Patents by Inventor Jonn Ditri

Jonn Ditri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die attach process using cornercube offset tool
    Patent number: 6778274
    Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: August 17, 2004
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: David T. Beatson, Christian Hoffman, James E. Eder, Jonn Ditri
  • Die attach system and process using cornercube offset tool
    Patent number: 6705507
    Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: March 16, 2004
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: David T. Beatson, Christian Hoffman, James E. Eder, Jonn Ditri
  • Die attach system and process using cornercube offset tool
    Publication number: 20030019909
    Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.
    Type: Application
    Filed: February 14, 2002
    Publication date: January 30, 2003
    Inventors: David T. Beatson, Christian Hoffman, James E. Eder, Jonn Ditri