Abstract: The present disclosure relates to a novel anti-HER2 antibody or an antigen-binding fragment thereof used in the prevention or treatment of cancer, a chimeric antigen receptor including the same, and uses thereof. The antibody of the present disclosure is an antibody that specifically binds to HER2 which is highly expressed in cancer cells (particularly, breast cancer or gastric cancer cells), and binds to an epitope that is different from an epitope to which trastuzumab binds.

Abstract: A semiconductor device includes: a semiconductor device, comprising: a bit line structure including a bit line contact plug, a bit line, and a bit line hard mask that are sequentially stacked over a substrate; a storage node contact plug that is spaced apart from the bit line structure; a conformal spacer that is positioned between the bit line and the storage node contact plug and includes a low-k material; and a seed liner that is positioned between the conformal spacer and the bit line and thinner than the conformal spacer.

Abstract: An organic light emitting device including: a substrate; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode and including an emission layer, wherein one of the first electrode and the second electrode is a reflective electrode and the other is a semitransparent or transparent electrode, and wherein the organic layer includes a layer having at least one of the compounds having at least one carbazole group, and a flat panel display device including the organic light emitting device. The organic light emitting device has low driving voltage, excellent current density, high brightness, excellent color purity, high efficiency, and long lifetime.

Abstract: Disclosed are a separator for fuel cells capable of minimizing the volume of a system and the use of sealants, and a stack for fuel cells, more particularly, a stack for solid oxide fuel cells, including the same. Specifically, by adding a metal sheet having a specific shape, position and size to the separator, the stress applied to the sealant can be uniformized, and thus the oxidizing agent and fuel can be separated and electrically isolated using only a piece of sealant. Therefore, the stack for fuel cells is characterized in that there is no variation in temperature, reactant concentration, power, or the like between respective unit cells, so delamination and microcracks do not occur, the volume is minimized, and the power density per unit volume is very high.

Abstract: Provided is a manufacturing method of a stainless steel sheet having etching patterns. The method includes: coating a coating composition on a stainless steel sheet to form a coating layer; and forming a matte coated film layer, having an etching effect, on the coating layer. The coating composition comprises: 10 to 30 wt% of a silane-based compound, 0.5 to 6 wt% of an organic acid, 0.1 to 3 wt% of a vanadium compound, 0.1 to 3 wt% of a magnesium compound, and a remainder of a solvent.

Abstract: Disclosed is a shark fin antenna for a vehicle. The shark fin antenna has a pad and a base disposed on the pad to provide a space for a printed circuit board and a plurality of antenna components. The shark fin antenna includes a holder having a groove therein for exposing at least a portion of an upper surface of a printed circuit board, a first antenna unit supported by the holder and having an antenna pattern formed on a surface thereof to receive an AM/FM frequency band signal, a first auxiliary unit covering at least a portion of an upper surface of the first antenna unit, and a spring mounted in the groove to elastically support the first auxiliary unit and the first antenna unit in a vertical direction of the upper surface of the printed circuit board.

Abstract: Disclosed is a shark fin antenna for a vehicle. The shark fin antenna has a pad and a base disposed on the pad to provide a space for a printed circuit board and a plurality of antenna components. The shark fin antenna includes a holder having a groove therein for exposing at least a portion of an upper surface of a printed circuit board, a first antenna unit supported by the holder and having an antenna pattern formed on a surface thereof to receive an AM/FM frequency band signal, a first auxiliary unit covering at least a portion of an upper surface of the first antenna unit, and a spring mounted in the groove to elastically support the first auxiliary unit and the first antenna unit in a vertical direction of the upper surface of the printed circuit board.

Abstract: Provided is a coating composition having excellent corrosion resistance and fingerprint resistance, and also provides a stainless steel sheet having etching patterns and a manufacturing method therefor, the stainless steel sheet comprising: a stainless steel sheet; a coating layer, which is formed on the stainless steel sheet and is a cured product of the coating composition; and a quenching coated film layer formed on the coating layer and having a quenching effect, wherein: the coating layer, formed by curing the coating composition having excellent corrosion resistance and fingerprint resistance, is transparent and has high gloss, thereby having an effect of enabling the surface characteristics of the stainless steel sheet to be expressed as they are; the stainless steel sheet having etching patterns has excellent corrosion resistance and fingerprint resistance even on the parts thereof on which the etching patterns are not formed.

