Abstract: An integrated circuit memory device includes a plurality of row selection transistors and a dummy row selection transistor, on a substrate. A plurality of word lines and a plurality of dummy word lines are also provided on the substrate. A plurality of memory cells are provided, which are electrically connected to corresponding ones of the plurality of word lines. A plurality of dummy memory cells are provided, which are electrically connected to corresponding ones of the plurality of dummy word lines. A first wiring structure is provided, which electrically connects a first one of the plurality of word lines to a first one of the plurality of row selection transistors, and a second wiring structure is provided, which electrically connects the plurality of dummy word lines together and to the dummy row selection transistor.

Abstract: An integrated circuit memory device includes a plurality of row selection transistors and a dummy row selection transistor, on a substrate. A plurality of word lines and a plurality of dummy word lines are also provided on the substrate. A plurality of memory cells are provided, which are electrically connected to corresponding ones of the plurality of word lines. A plurality of dummy memory cells are provided, which are electrically connected to corresponding ones of the plurality of dummy word lines. A first wiring structure is provided, which electrically connects a first one of the plurality of word lines to a first one of the plurality of row selection transistors, and a second wiring structure is provided, which electrically connects the plurality of dummy word lines together and to the dummy row selection transistor.

Abstract: Disclosed is an LED illumination device of a simple configuration, capable of suppressing thermal resistance to a low level, and of effectively dissipating heat generated from LED elements. Rigidity of a mounting plate is ensured by a wall of a certain height, and thereby the mounting plate now becomes possible to endure saturation vapor pressure of a coolant liquid possibly exerted thereon, and vacuum state or near-vacuum state when the coolant liquid is injected, without being deformed. Since the rigidity of the mounting plate is ensured by the wall, a wall composing a bottom face of recesses may now be thinned, and this is advantageous in view of allowing the heat generated from the LED elements to effectively conduct to the coolant liquid, and of effectively cooling the LED elements.

Abstract: Disclosed is an LED illumination device of a simple configuration, capable of suppressing thermal resistance to a low level, and of effectively dissipating heat generated from LED elements. Rigidity of a mounting plate is ensured by a wall of a certain height, and thereby the mounting plate now becomes possible to endure saturation vapor pressure of a coolant liquid possibly exerted thereon, and vacuum state or near-vacuum state when the coolant liquid is injected, without being deformed. Since the rigidity of the mounting plate is ensured by the wall, a wall composing a bottom face of recesses may now be thinned, and this is advantageous in view of allowing the heat generated from the LED elements to effectively conduct to the coolant liquid, and of effectively cooling the LED elements.

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.