Patents by Inventor Jong Yeon Kim

Jong Yeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250103735
    Abstract: According to one aspect of the present invention, there is provided a local data protection system including a data protection agent program installed on a local computing device, which, in accordance with a preset security policy, directs storage of data files stored on the local computing device to a security area, and performs predetermined data protection functions to prevent data in storage from being leaked, lost, stolen or otherwise compromised.
    Type: Application
    Filed: December 29, 2022
    Publication date: March 27, 2025
    Applicant: NAMUSOFT CO., LTD
    Inventors: Jong Hyun WOO, Mineui HONG, Hyo Dong KIM, Yu Seon CHOI, Bong Chan KIM, Sin Ae KIM, Young Il SHIN, Jea Yeon KIM, Jae Choon CHO, Sang Yong KIM
  • Publication number: 20250105221
    Abstract: A light emitting device including first, second, and third light emitting stacks each including first and second conductivity type semiconductor layers, a first lower contact electrode in ohmic contact with the first light emitting stack, and second and third lower contact electrodes respectively in ohmic contact with the second conductivity type semiconductor layers of the second and third light emitting stacks, in which the first lower contact electrode is disposed between the first and second light emitting stacks, the second and third lower contact electrodes are disposed between the second and third light emitting stacks, and the first, second, and third lower contact electrodes include transparent conductive oxide layers.
    Type: Application
    Filed: December 10, 2024
    Publication date: March 27, 2025
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Min JANG, Chang Yeon KIM
  • Publication number: 20250098218
    Abstract: A thin film transistor includes a first gate electrode on a substrate, a gate insulating film on the first gate electrode, a first active layer on the gate insulating film, a drain electrode on one side of the first active layer, a sidewall spacer on a side wall of the drain electrode, and a first source electrode provided on the other side of the first active layer and a sidewall of the sidewall spacer.
    Type: Application
    Filed: July 2, 2024
    Publication date: March 20, 2025
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jae-Eun PI, Seung Youl KANG, Yong Hae KIM, Joo Yeon KIM, Hee-ok KIM, Jaehyun MOON, Jong-Heon YANG, Himchan OH, Seong-Mok CHO, Ji Hun CHOI, Chi-Sun HWANG
  • Patent number: 12256619
    Abstract: A display device is provided. A display device including a plurality of light-output areas through which incident light is emitted and a light-blocking area which blocks the incident light, the display device includes a substrate, a bank layer which is disposed in the light-blocking area on the substrate and defines a plurality of openings, each of which is disposed in one of the plurality of light-output areas, and a color control pattern disposed in the opening of the bank layer, wherein the bank layer includes a first bank area which has a first thickness and defines the plurality of openings and a second bank area which is disposed between the plurality of openings and has a second thickness smaller than the first thickness.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: March 18, 2025
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seon Uk Lee, Hwa Yeul Oh, Seung Kil Yang, Song Ee Lee, Yoo Seok Jang, Jeong Ki Kim, Jong Hoon Kim, Ju Yong Kim, Ji Seong Yang, Jun Hwi Lim, Sang Yeon Hwang
  • Publication number: 20250082762
    Abstract: The present invention relates to a novel heterocyclic compound and a composition, for preventing or treating a cancer, an autoimmune disease, and an inflammatory disease, comprising same. The novel heterocyclic compound of the present invention is a bifunctional compound having a Bruton's tyrosine kinase (BTK) degradation function via a ubiquitin proteasome pathway, and may be utilized as a composition for preventing or treating a cancer, an autoimmune disease, and Parkinson's disease.
    Type: Application
    Filed: November 15, 2024
    Publication date: March 13, 2025
    Applicants: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY, UBIX THERAPEUTICS, INC.
    Inventors: Pil Ho KIM, Sung Yun CHO, Jae Du HA, Chi Hoon PARK, Jong Yeon HWANG, Hyun Jin KIM, Song Hee LEE, Ye Seul LIM, Han Wool KIM, Sun Mi YOO, Beom Seon SUH, Ji Youn PARK, Je Ho RYU, Jung Min AHN, Hee Jung MOON, Ho Hyun LEE
  • Publication number: 20250073341
    Abstract: The present invention relates to a novel heterocyclic compound and a composition, for preventing or treating a cancer, an autoimmune disease, and an inflammatory disease, comprising same. The novel heterocyclic compound of the present invention is a bifunctional compound having a Bruton's tyrosine kinase (BTK) degradation function via a ubiquitin proteasome pathway, and may be utilized as a composition for preventing or treating a cancer, an autoimmune disease, and Parkinson's disease.
