completely filled. Then, a sputtering etch is performed entirely on a surface of the first interlayer dielectric film. Thereafter, the first interlayer dielectric film is partially removed through isotropic etching. Next, a second interlayer dielectric film is deposited on the first interlayer dielectric film so that the gaps between the gates are completely filled.

Abstract: A method for fabricating a semiconductor device and forming an insulating film used therein, includes forming an isolation insulating film on a semiconductor wafer and forming gates, separated by gaps having a predetermined distance, on an active region. Next, a first interlayer dielectric film is deposited to a predetermined thickness on the semiconductor wafer having the gates, so that the gaps between the gates are not completely filled. Then, a sputtering etch is performed entirely on a surface of the first interlayer dielectric film. Thereafter, the first interlayer dielectric film is partially removed through isotropic etching. Next, a second interlayer dielectric film is deposited on the first interlayer dielectric film so that the gaps between the gates are completely filled.