Patents by Inventor Jong Yeon Kim
Jong Yeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240142826Abstract: Disclosed is a display device having a thin film transistor substrate, which may prevent afterimage and flicker defects by reducing the non-uniformity of an electric field. In the thin film transistor substrate, a pixel electrode includes a transparent edge electrode and a transparent inner electrode, which are spaced apart from each other with a first slit having a first width interposed therebetween, and a common electrode is exposed from the other-side end of the transparent edge electrode by a second width, which is smaller than the first width, in the width direction of a data line. As such, an inner area and an edge area in each sub pixel have uniform electric field distribution.Type: ApplicationFiled: January 8, 2024Publication date: May 2, 2024Inventors: Do-Yeon Kim, Byung-Sam Min, Jong-Hyun KIm
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Patent number: 11969397Abstract: The present invention relates to a composition for preventing or treating transplantation rejection or a transplantation rejection disease, comprising a novel compound and a calcineurin inhibitor. A co-administration of the present invention 1) reduces the activity of pathogenic Th1 cells or Th17 cells, 2) increases the activity of Treg cells, 3) has an inhibitory effect against side effects, such as tissue damage, occurring in the sole administration thereof, 4) inhibits various pathogenic pathways, 5) inhibits the cell death of inflammatory cells, and 6) increases the activity of mitochondria, in an in vivo or in vitro allogenic model, a transplantation rejection disease model, a skin transplantation model, and a liver-transplanted patient, and thus inhibits transplantation rejection along with mitigating side effects possibly occurring in the administration of a conventional immunosuppressant alone.Type: GrantFiled: November 7, 2019Date of Patent: April 30, 2024Assignee: THE CATHOLIC UNIVERSITY OF KOREA INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Mi-La Cho, Dong-Yun Shin, Jong-Young Choi, Chul-Woo Yang, Sung-Hwan Park, Seon-Yeong Lee, Min-Jung Park, Joo-Yeon Jhun, Se-Young Kim, Hyeon-Beom Seo, Jae-Yoon Ryu, Keun-Hyung Cho
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Publication number: 20240128653Abstract: Disclosed is a meta-structure. The meta-structure includes a lower electrode, a lower insulating layer on the lower electrode, a lower metal oxide layer on the lower insulating layer, a metal layer on the lower metal oxide layer, an upper metal oxide layer on the metal layer, an upper insulating layer on the upper metal oxide layer, and antenna electrodes on the upper insulating layer.Type: ApplicationFiled: June 28, 2023Publication date: April 18, 2024Inventors: Yong Hae KIM, Chi-Sun HWANG, Joo Yeon KIM, Jaehyun MOON, Jong-Heon YANG, Kyunghee CHOI, Ji Hun CHOI
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Patent number: 11961750Abstract: A magnetic transfer apparatus includes: a magnetomotive force source providing magnetic flux, a first magnetic flux distribution circuit connected to one end of the magnetomotive force source, having a single input terminal and a plurality of output terminals, and distributing the magnetic flux, and a second magnetic flux distribution circuit connected to the other end of the magnetomotive force source, having a single output terminal and a plurality of input terminals, and collecting the distributed magnetic flux. The output terminals of the first magnetic flux distribution circuit are disposed to be adjacent to each other to form a pair with the input terminals of the second magnetic flux distribution circuit.Type: GrantFiled: November 29, 2021Date of Patent: April 16, 2024Assignee: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATIONInventors: Tae-Yeon Seong, Da-Hoon Lee, Jong-Ho Kim
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Publication number: 20240120292Abstract: A stack package includes a first die stack including first dies, a second die stack including second dies, and an insert die between the first die stack and the second die stack, wherein the insert die is thicker than each of the first and second dies.Type: ApplicationFiled: March 20, 2023Publication date: April 11, 2024Applicant: SK hynix Inc.Inventors: Jin Woong KIM, Jong Yeon KIM
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Publication number: 20240122037Abstract: A display device includes a substrate that includes a display area and a non-display area, a display element layer disposed on the display area of the substrate, an opposing substrate that faces the substrate and the display element layer, a sealing member disposed on the non-display area and that couples the substrate and the opposing substrate, and a filler disposed between the substrate and the opposing substrate. A thickness of the filler varies in the range of 60% to 400% of a thickness of the sealing member.Type: ApplicationFiled: June 21, 2023Publication date: April 11, 2024Inventors: Jae Heung HA, Jong Woo KIM, So Young OH, Woo Suk JUNG, Hee Yeon PARK, Chang Yeong SONG, Jong Kwang YUN
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Patent number: 11955262Abstract: An inductor includes a first magnetic body having a toroidal shape and having a ferrite; and a second magnetic body configured to be different from the first magnetic body and including a metal ribbon, wherein the second magnetic body includes an outer magnetic body disposed on an outer circumferential surface of the first magnetic body and an inner magnetic body disposed on an inner circumferential surface of the first magnetic body, and each of the outer magnetic body and inner magnetic body is wound in a plurality of layers in a circumferential direction of the first magnetic body.Type: GrantFiled: February 16, 2022Date of Patent: April 9, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Mi Jin Lee, Ji Yeon Song, Yu Seon Kim, Jong Wook Lim, Seok Bae, Sang Won Lee
