Patents by Inventor Joo Hun Park

Joo Hun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190237714
    Abstract: According to various embodiments of the present invention, a protective cover for protecting an electronic device comprises: a cover part; and a coupling part extending from the cover part, rotatably connected to the cover part, and detachably coupled to a part of the electronic device, wherein the coupling part rotates the cover part while being coupled to a part of the electronic device, so as to enable the cover part to cover at least one of a first and a second surface of the electronic device. In addition, various embodiments are possible.
    Type: Application
    Filed: September 18, 2017
    Publication date: August 1, 2019
    Inventors: Joo-Ho SEO, Dong-Hun KIM, Seon-Keun PARK, Jin-Ie RYU
  • Publication number: 20190203683
    Abstract: An injector for injecting fuel, which is introduced from a fuel rail, into an engine to supply the fuel thereto is provided. In particular, the injector includes a housing, an electromagnetic generation unit accommodated in the housing and formed to generate an electromagnetic field when electric power is applied thereto, a core inserted into a fuel-rail-side end of a bobbin to form a magnetic circuit using the generated electromagnetic field, a lead pipe inserted into an engine-side end of the bobbin to form the magnetic circuit by coupling with the core, a molding unit formed to enclose the electromagnetic generation unit and an outer peripheral surface of the core to block introduction of moisture, and a cover coupled to the outer peripheral surface of the core to constitute the magnetic circuit together with the core.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 4, 2019
    Inventors: Kang Hun Lee, Bong Woo Ryu, Joo Hee Park
  • Publication number: 20190194603
    Abstract: The present invention relates to Nelumbo nucifera callus having an increased content of gallic acid or an extract thereof and to a method for preparing the same. The Nelumbo nucifera callus extract according to the present invention has an excellent whitening effect by containing a large amount of gallic acid, and thus can be advantageously used as a cosmetic composition.
    Type: Application
    Filed: March 30, 2017
    Publication date: June 27, 2019
    Inventors: Yeon Sook Kim, Jung Yeon Kim, Jae Hun Kim, Hyeong Mi Kim, Jung Soo Bae, Jung Yun Kim, Ju Yeon Kim, Joo Hyuck Lim, Seung Ki Lee, Sung Ho Moon, Shin Jae Chang, Sang Hyun Moh, Jeong Hun Lee, Hyo Hyun Seo, Ji Hong Moh, Soo Yun Kim, Jeong Gon Park
  • Publication number: 20190171254
    Abstract: An electronic device is disclosed herein, including a first face oriented in a first direction, the first face formed having a curvature and disposed as to be visible from an exterior of the electronic device, a body including a second face oriented towards a second direction opposite to the first direction, the second face visible from the exterior, and a display module visible when viewing the first face, the display module including a flexible display disposed under a window, and the window including a central visible area formed in a substantially rectangular shape including first, second, third and fourth visible areas disposed adjacent to four respective edges of the central visible area.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 6, 2019
    Inventors: Dong Hun KIM, Jung Sik PARK, Min Sung LEE, Chung Ha KIM, Joo Ho SEO, Han Gil SONG, Seung Ah OH, So Young LEE, Jung Won LEE, Jong Chul CHOI
  • Publication number: 20190163008
    Abstract: A display device includes: a display panel; a bottom chassis in which the display panel is accommodated; a driving circuit substrate disposed on an outside surface of the bottom chassis; at least one flexible printed circuit board connecting the display panel to the driving circuit substrate; and a top chassis configured to cover an edge portion of a top surface and side surfaces of the display panel, wherein the top chassis has an opening formed in an area in contact with the flexible printed circuit board.
    Type: Application
    Filed: January 30, 2019
    Publication date: May 30, 2019
    Inventors: SU YOUNG YUN, SUNG HUN LEE, JOO HYUK PARK
  • Patent number: 10302256
    Abstract: A lighting apparatus including a plurality of frames connected to each other in the lengthwise direction; a connector, which is arranged between the plurality of frames and interconnects the plurality of frames by including a portion inserted into one of the plurality of frames, and including another portion inserted into the other one of the plurality of frames; and a light source arranged on the plurality of frames.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-kwang Kwon, Joo-hun Han, Bang-won Oh, Du-su Kwon, Hyun-kyung Kim, Yoon-ki Park, Yoon-suk Lee
  • Publication number: 20170358546
    Abstract: A flip chip includes a substrate, an electrode pad layer stacked over the substrate, a passivation layer stacked at both ends of the electrode pad layer, an under bump metallurgy (UBM) layer stacked over the electrode pad layer and the passivation layer, and a bump formed over the UBM layer. The width of an opening on which the passivation layer is not formed over the electrode pad layer is greater than the width of the bump. The flip chip can prevent a crack from being generated in the pad upon ultrasonic bonding.
