Abstract: A touch panel is provided. The touch panel includes a window, a sensor layer formed on a visible area of the window and comprising sensor patterns for detecting an input, a light shielding layer formed on a non-visible area of the window located around the sensor layer, wiring electrodes formed on the light shielding layer and connected to the sensor patterns such that the sensor layer is connected to an external connector, and etching masks formed on the wiring electrodes, respectively.

Abstract: A method for fabricating a touch panel, a touch panel, and an electronic device having the touch panel are provided. The touch panel includes a window member including a view area and a bezel area surrounding the view area, a sensor layer formed in the view area on a surface of the window member and including a sensor pattern for detecting a user input, a light blocking layer formed in the bezel area on the surface of the window member, a wiring layer formed on a surface of the light blocking layer and connected to the sensor pattern, and a barrier layer formed on the surface of the light blocking layer or a surface of the wiring layer.

Abstract: A method for fabricating a touch panel, a touch panel, and an electronic device having the touch panel are provided. The touch panel includes a window member including a view area and a bezel area surrounding the view area, a sensor layer formed in the view area on a surface of the window member and including a sensor pattern for detecting a user input, a light blocking layer formed in the bezel area on the surface of the window member, a wiring layer formed on a surface of the light blocking layer and connected to the sensor pattern, and a barrier layer formed on the surface of the light blocking layer or a surface of the wiring layer.

Abstract: A touch panel is provided. The touch panel includes a window, a sensor layer formed on a visible area of the window and comprising sensor patterns for detecting an input, a light shielding layer formed on a non-visible area of the window located around the sensor layer, wiring electrodes formed on the light shielding layer and connected to the sensor patterns such that the sensor layer is connected to an external connector, and etching masks formed on the wiring electrodes, respectively.

Abstract: A multi-chip semiconductor device capable of selectively activating and deactivating the individual semiconductor chips of the device and a chip enable method thereof are included. The individual semiconductor chips of the device are activated and deactivated in accordance with internal chip enable signals.

Abstract: A multi-chip semiconductor device capable of selectively activating and deactivating the individual semiconductor chips of the device and a chip enable method thereof are provided. The individual semiconductor chips of the device are activated and deactivated in accordance with internal chip enable signals.

Abstract: A multi-chip semiconductor device capable of selectively activating and deactivating the individual semiconductor chips of the device and a chip enable method thereof are provided. The individual semiconductor chips of the device are activated and deactivated in accordance with internal chip enable signals.

Abstract: A multi-chip semiconductor device capable of selectively activating and deactivating the individual semiconductor chips of the device and a chip enable method thereof are provided. The individual semiconductor chips of the device are activated and deactivated in accordance with internal chip enable signals.

Abstract: A multi-chip semiconductor device capable of selectively activating and deactivating the individual semiconductor chips of the device and a chip enable method thereof are included. The individual semiconductor chips of the device are activated and deactivated in accordance with internal chip enable signals.

Abstract: A multi-chip semiconductor device capable of selectively activating and deactivating the individual semiconductor chips of the device and a chip enable method thereof are provided. The individual semiconductor chips of the device are activated and deactivated in accordance with internal chip enable signals.