Patents by Inventor Joo Chul Kim

Joo Chul Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10020280
    Abstract: The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: July 10, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
  • Publication number: 20150311176
    Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of
    Type: Application
    Filed: July 6, 2015
    Publication date: October 29, 2015
    Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
  • Patent number: 9105631
    Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: August 11, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
  • Publication number: 20140291004
    Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of
    Type: Application
    Filed: June 13, 2014
    Publication date: October 2, 2014
    Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
  • Patent number: 8791370
    Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: July 29, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
  • Publication number: 20110100687
    Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.
    Type: Application
    Filed: February 23, 2010
    Publication date: May 5, 2011
    Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo