Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate—based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus—based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polymide resin layer. The polymide resin layer has a modulus of elasticity of 70 Mpa at 400° C.

Abstract: The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polymide resin layer. The polymide resin layer has a modulus of elasticity of 70 Mpa at 400° C.

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer. The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.

Abstract: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.

Abstract: Disclosed herein are a metallic laminate, including (i) a metal layer and (ii) a polyimide resin layer having a coefficient of thermal expansion of 19 ppm/° C. or less and a glass transition temperature of 350° C. or more, laminated on the metal layer, and a method of manufacturing the same. According to this invention, the metallic laminate has a good external appearance, having no foam on the polyimide resin layer.

Abstract: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.

Abstract: The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.

Abstract: The present invention relates to a method for preparing polyimide having excellent heat resistance and processibility and, more particularly, to a method of preparing polyimide which has desirable mechanical strength during curing at low temperatures and excellent processibility to be used as an insulating film of a metal laminate plate or a coverlay film for print substrates or hard disks, and polyimide prepared using the same.

Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate-based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus-based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.

Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10?6 to 2.5×10?5/° C. and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.

Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10-6 to 2.5×10-5/iÉ and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.

Abstract: The present invention relates to a metallic laminate for printed-circuit base board composed of two low thermal expansion polyimide resin layers having thermal expansion coefficient of up to 20 ppm/?, a metal conductor layer, and a high thermal expansion polyimide resin layer having thermal expansion coefficient of more than 20 ppm/? which is loaded on the above low thermal expansion polyimide resin layers, and a preparation method of the same.

Abstract: The present invention relates to a polyimide copolymer used in a precursor of heat resistant adhesive and methods for preparing the same, and more particularly, to a polyamic acid copolymer and methods for preparing the same obtained by controlling a polymerization degree of the tetracarboxylic acid dianhydride and aromatic diamine. The present invention also comprises a polyimide copolymer obtained by curing the polyamic acid copolymer, and methods for preparing the same. The present invention also provides a heat resistant adhesive composition comprising the polyamic acid copolymer and the polyimide copolymer, and a semiconductor device using the same. The polyamic acid copolymer used in a precursor and polyimide copolymer obtained therefrom of the present invention has superior adhesion strength and simultaneously satisfies physical properties like high heat resistance and low water absorption rate, etc. and thus it can be effectively adhered parts of semiconductor devices, etc.