Abstract: A semiconductor device includes an on-die resistor circuit comprising an on-die resistor, a calibration circuit configured to perform a calibration operation on the on-die resistor, and a calibration control circuit configured to control the calibration operation of the calibration circuit. The calibration circuit includes a current generating circuit configured to supply a calibration current to the on-die resistor and a comparing circuit configured to compare the magnitude of a first input signal that is generated by the calibration current and the on-die resistor with a magnitude of a second input signal that is generated by the calibration current and an external resistor.

Abstract: A semiconductor device includes an on-die resistor circuit comprising an on-die resistor, a calibration circuit configured to perform a calibration operation on the on-die resistor, and a calibration control circuit configured to control the calibration operation of the calibration circuit. The calibration circuit includes a current generating circuit configured to supply a calibration current to the on-die resistor and a comparing circuit configured to compare the magnitude of a first input signal that is generated by the calibration current and the on-die resistor with a magnitude of a second input signal that is generated by the calibration current and an external resistor.

Abstract: A multiple support wall structure according to the present invention includes: a pair of top and bottom support plates that has a plurality of rectangular projective islands separated by lattice-shaped projections protruding in the shape of a go board, and protruding upward in the opposite direction to the lattice-shaped projections; and a intermediate reinforcing plate that is disposed between the top and bottom support plates, has upward projective insertions protruding in a shape corresponding to the rectangular islands to be fitted in the rectangular islands of the top support plate, has top grooves formed laterally and longitudinally between the upward projective insertions to fit the lattice-shaped projections, has downward projective insertions formed in the same shape as but in the opposite direction to the upward projective insertions in spaces diagonally adjacent to the upward projective insertions, and has bottom grooves formed laterally and longitudinally between the downward projective insertions

Abstract: A multiple support wall structure according to the present invention includes: a pair of top and bottom support plates that has a plurality of rectangular projective islands separated by lattice-shaped projections protruding in the shape of a go board, and protruding upward in the opposite direction to the lattice-shaped projections; and a intermediate reinforcing plate that is disposed between the top and bottom support plates, has upward projective insertions protruding in a shape corresponding to the rectangular islands to be fitted in the rectangular islands of the top support plate, has top grooves formed laterally and longitudinally between the upward projective insertions to fit the lattice-shaped projections, has downward projective insertions formed in the same shape as but in the opposite direction to the upward projective insertions in spaces diagonally adjacent to the upward projective insertions, and has bottom grooves formed laterally and longitudinally between the downward projective insertions

Abstract: Provided area carbon nanotube composite material obtained by treating a mixture including carbon nanotubes, at least one carbon compound other than carbon nanotubes and a dispersion medium under a sub-critical or super-critical condition of 50-400 atm, and a method for producing the same. More particularly, the method for producing a carbon nanotube composite material, includes: introducing a mixture including carbon nanotubes, at least one carbon compound other than carbon nanotubes and a dispersion medium into a preheating unit under a pressure of 1-400 atm to preheat the mixture; treating the preheated mixture under a sub-critical or super-critical condition of 50-400 atm; cooling and depressurizing the resultant product to 0-1000 C and 1-10 atm; and recovering the cooled and depressurized product. Provided also is an apparatus for producing a carbon nanotube composite material in a continuous manner.

Abstract: Provided area carbon nanotube composite material obtained by treating a mixture including carbon nanotubes, at least one carbon compound other than carbon nanotubes and a dispersion medium under a sub-critical or super-critical condition of 50-400 atm, and a method for producing the same. More particularly, the method for producing a carbon nanotube composite material, includes: introducing a mixture including carbon nanotubes, at least one carbon compound other than carbon nanotubes and a dispersion medium into a preheating unit under a pressure of 1-400 atm to preheat the mixture; treating the preheated mixture under a sub-critical or super-critical condition of 50-400 atm; cooling and depressurizing the resultant product to 0-1000 C and 1-10 atm; and recovering the cooled and depressurized product. Provided also is an apparatus for producing a carbon nanotube composite material in a continuous manner.

Abstract: Disclosed are anisotropic conductive balls for electric connection comprised of conductive balls and insulation resin layers coating the surfaces of those conductive balls, where the conductive balls are coated with a core-shell-structured emulsion-phase or suspension-phase or water-dispersible resin to form insulation resin layers and the functions of the insulation layers are improved as the shells of corpuscles of the insulation resin layers are cross-linked by using a cross-linking agent. Also disclosed are methods of manufacturing such anisotropic conductive balls for electric connection as well as the products using them. Although the anisotropic conductive balls for electric connection of the present invention are single-layered or cross-linked, they show superior alive and insulation characteristics as the problems with the conventional anisotropic conductive balls for electric connection coated with a thermoplastic resin or a thermosetting resin are improved.

Abstract: Disclosed are anisotropic conductive balls for electric connection comprised of conductive balls and insulation resin layers coating the surfaces of those conductive balls. The conductive balls are coated with a core-shell-structured emulsion-phase or suspension-phase or water-dispersible resin to form insulation resin layers as the shells of the insulation resin layers are coated with resin layers having the water-emission ability. Also disclosed are methods of manufacturing anisotropic conductive balls for electric connection as well as the products using them. Although the surfaces of the anisotropic conductive balls are coated with single- or multi-layered insulation resin layers, they show superior alive and insulation characteristics.

Abstract: Disclosed is an insulated conductive ball for anisotropic conductive connection, a method of preparing the same and a product using the same. The insulated conductive ball includes a conductive ball, and an insulating resin layer coated on a surface of the conductive ball, in which the insulating resin layer is formed of water-soluble resin beads of core/shell structure. Therefore, the conductive ball of the current invention can exhibit superior current feed and insulation characteristics, compared to those of conventional insulated conductive balls for anisotropic conductive connection coated with thermoplastic resin or thermosetting resin.

Abstract: Disclosed is an insulated conductive ball for anisotropic conductive connection, a method of preparing the same and a product using the same. The insulated conductive ball includes a conductive ball, and an insulating resin layer coated on a surface of the conductive ball, in which the insulating resin layer is formed of water-soluble resin beads of core/shell structure. Therefore, the conductive ball of the current invention can exhibit superior current feed and insulation characteristics, compared to those of conventional insulated conductive balls for anisotropic conductive connection coated with thermoplastic resin or thermosetting resin.