Patents by Inventor JongVin Park

JongVin Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with shielding spacer and method of manufacture thereof
    Patent number: 8569870
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a bottom integrated circuit over the substrate; connecting a bottom interconnect between the bottom integrated circuit and the substrate; and mounting a bottom shield-spacer above the bottom integrated circuit and the bottom shield-spacer includes a bottom shield plate above the bottom integrated circuit, a bottom shield pillar extending from a bottom shield foot and connected to the bottom shield plate, and a protuberance extending vertically above the bottom shield pillar and directly above the bottom shield foot.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: October 29, 2013
    Assignee: Stats Chippac Ltd.
    Inventors: SinJae Lee, JongVin Park, Sung Jun Yoon, JiHoon Oh
  • Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof
    Patent number: 8310038
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package carrier; mounting an integrated circuit device to the package carrier; mounting an embeddable conductive structure, having a non-horizontal portion between a lower portion and an elevated portion and a hole, to the integrated circuit device with the lower portion over the integrated circuit device; mounting an interposer to the lower portion and below the elevated portion; and forming an encapsulation having a recess exposing the interposer and the elevated portion.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: November 13, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: JinGwan Kim, KyuWon Lee, JiHoon Oh, JongVin Park
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CONDUCTIVE STRUCTURE AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20120241967
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package carrier; mounting an integrated circuit device to the package carrier; mounting an embeddable conductive structure, having a non-horizontal portion between a lower portion and an elevated portion and a hole, to the integrated circuit device with the lower portion over the integrated circuit device; mounting an interposer to the lower portion and below the elevated portion; and forming an encapsulation having a recess exposing the interposer and the elevated portion.
    Type: Application
    Filed: March 23, 2011
    Publication date: September 27, 2012
    Inventors: JinGwan Kim, KyuWon Lee, JiHoon Oh, JongVin Park
  • Integrated circuit package stacking system
    Patent number: 8004093
    Abstract: An integrated circuit package stacking system includes: forming a flexible substrate by: providing an insulating material, forming a stacking pad on the insulating material, forming a coupling pad on the insulating material, and forming a trace between the stacking pad and the coupling pad; providing a package substrate; coupling an integrated circuit to the package substrate; and applying a conductive adhesive on the package substrate for positioning the flexible substrate over the integrated circuit and coupling the flexible substrate on the conductive adhesive.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: August 23, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: JiHoon Oh, JinGwan Kim, Jaehyun Lim, SunYoung Chun, KyuWon Lee, SinJae Lee, JongVin Park
  • Package-on-package system with heat spreader
    Patent number: 7683469
    Abstract: A package-on-package system includes: providing a base substrate; mounting an integrated circuit on the base substrate; positioning a stacking interposer over the integrated circuit; and forming a heat spreader base around the integrated circuit by coupling the base substrate and the stacking interposer to the heat spreader base.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: March 23, 2010
    Assignee: Stats Chippac Ltd.
    Inventors: JiHoon Oh, KyuWon Lee, Jaehyun Lim, JongVin Park, SinJae Lee
  • INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM
    Publication number: 20100025835
    Abstract: An integrated circuit package stacking system includes: forming a flexible substrate by: providing an insulating material, forming a stacking pad on the insulating material, forming a coupling pad on the insulating material, and forming a trace between the stacking pad and the coupling pad; providing a package substrate; coupling an integrated circuit to the package substrate; and applying a conductive adhesive on the package substrate for positioning the flexible substrate over the integrated circuit and coupling the flexible substrate on the conductive adhesive.
    Type: Application
    Filed: August 1, 2008
    Publication date: February 4, 2010
    Inventors: JiHoon Oh, JinGwan Kim, Jaehyun Lim, SunYoung Chun, KyuWon Lee, SinJae Lee, JongVin Park
  • PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER
    Publication number: 20090294941
    Abstract: A package-on-package system includes: providing a base substrate; mounting an integrated circuit on the base substrate; positioning a stacking interposer over the integrated circuit; and forming a heat spreader base around the integrated circuit by coupling the base substrate and the stacking interposer to the heat spreader base.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 3, 2009
    Inventors: JiHoon Oh, KyuWon Lee, Jaehyun Lim, JongVin Park, SinJae Lee