Abstract: A smart nasometer according to an embodiment of the present invention includes: a hardware unit worn on a head of a user for measuring nasal and oral sounds and providing feedback for the user; and a computational unit for receiving and processing speech signals of the nasal and oral sounds measured by the hardware unit, wherein the hardware unit includes: a microphone unit for separately measuring the nasal and oral sounds in a non-touched state of the user's philtrum, wherein the computational unit includes: a nasalance adjustment unit for adjusting a nasalance of the nasal and oral sounds measured by the microphone unit.

Abstract: A smart nasometer according to an embodiment of the present invention includes: a hardware unit for mesmartasuring and feedbacking nasal and oral sounds worn by the user; and a computational unit for receiving a speech signal measured by the hardware unit and performing processing, wherein the hardware unit includes: a microphone unit for separating and measuring the nasal and oral speech signals in a non-touched state of the user's philtrum, wherein the operation unit includes: a nasalance adjustment unit for adjusting a nasalance of the speech signal measured by the microphone unit.

Abstract: The present invention relates to a guiding needle for a suction tube, which is for increasing accuracy and preventing medical accidents by enabling an operator to accurately recognize the bent direction of the needle and to stably hold the needle by means of a handle portion formed inside the rear end of the needle connected to a tube or by means of a separate fixing handle coupled to the inside of the rear end of the needle. In other words, the present invention relates to a needle having the rear end thereof coupled to one end of a tube connected to a drainage container for discharging body blood of a patient, wherein the needle has a coupling part formed inside the rear end thereof and comprises a fixing handle detachably coupled to the coupling part.

Abstract: The present invention features a steel-base sintering alloy having a high wear-resistance for a valve seat of an engine. In preferred embodiments, the steel-base sintering alloy may include a chief element of Ferrum (Fe); and a powder-alloy which are composed of Carbon (C) of 0.6˜1.2 wt %, Nickel (Ni) of 1.0˜3.0 wt %, Cobalt (Co) of 15.0˜25.0 wt %, Chrome (Cr) of 3.0˜9.0 wt %, Molybdenum (Mo) of 8.0˜15.0 wt %, Tungsten (W) of 1.0˜4.0 wt %, Manganese (Mn) of 0.5˜2.0 wt %, and Calcium (Ca) of 0.1˜0.5 wt %.

Abstract: Provided are a chemical mechanical polishing (CMP) composition used for polishing a semiconductor device which contains polysilicon film and insulator, and a chemical mechanical polishing method thereof. The CMP composition is especially useful in a isolation CMP process for semiconductor devices. Provided is a highly selective CMP composition containing a polysilicon polish finisher which can selectively polish semiconductor insulators since it uses a polysilicon film as a polish finishing film.

Abstract: Disclosed is a chemical-mechanical polishing composition used in a process for chemical-mechanical polishing of silicon oxide layer having severe unevenness with large step-height. The composition includes abrasive particles of metal oxide; and at least one compound(s) selected from the group consisting of amino alcohols, hydroxycarboxylic acid having at least 3 of the total number of carboxylic acid group(s) and hydroxyl group(s) or their salts, or a mixture thereof. A polymeric organic acid, a preservative, a lubricant and a surfactant may be further contained. The composition shortens the vapor-deposition time of a layer to be polished, saves the raw material to be vapor-deposited, shortens the chemical-mechanical polishing time, and saves the slurry employed.

Abstract: The present invention relates to a novel slurry composition for copper polishing, comprising zeolite which is a porous crystalline material for CMP of copper film in a semiconductor manufacturing process. The slurry composition according to the present invention comprises zeolite, an oxidant and a polish promoting agent and may further comprise a corrosion inhibitor, a surfactant, an aminoalcohol, an antiseptic and a dispersion agent and pH is in a range of 1 to 7. The zeolite slurry according to the present invention has advantages of absorbing and removing metal cation generated in CMP process by using zeolite and having a low level of scratches as the zeolite has micropores therein and thus its hardness is low. The slurry composition using zeolite of the present invention is usable to both first and second step polishing of copper damascene process and particularly useful as the first step polishing slurry for copper.

Abstract: To manufacture a flange for a compressor with a relief groove by using powder metallurgy in order to prevent deformation of the compressor in operation, powder material for the flange is charged into a mold; an ablative member having a melting point lower than that of the powder material is positioned at a place where a relief groove is to be formed; the flange is formed by compressing the powder material and the ablative member; and the formed flange is sintered at a temperature between the melting points of the power material and the ablative member so as to melt and remove the ablative member.

Abstract: To manufacture a flange for a compressor with a relief groove by using powder metallurgy in order to prevent deformation of the compressor in operation, powder material for the flange is charged into a mold; an ablative member having a melting point lower than that of the powder material is positioned at a place where a relief groove is to be formed; the flange is formed by compressing the powder material and the ablative member; and the formed flange is sintered at a temperature between the melting points of the power material and the ablative member so as to melt and remove the ablative member.