    Type: Application
    Filed: November 15, 2024
    Publication date: March 6, 2025
    Applicants: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY, UBIX THERAPEUTICS, INC.
    Inventors: Pil Ho KIM, Sung Yun CHO, Jae Du HA, Chi Hoon PARK, Jong Yeon HWANG, Hyun Jin KIM, Song Hee LEE, Ye Seul LIM, Han Wool KIM, Sun Mi YOO, Beom Seon SUH, Ji Youn PARK, Je Ho RYU, Jung Min AHN, Hee Jung MOON, Ho Hyun LEE
  • Publication number: 20250070100
    Abstract: A light emitting device including a first LED sub-unit having a thickness in a first direction, a second LED sub-unit disposed on a portion of the first LED sub-unit in the first direction, each of the first and second LED sub-units comprising a first-type semiconductor layer, a second-type semiconductor layer, and an active layer, a reflective electrode disposed adjacent to the first LED sub-unit and electrically connected to the first-type semiconductor layer of the first LED sub-unit, and a first ohmic electrode forming ohmic contact with the second-type semiconductor layer of the first LED sub-unit, in which the active layer of the first LED sub-unit is configured to generate light, includes AlxGa(1-x-y)InyP (0?x?1, 0?y?1), and overlaps the active layer of the second LED sub-unit in the first direction, and the active layer of the second LED sub-unit includes the same material as the active layer of the first LED sub-unit.
    Type: Application
    Filed: November 7, 2024
    Publication date: February 27, 2025
    Applicant: Seoul Viosys Co., Ltd.
    Inventors: Jong Hyeon CHAE, Chang Yeon KIM, Ho Joon LEE, Seong Gyu JANG, Chung Hoon LEE, Dae Sung CHO
  • Publication number: 20250070108
    Abstract: The present technology relates to a reference point marking apparatus for marking reference points on a pattern electrode in which coated portions and uncoated portions are repeatedly arranged in a longitudinal direction, in which the pattern electrode includes a plurality of reserved electrode lane parts to be slit into a plurality of electrode lanes in the longitudinal direction in a subsequent process, and the reference point marking apparatus includes a moving marking machine configured to mark reference points on uncoated portions of the reserved electrode lane parts arranged in a width direction of the pattern electrode while moving in the width direction, and a controller configured to control an operation of the moving 10 marking machine. The present technology also provides a roll map generation apparatus using the reference point marking apparatus.
    Type: Application
    Filed: August 28, 2023
    Publication date: February 27, 2025
    Inventors: Jee Yeon Koh, Kyu Taek Kang, June Hee Kim, Min Kyu Sim, Jong Seok Park, Min Su Kim
  • Patent number: 12234350
    Abstract: A polyolefin thermoplastic elastomer composition for an airbag chute, includes a polypropylene, an olefin block copolymer, and a dendrimer as a material applied to a raw material of a passenger airbag chute. An olefin elastomer composite resin composition for an airbag chute includes 30-80 parts by weight of a polypropylene resin, 30-70 parts by weight of an olefin block copolymer, and 0.1-5 parts by weight of a dendrimer based on 100 parts by weight of the olefin elastomer composite resin composition. The olefin elastomer composite resin composition for an airbag chute, improves the dispersion of the elastomer by applying a high-flow elastomer and a low-flow polypropylene, and improves flowability and meltability characteristics without deteriorating physical properties by applying the dendrimer.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: February 25, 2025
    Assignee: CEPLA CO., LTD.
    Inventors: Chang Won Chae, Sung Yeon Lee, Chang Min Hong, Jong Soo Park, Jae Myung Rhee, Jin Young Huh, Kyu Haeng Cho, Dae Keun Kim, Gwang Ho Go, Poong Hyun Choi
  • Publication number: 20250055013
    Abstract: Systems and methods for manufacturing a battery are disclosed. One system may include: a first cutter configured to cut a first electrode sheet into a first electrode portion; a second cutter configured to cut a second electrode sheet into a second electrode portion having a second length; a winder configured to form an electrode assembly by winding the first electrode portion, the second electrode portion, a separator between the first electrode portion and the second electrode portion; and an identification information assigning device configured to assign identification information to the electrode assembly based on: a cut count value of the first electrode sheet and/or a cut count value of the second electrode sheet; and/or a position coordinate value of the first electrode sheet and/or a position coordinate value of the second electrode sheet.
