Patents by Inventor Joo Shan Yam

Joo Shan Yam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for packaging an acoustic device in an integrated circuit (IC)
    Patent number: 11855608
    Abstract: Systems and methods for packaging an acoustic device in an integrated circuit (IC) include walls formed on a wiring substrate. The walls have a height which is just shorter than an expected height of a solder bump on the acoustic device after solder reflow. The walls are positioned on either side of the acoustic device and a small portion lies underneath an exterior edge of the acoustic device such that a relatively small gap is formed between an upper surface of the wall and the lower surface of the acoustic device. By providing a small gap between wall and acoustic device, encroachment by an encapsulating material into a keep out zone of the acoustic device is minimized.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: December 26, 2023
    Assignee: RF360 SINGAPORE PTE. LTD.
    Inventors: Huan En Ku, Joo Shan Yam, Chee Kong Lee
  • SYSTEMS AND METHODS FOR PACKAGING AN ACOUSTIC DEVICE IN AN INTEGRATED CIRCUIT (IC)
    Publication number: 20210313957
    Abstract: Systems and methods for packaging an acoustic device in an integrated circuit (IC) include walls formed on a wiring substrate. The walls have a height which is just shorter than an expected height of a solder bump on the acoustic device after solder reflow. The walls are positioned on either side of the acoustic device and a small portion lies underneath an exterior edge of the acoustic device such that a relatively small gap is formed between an upper surface of the wall and the lower surface of the acoustic device. By providing a small gap between wall and acoustic device, encroachment by an encapsulating material into a keep out zone of the acoustic device is minimized.
    Type: Application
    Filed: August 31, 2020
    Publication date: October 7, 2021
    Inventors: Huan En Ku, Joo Shan Yam, Chee Kong Lee