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Publication number: 20240105656Abstract: A packaging device including bumps and a method of manufacturing the packaging device are presented. In the method of manufacturing a packaging device, a dielectric layer that covers a packaging base is formed and a lower layer is formed over a packaging base including first and second connecting pads. A plurality of dummy bumps that overlaps with the dielectric layer is formed. A sealing pattern that covers the dummy bumps, filling areas between the dummy bumps, is formed. A lower layer pattern in which the plurality of dummy bumps have been disposed is formed by removing portions of the lower layer that are exposed and do not overlap with the sealing pattern.Type: ApplicationFiled: March 20, 2023Publication date: March 28, 2024Applicant: SK hynix Inc.Inventors: Jae Jun LEE, Jong Yeon KIM, Jong Hoon KIM, Ju Heon YANG, Mi Seon LEE
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Publication number: 20240101272Abstract: The present disclosure relates to a system and method for detecting an aircraft energy anomaly using an artificial neural network learning model. A system for detecting an aircraft energy anomaly using an artificial neural network learning model according to the present disclosure includes an input interface device for receiving ADS-B (Automatic Dependent Surveillance-Broadcast) data, a memory storing a program which generates a specific energy feature for energy state analysis by extending the ADS-B data through a preprocessing, and a processor for executing the program, wherein the processor generates an energy distribution model by the use of the specific energy feature, and performs artificial neural network-based energy anomaly learning.Type: ApplicationFiled: July 10, 2023Publication date: March 28, 2024Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Noh-Sam PARK, Ji Yeon KIM, Jong Hyun JANG
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Patent number: 11935912Abstract: A display apparatus including a thin film transistor (TFT) substrate; a first LED sub-unit, a second LED sub-unit, and a third LED sub-unit; first, second, third, and fourth electrode pads disposed between the TFT substrate and the first LED sub-unit; and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first, second, and third sub-units are configured to be independently driven; light generated from the first LED sub-unit is emitted to the outside of the display apparatus by passing through the second and third LED sub-units; light generated from the second LED sub-unit is emitted to the outside of the display apparatus by passing through the third LED sub-unit; and at least one of the connectors includes a first portion electrically connecting a first surface of the first LED sub-unit to the second electrode pad.Type: GrantFiled: June 22, 2022Date of Patent: March 19, 2024Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Hyeon Chae, Seong Gyu Jang, Ho Joon Lee, Chang Yeon Kim, Chung Hoon Lee
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Publication number: 20240084259Abstract: The present invention relates to stem cell-derived mature cardiomyocytes and a cardiovascular disease model using same and, more specifically, to differentiation into mature ventricular cardiomyocytes by culturing stem cells in a medium containing FGF4 and ascorbic acid, and use of the differentiated mature ventricular cardiomyocytes as a cardiovascular disease cell model. The mature ventricular cardiomyocytes, obtained by culturing stem cells in a medium containing FGF4 and ascorbic acid and inducing the differentiation thereof, and cardiovascular disease cell model using same according to the present invention are very useful for screening for cardiovascular disease therapeutic agents and evaluation of the toxicity of new drugs.Type: ApplicationFiled: November 13, 2019Publication date: March 14, 2024Applicant: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATIONInventors: Do-Sun LIM, Seung Cheol CHOI, Hyung Joon JOO, Jong-Ho KIM, Chi-Yeon PARK, Yongdoo PARK
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Publication number: 20240088197Abstract: A light emitting chip including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a first bonding layer interposed between the first and second LED sub-units, a second bonding layer interposed between second and third LED sub-units, and a first connection electrode electrically connected to and overlapping at least one of the first, second, and third LED sub-units, the first connection electrode having first and second opposing side surfaces, the first side surface having a first length and the second side surface having a second length, in which the difference in length between the first side surface and the second side surface of the first connection electrode is greater than a thickness of at least one of the LED sub-units.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Applicant: Seoul Viosys Co., Ltd.Inventors: Jong Min JANG, Chang Yeon KIM, Myoung Hak YANG
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Patent number: 11929262Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.Type: GrantFiled: April 10, 2023Date of Patent: March 12, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae-in Won, Jong-kak Jang, Dong-woo Kang, Do-yeon Kim
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Patent number: 10690709Abstract: A ground electrode (100) positioned in the earth and a monitoring device (200) configured to measure a current and resistance of a ground line, where the monitoring device (200) includes a ground current sensing unit (210) configured to measure the current of the ground line, a resistance sensing unit (220) configured to measure ground resistance of the earth and an earth resistance rate, a voltage sensing unit (230) configured to check a voltage value of commercial power, a temperature and humidity sensing unit (240) configured to check a surrounding temperature and humidity of the monitoring device (200), and a monitoring unit (250) configured to confirm whether the ground current, ground resistance and earth resistance measured are abnormal values by compared with reference values classified based on the temperature and humidity measured.Type: GrantFiled: June 7, 2017Date of Patent: June 23, 2020Assignee: SUNKWANG LIGHTNING PROTECTION TECHNICAL INSTITUTE INC.Inventors: Dong-Jin Kim, Jong-Yeon Kim, Wan-Seong Kwon, Dong-Min Kim, Yong-Su Kim, Byeong-U Kim