Abstract: A method of manufacturing a transparent pattern printed steel plate includes forming a printed paint film layer by jetting transparent ink onto at least one surface of a steel plate, and curing the printed paint film layer with ultraviolet light to form a cured printed paint film layer. Further, a method of manufacturing a transparent pattern printed steel plate includes preparing a steel plate having a color painted film layer formed on at least one surface thereof, forming a printed paint film layer by jetting transparent ink onto the color painted film layer, and curing the printed paint film layer to form a cured printed paint film layer.

Abstract: A semiconductor package having improved performance and reliability and a method of fabricating the same are provided. The semiconductor package includes a processing chip including a first pin at a first side to output a first signal, and a second pin at a second side to output a second signal different from the first signal, and a substrate having the processing chip thereon, the substrate including a first bump ball electrically connected to the first pin and a second bump ball electrically connected to the second pin, wherein the first bump ball and the second bump ball are adjacent at one of the first and second sides of the substrate.

Abstract: A method of manufacturing a transparent pattern printed steel plate includes forming a printed paint film layer by jetting transparent ink onto at least one surface of a steel plate, and curing the printed paint film layer with ultraviolet light to form a cured printed paint film layer. Further, a method of manufacturing a transparent pattern printed steel plate includes preparing a steel plate having a color painted film layer formed on at least one surface thereof, forming a printed paint film layer by jetting transparent ink onto the color painted film layer, and curing the printed paint film layer to form a cured printed paint film layer.

Abstract: A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package.

Abstract: Provided is a semiconductor package stack structure. The semiconductor package stack structure includes a lower semiconductor package, an interposer substrate disposed on the lower semiconductor package and having a horizontal width greater than a horizontal width of the lower semiconductor package, an upper semiconductor package disposed on the interposer substrate, and underfill portions filling a space between the lower semiconductor package and the interposer substrate and surround side surfaces of the lower semiconductor package.

Abstract: Provided is a semiconductor package stack structure. The semiconductor package stack structure includes a lower semiconductor package, an interposer substrate disposed on the lower semiconductor package and having a horizontal width greater than a horizontal width of the lower semiconductor package, an upper semiconductor package disposed on the interposer substrate, and underfill portions filling a space between the lower semiconductor package and the interposer substrate and surround side surfaces of the lower semiconductor package.

Abstract: In a semiconductor assembly having stacked elements, discrete bumps made of a polymer such as an electrically nonconductive epoxy are interposed between the upper surface of a substrate and the lower surface of the overhanging part of an elevated element (die or package) with the discrete bump directly under bond sites on the elevated element.

Abstract: Provided is a detecting method of abnormality of a machine tool operation, and the detecting method includes a preparing step S100; a reference waveform obtaining step S200 of measuring a drive voltage and a drive current, while machining the material in a normal state of the machine tool, and obtaining a reference waveform; a monitoring section setting step S300 of setting a monitoring section and thus automatically calculating a maximum load value and a minimum load value; a permissible limit setting step S400 of setting maximum and minimum permissible limits; and a monitoring step S500 of obtaining a machining load generated and determining whether a difference between maximum and minimum load values of the machining load is out of the maximum or minimum permissive limit and then outputting normality or abnormality thereof.

Abstract: A flip-chip semiconductor package is provided that includes a semiconductor chip, a package substrate having a chip attachment surface on which bond sites are formed, and bumps attached to an active surface of the semiconductor chip and bonded to the bond sites, wherein the bond sites are radially arranged around a middle portion of the package substrate.

Abstract: A semiconductor package having improved performance and reliability and a method of fabricating the same are provided. The semiconductor package includes a processing chip including a first pin at a first side to output a first signal, and a second pin at a second side to output a second signal different from the first signal, and a substrate having the processing chip thereon, the substrate including a first bump ball electrically connected to the first pin and a second bump ball electrically connected to the second pin, wherein the first bump ball and the second bump ball are adjacent at one of the first and second sides of the substrate.

Abstract: A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package.

Abstract: A semiconductor package system, and method of manufacturing thereof, includes: an electrical substrate having a contact pad; a support structure having a lead finger thereon; a bump on the lead finger, the bump clamped on a top and a side of the lead finger and connected with the contact pad; and an encapsulant over the lead finger and the electrical substrate.