    Type: Application
    Filed: March 15, 2024
    Publication date: February 13, 2025
    Inventors: Kyu Taek KANG, Min Su KIM, Jong Seok PARK, June Hee KIM, Min Kyu SIM, Jee Yeon KOH
  • Patent number: 12205933
    Abstract: A light emitting device including first, second, and third light emitting stacks each including first and second conductivity type semiconductor layers, a first lower contact electrode in ohmic contact with the first light emitting stack, and second and third lower contact electrodes respectively in ohmic contact with the second conductivity type semiconductor layers of the second and third light emitting stacks, in which the first lower contact electrode is disposed between the first and second light emitting stacks, the second and third lower contact electrodes are disposed between the second and third light emitting stacks, and the first, second, and third lower contact electrodes include transparent conductive oxide layers.
    Type: Grant
    Filed: August 23, 2023
    Date of Patent: January 21, 2025
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Min Jang, Chang Yeon Kim
  • Publication number: 20250023006
    Abstract: A light emitting device including a first light emitting stack, a second light emitting stack, and a third light emitting stack each including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, a first adhesive layer bonding the first light emitting stack and the second light emitting stack, and a second adhesive layer bonding the second light emitting stack and the third light emitting stack, in which the second light emitting stack is disposed between the first light emitting stack and the third light emitting stack, and one of the first adhesive layer and the second adhesive layer electrically connects adjacent light emitting stacks.
    Type: Application
    Filed: September 26, 2024
    Publication date: January 16, 2025
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Min JANG, Chang Yeon KIM
  • Publication number: 20250022869
    Abstract: A method of manufacturing a semiconductor die stack structure includes: preparing a base die including a base die substrate and a base die inter-layer dielectric layer; forming a base die front-side bonding pad structure; preparing a bottom die having a bottom die substrate and bottom die through-electrode; forming a bottom die front-side bonding pad structure in the bottom die substrate; forming a base-bottom die stack structure where the bottom die front-side bonding pad structure is directly in contact with the base die front-side; forming a base die through-electrode vertically passing through the base die substrate and electrically connected to the base die front-side bonding pad structure; forming a base die back-side bump structure electrically connected to the base die through-electrode; stacking middle dies and a top die in the base-bottom die stack structure; and forming a bottom die back-side bump structure electrically connected to the bottom die through-electrode.
    Type: Application
    Filed: December 7, 2023
    Publication date: January 16, 2025
    Applicant: SK hynix Inc.
    Inventors: Sung Kyu KIM, Jong Yeon KIM, Ki Ill MOON, Sang Yong LEE, Gyu Jei LEE
  • Publication number: 20240395746
    Abstract: In an embodiment, a semiconductor die includes a substrate, an interlayer insulating layer under a front-side surface the substrate, a horizontal metal interconnection in the interlayer insulating layer, a front-side pad under a lower surface of the interlayer insulating layer, a front-side bump structure under a lower surface of the front-side pad, a through-electrode vertically passing through the substrate, a back-side insulating layer over the back-side surface of the substrate, a first back-side metal plate layer over the back-side insulating layer, a back-side passivation layer over the back-side insulating layer and covering the first back-side metal plate layer, and a back-side bump structure over the through-electrode and the back-side passivation layer.
    Type: Application
    Filed: October 30, 2023
    Publication date: November 28, 2024
    Applicant: SK hynix Inc.
    Inventors: Jae Jun LEE, Sung Kyu KIM, Jong Yeon KIM, Ki Ill MOON, Mi Seon LEE
  • Publication number: 20240186291
    Abstract: A semiconductor die stack structure includes a base die, a plurality of semiconductor die stack units, and bumps. Each of the plurality of semiconductor die stack units includes a lower semiconductor die and an upper semiconductor die. Each of the lower semiconductor die and the upper semiconductor die includes a body and a front-side pad structure. The front-side pad structure includes a front-side pad seed layer and a front-side pad pattern. The front-side pad pattern includes a first front-side pad portion, a second front-side pad portion, and a third front-side pad portion. The first front-side pad portion and the second front-side pad portion forms a staircase. The first front-side pad portion and the third front-side pad form a reverse staircase. The first front-side pad portion, the second front-side pad portion, and the third front-side pad include a same metal.
