Abstract: A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

Abstract: A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly including a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

Abstract: A power electronic component including a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips mounted on a substrate above the bottom surface, and a housing enclosing the one or more power electronic semiconductor chips. The power electronic component includes a thermal insulator disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator are on the opposite sides of the one or more power electronic semiconductor chips.

Abstract: A power electronic assembly a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

Abstract: A cooling element and a method of manufacturing a cooling element. The cooling element includes a body having a surface adapted to receive a heat source, wherein the body is formed of extrusion profile having open ends. The cooling element further includes plugs attached to the open ends of the body to close the body, and a port for filling working fluid inside the closed body.

Abstract: A power electronics module and a method of producing a power electronics module. The module includes multiple of power electronic semiconductor chips incorporated in a housing, and a heat transfer structure which forms an outer surface of the module and is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a metallic structure having a soft coating.

Abstract: A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

Abstract: A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly including a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

Abstract: A power electronic component including a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips mounted on a substrate above the bottom surface, and a housing enclosing the one or more power electronic semiconductor chips. The power electronic component includes a thermal insulator disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator are on the opposite sides of the one or more power electronic semiconductor chips.

Abstract: A heatsink and a method of manufacturing a heatsink. The heatsink includes a base plate and at least one cooling fin, wherein the base plate includes a surface arranged to receive a heat source in mating connection. The heatsink base plate includes at least one heatsink insert and a heatsink body block attached together, the at least one heatsink insert having different thermal properties than the heatsink body block, and at least part of a surface of the heatsink insert is adapted to form at least a part of the surface arranged to receive the heat source in mating connection.

Abstract: A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

Abstract: A power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate, a vapour chamber having one or more condenser pipes in fluid communication with the vapour chamber, the vapour chamber and the one or more condenser pipes forming a closed volume and enclosing a working fluid, a mounting plate having an indent for receiving the vapour chamber and one or more apertures for receiving the one or more condenser pipes, wherein the power electronic module is attached to the mounting plate to transfer heat from the base plate of the power electronic module to the vapour chamber.