    Type: Application
    Filed: June 8, 2017
    Publication date: December 14, 2017
    Inventors: Young Seok SHIM, Hyung Ju KIM, Joo Hun PARK, Chang Dug KIM
  • Patent number: 7820468
    Abstract: Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: October 26, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Hee Lee, Doo Cheol Park, Joo Hun Park, Young Jin Lee, Sang Wook Park, Nam Hyeong Kim
  • Publication number: 20100047949
    Abstract: Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.
    Type: Application
    Filed: August 24, 2009
    Publication date: February 25, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO.,LTD.
    Inventors: Seung Hee Lee, Doo Cheol Park, Joo Hun Park, Young Jin Lee, Sang Wook Park, Nam Hyeong Kim
  • Patent number: 7336017
    Abstract: A surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: February 26, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Hee Lee, Doo Cheol Park, Joo Hun Park, Young Jin Lee, Sang Wook Park, Nam Hyeong Kim
  • Publication number: 20070145541
    Abstract: Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.
    Type: Application
    Filed: March 6, 2007
    Publication date: June 28, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Hee LEE, Doo Cheol PARK, Joo Hun PARK, Young Jin LEE, Sang Wook PARK, Nam Hyeong KIM
  • Patent number: 7045385
    Abstract: A method for fabricating Surface Acoustic Wave filter packages uses a package sheet having an outline pattern and anti-bur holes. In the package sheet for a Surface Acoustic Wave filter package, the outline pattern is formed along outer peripheries of chip mounting areas where a plurality of SAW filter chips are to be mounted. The outline pattern is contacted with a metal shield layer formed on the SAW filter chips and a predetermined region of the package sheet. Circular anti-bur holes are located at the corners of the chip mounting areas and on cutting lines along which the sheet is to be singulated into individual SAW filter packages.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: May 16, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hoon Kim, Ju Weon Seo, Joo Hun Park, Moon Soo Jeon
  • Patent number: 6928719
    Abstract: A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: August 16, 2005
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hoon Kim, Chan Wang Park, Joo Hun Park, Jong Tae Kim
  • Patent number: 6670206
    Abstract: Disclosed is a method for simply fabricating plural surface acoustic wave filter chip packages in large quantities comprising the steps of providing a wafer, on the surface of which plural surface acoustic wave filter chips are formed, and a package substrate, on the surface of which mounting portions corresponding to surface acoustic wave filter chips are formed; providing underfill on the package substrate; mounting the wafer on the package substrate; removing wafer portions between surface acoustic wave filter chips; forming metal shield layers on outer walls of separated surface acoustic wave filter chips; molding a resin on outer walls of surface acoustic wave filter chips coated with metal layers; and dividing the package substrate molded with resin into individual surface acoustic wave filter chip packages.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: December 30, 2003
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hoon Kim, Chan Wang Park, Joo Hun Park, Jae Myung Kim
  • Publication number: 20030109077
    Abstract: Disclosed is a method for simply fabricating plural surface acoustic wave filter chip packages in large quantities comprising the steps of providing a wafer, on the surface of which plural surface acoustic wave filter chips are formed, and a package substrate, on the surface of which mounting portions corresponding to surface acoustic wave filter chips are formed; providing underfill on the package substrate; mounting the wafer on the package substrate; removing wafer portions between surface acoustic wave filter chips; forming metal shield layers on outer walls of separated surface acoustic wave filter chips; molding a resin on outer walls of surface acoustic wave filter chips coated with metal layers; and dividing the package substrate molded with resin into individual surface acoustic wave filter chip packages.
    Type: Application
    Filed: April 11, 2002
    Publication date: June 12, 2003
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hoon Kim, Chan Wang Park, Joo Hun Park, Jae Myung Kim
  • Publication number: 20030009864
    Abstract: Disclosed is a method for fabricating a surface acoustic wave filter chip package comprising the steps of mounting the surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the surface acoustic wave filter chip; forming a metal shield layer on an whole outer wall of the surface acoustic wave filter chip by using a spray process; and molding resins on the metal shield layer. The method has advantages in that a fillet forming step for improving a step-coverage is removed by forming a metal shield layer from a conductive epoxy with the use of a spray nozzle, a one-ply metal shield layer is formed without an additional metal layer for preventing oxidation of the metal layer by forming an exterior of the SAW filter chip package with the use of a top molding process, and that a structurally stable SAW filter package can be fabricated.
    Type: Application
    Filed: April 11, 2002
    Publication date: January 16, 2003
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hoon Kim, Chan Wang Park, Joo Hun Park, Jong Tae Kim