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Publication number: 20190219620Abstract: A ground electrode (100) positioned in the earth and a monitoring device (200) configured to measure a current and resistance of a ground line, where the monitoring device (200) includes a ground current sensing unit (210) configured to measure the current of the ground line, a resistance sensing unit (220) configured to measure ground resistance of the earth and an earth resistance rate, a voltage sensing unit (230) configured to check a voltage value of commercial power, a temperature and humidity sensing unit (240) configured to check a surrounding temperature and humidity of the monitoring device (200), and a monitoring unit (250) configured to confirm whether the ground current, ground resistance and earth resistance measured are abnormal values by compared with reference values classified based on the temperature and humidity measured.Type: ApplicationFiled: June 7, 2017Publication date: July 18, 2019Applicant: SUNKWANG LIGHTING PROTECTION TECHNICAL INSTITUTE INC.Inventors: Dong-Jin KIM, Jong-Yeon KIM, Wan-Seong KWON, Dong-Min KIM, Yong-Su KIM, Byeong-U KIM
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Patent number: 9590418Abstract: An apparatus for checking damage to a surge protector and automatically changing a surge protector includes a casing, a current inflow unit supplied with an external current, a current discharge unit configured to supply an inflow current to an external electronic device, surge protectors placed between the current inflow unit and the current discharge unit in parallel, selectively connected to the current inflow unit, and supplied with an electric current, a relay placed between the current inflow unit and the surge protectors and configured to selectively connect the surge protectors to the current inflow unit, and a surge protector damage check unit configured to check whether a surge protector connected to the current inflow unit has been damaged by applying a voltage between the current inflow unit and the current discharge unit.Type: GrantFiled: March 10, 2015Date of Patent: March 7, 2017Assignee: SUNKWANG LIGHTNING PROTECTION TECHNICAL INSTITUTE INC.Inventors: Dong-Jin Kim, Jong-Yeon Kim, Jin-Yeong Lee, Wan-Seong Kwon, Dong-Min Kim, Yong-Su Kim
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Publication number: 20160372919Abstract: An apparatus for checking damage to a surge protector and automatically changing a surge protector includes a casing, a current inflow unit supplied with an external current, a current discharge unit configured to supply an inflow current to an external electronic device, surge protectors placed between the current inflow unit and the current discharge unit in parallel, selectively connected to the current inflow unit, and supplied with an electric current, a relay placed between the current inflow unit and the surge protectors and configured to selectively connect the surge protectors to the current inflow unit, and a surge protector damage check unit configured to check whether a surge protector connected to the current inflow unit has been damaged by applying a voltage between the current inflow unit and the current discharge unit.Type: ApplicationFiled: March 10, 2015Publication date: December 22, 2016Inventors: Dong-Jin KIM, Jong-Yeon KIM, Jin-Yeong LEE, Wan-Seong KWON, Dong-Min KIM, Yong-Su KIM
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Patent number: 9076881Abstract: Provided are a bump structure includes a first bump and a second bump, a semiconductor package including the same, and a method of manufacturing the same. The bump structure includes: first bump provided on a connection pad of a substrate, the first bump including a plurality of nano-wires extending from the connection pad and a body connecting end portions of the plurality of nano-wires; and a second bump provided on the body of the first bump.Type: GrantFiled: February 3, 2014Date of Patent: July 7, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yun-Hyeok Im, Jong-Yeon Kim, Tae-Je Cho, Un-Byoung Kang
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Patent number: 8921918Abstract: Three-dimensional semiconductor devices may be provided. The devices may include a stack-structure including gate patterns and an insulation pattern. The stack-structure may further include a first portion and a second portion, and the second portion of the stack-structure may have a narrower width than the first portion. The devices may also include an active pattern that penetrates the stack-structure. The devices may further include a common source region adjacent the stack-structure. The devices may additionally include a strapping contact plug on the common source region.Type: GrantFiled: October 25, 2011Date of Patent: December 30, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Joo Shim, Kyoung-Hoon Kim, Woonkyung Lee, Wonseok Cho, Hoosung Cho, Jintaek Park, Jong-Yeon Kim, Sung-Min Hwang
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Patent number: 8816407Abstract: Semiconductor packages are disclosed. A semiconductor package includes: a first chip that includes a chip region and scribe regions at edges of the chip region, wherein the chip region comprises integrated circuit units and main through substrate vias electrically connected to the integrated circuit units; and a second chip that is bonded onto the first chip. The semiconductor package includes dummy conductive connectors including at least dummy wiring lines, the dummy conductive connectors electrically connected to the main through substrate vias at one end, and not capable of forming an electrical connection at the other end.Type: GrantFiled: February 13, 2013Date of Patent: August 26, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Jong-yeon Kim, Tae-hong Min, Yeong-kwon Ko, Tae-je Cho