    Type: Application
    Filed: July 3, 2023
    Publication date: June 6, 2024
    Applicant: SK hynix Inc.
    Inventors: Sung Kyu KIM, Jong Yeon KIM, Song NA, Sang Hyuk LIM, Jong Oh KWON, Jin Woo PARK
  • Publication number: 20240120292
    Abstract: A stack package includes a first die stack including first dies, a second die stack including second dies, and an insert die between the first die stack and the second die stack, wherein the insert die is thicker than each of the first and second dies.
    Type: Application
    Filed: March 20, 2023
    Publication date: April 11, 2024
    Applicant: SK hynix Inc.
    Inventors: Jin Woong KIM, Jong Yeon KIM
  • Publication number: 20240105656
    Abstract: A packaging device including bumps and a method of manufacturing the packaging device are presented. In the method of manufacturing a packaging device, a dielectric layer that covers a packaging base is formed and a lower layer is formed over a packaging base including first and second connecting pads. A plurality of dummy bumps that overlaps with the dielectric layer is formed. A sealing pattern that covers the dummy bumps, filling areas between the dummy bumps, is formed. A lower layer pattern in which the plurality of dummy bumps have been disposed is formed by removing portions of the lower layer that are exposed and do not overlap with the sealing pattern.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 28, 2024
    Applicant: SK hynix Inc.
    Inventors: Jae Jun LEE, Jong Yeon KIM, Jong Hoon KIM, Ju Heon YANG, Mi Seon LEE
  • Patent number: 10690709
    Abstract: A ground electrode (100) positioned in the earth and a monitoring device (200) configured to measure a current and resistance of a ground line, where the monitoring device (200) includes a ground current sensing unit (210) configured to measure the current of the ground line, a resistance sensing unit (220) configured to measure ground resistance of the earth and an earth resistance rate, a voltage sensing unit (230) configured to check a voltage value of commercial power, a temperature and humidity sensing unit (240) configured to check a surrounding temperature and humidity of the monitoring device (200), and a monitoring unit (250) configured to confirm whether the ground current, ground resistance and earth resistance measured are abnormal values by compared with reference values classified based on the temperature and humidity measured.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: June 23, 2020
    Assignee: SUNKWANG LIGHTNING PROTECTION TECHNICAL INSTITUTE INC.
    Inventors: Dong-Jin Kim, Jong-Yeon Kim, Wan-Seong Kwon, Dong-Min Kim, Yong-Su Kim, Byeong-U Kim
  • Publication number: 20190219620
    Abstract: A ground electrode (100) positioned in the earth and a monitoring device (200) configured to measure a current and resistance of a ground line, where the monitoring device (200) includes a ground current sensing unit (210) configured to measure the current of the ground line, a resistance sensing unit (220) configured to measure ground resistance of the earth and an earth resistance rate, a voltage sensing unit (230) configured to check a voltage value of commercial power, a temperature and humidity sensing unit (240) configured to check a surrounding temperature and humidity of the monitoring device (200), and a monitoring unit (250) configured to confirm whether the ground current, ground resistance and earth resistance measured are abnormal values by compared with reference values classified based on the temperature and humidity measured.
    Type: Application
    Filed: June 7, 2017
    Publication date: July 18, 2019
    Applicant: SUNKWANG LIGHTING PROTECTION TECHNICAL INSTITUTE INC.
    Inventors: Dong-Jin KIM, Jong-Yeon KIM, Wan-Seong KWON, Dong-Min KIM, Yong-Su KIM, Byeong-U KIM
  • Patent number: 9590418
    Abstract: An apparatus for checking damage to a surge protector and automatically changing a surge protector includes a casing, a current inflow unit supplied with an external current, a current discharge unit configured to supply an inflow current to an external electronic device, surge protectors placed between the current inflow unit and the current discharge unit in parallel, selectively connected to the current inflow unit, and supplied with an electric current, a relay placed between the current inflow unit and the surge protectors and configured to selectively connect the surge protectors to the current inflow unit, and a surge protector damage check unit configured to check whether a surge protector connected to the current inflow unit has been damaged by applying a voltage between the current inflow unit and the current discharge unit.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: March 7, 2017
    Assignee: SUNKWANG LIGHTNING PROTECTION TECHNICAL INSTITUTE INC.
    Inventors: Dong-Jin Kim, Jong-Yeon Kim, Jin-Yeong Lee, Wan-Seong Kwon, Dong-Min Kim, Yong-Su Kim