Abstract: Example embodiments relate to a memory system and a method of controlling power thereof. The memory system may include a memory device and a memory controller. The memory device may be configured to be set to a specific power characteristic mode in response to a mode register set command so as to provide a power characteristic information corresponding to the specific power characteristic mode. The memory controller may be configured to provide the mode register set command to the memory device, configured to read the power characteristic information corresponding to the specific power characteristic mode from the memory device, configured to generate a power control information based on the power characteristic information, configured generate a command in response to the power control information, and provide the command to the memory device according to the power control information.

Abstract: An input/output (IO) interface includes a data encoder which encodes each of a plurality of pieces of parallel data having different timings and generates a plurality of pieces of encoded data, and an alternating current (AC) coupling transmission unit which transmits the plurality of encoded data in an AC coupling method. The data encoder compares first parallel data with second parallel data from among the plurality of pieces of parallel data on a bit-by-bit basis and obtains the number of bits whose logic states have transited between the first parallel data and the second parallel data. When the number of bits whose logic states have transited is greater than or equal to a reference number of bits, the data encoder inverts bit values of the second parallel data to generate the encoded data. When the number of bits whose logic states have transited is less than the reference number of bits, the data encoder maintains the bit values of the second parallel data to generate the encoded data.

Abstract: A memory controller controlling a plurality of semiconductor memory devices includes a refresh control circuit controlling refresh operations of the semiconductor memory devices according to positional information of memory chips of the memory devices. The refresh control circuit classifies the semiconductor memory devices into first and second groups and sets an auto refresh interval of the semiconductor memory devices belong to the first group and an auto refresh interval of the semiconductor memory devices belong to the second group different from each other.

Abstract: A dynamic output buffer circuit performs an impedance matching function and a pre-emphasis function by using input and output signals, and consumes relatively less power, occupies a relatively smaller layout area, and dynamically varies an output impedance. The dynamic output buffer circuit dynamically matches an output impedance to the characteristic impedance of a metal line connected to an external circuit, pre-emphasizes at least one input signal, and includes a control circuit and an output circuit. The control circuit matches the output impedance of the dynamic output circuit to the characteristic impedance of the metal line in response to at least one output signal, and outputs a plurality of resistor control signals which are used to pre-emphasize at least one input signal in response to the input signal. The output circuit controls the output impedance and pre-emphasizes the input signal in response to the resistor control signals, and outputs the output signal.

Abstract: A memory module includes a plurality of data ports configured to receive/transmit associated data and a plurality of memory devices. The plurality of memory devices include a first set of the memory devices in at least one rank, each memory device of the first set being coupled to each of the associated data ports, and a second set of the memory devices in at least one other rank, each memory device of the second set being configured to receive/transmit the associated data for the memory device through at least each associated memory device of the first set.

Abstract: Provided is a data parallelizing receiver including an input signal receiver for externally receiving serial data as packets, sampling the serial data, aligning the sampled data in an input order, and converting the aligned data into parallel data to output the parallel data, a cyclic redundancy check (CRC) partial calculator for receiving the parallel data, classifying the parallel data into groups according to the input order, and performing a partial CRC calculation on each of the groups to sequentially output a plurality of partial CRC calculation results, and a CRC partial calculation merger for receiving the plurality of partial CRC calculation results and merging the partial CRC calculation results to output CRC calculation data.

Abstract: A memory module includes a port configured to receive write data and command/address signals and multiple memory devices. The multiple memory devices include a first set of the memory devices, each memory device of the first set coupled to the port, and a second set of the memory devices, each memory device of the second set configured to receive associated write data and associated command/address signals for the memory device through at least one of the other memory devices of the first set and the second set.

Abstract: A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.

Abstract: A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.

Abstract: A memory system selectively sets signaling modes based on stack position information. The memory system includes a memory module having at least one semiconductor memory device and a memory controller configured to set a signaling mode based on stack position information of each of the semiconductor memory devices. A signaling between the memory controller and each of the semiconductor memory devices is performed in a differential signaling mode, and a signaling among the semiconductor memory devices is performed in a single-ended signaling mode. Accordingly, the memory system has reduced power consumption.

Abstract: A memory device includes a memory cell array, a row decoding section, a K-bit prefetch section and an output buffer section. The row decoding section decodes a row address in response to a first clock, to activate one of the word lines corresponding to the decoded row address. The K-bit prefetch section decodes a column address in response to a second clock and prefetches K data from K memory cells connected to the activated word line and corresponds to the decoded column address, in response to a second clock, where a frequency of the second clock is 1/M of that of the first clock. The output buffer section outputs the K prefetched data as a data stream in response to a third clock. Therefore, a burden from the physical limit of the access speed may be alleviated when the data I/O speed is increased.

Abstract: Example embodiments relate to a memory system and a method of controlling power thereof. The memory system may include a memory device and a memory controller. The memory device may be configured to be set to a specific power characteristic mode in response to a mode register set command so as to provide a power characteristic information corresponding to the specific power characteristic mode. The memory controller may be configured to provide the mode register set command to the memory device, configured to read the power characteristic information corresponding to the specific power characteristic mode from the memory device, configured to generate a power control information based on the power characteristic information, configured generate a command in response to the power control information, and provide the command to the memory device according to the power control information.

Abstract: In an embodiment, a semiconductor memory device includes a clock latency that can be controlled responsive to whether or not an output order of burst data is reordered. The semiconductor memory device may comprise a control unit and a latency control unit. The control unit may generate a latency control signal having a logic level that varies depending on whether or not an output order of burst data is reordered. The latency control unit may control a latency value in response to the latency control signal. The semiconductor memory device and the method of controlling the latency value responsive to a reordering of the burst data allow for an optimally fast memory access time.

Abstract: A dynamic output buffer circuit performs an impedance matching function and a pre-emphasis function by using input and output signals, and consumes relatively less power, occupies a relatively smaller layout area, and dynamically varies an output impedance. The dynamic output buffer circuit dynamically matches an output impedance to the characteristic impedance of a metal line connected to an external circuit, pre-emphasizes at least one input signal, and includes a control circuit and an output circuit. The control circuit matches the output impedance of the dynamic output circuit to the characteristic impedance of the metal line in response to at least one output signal, and outputs a plurality of resistor control signals which are used to pre-emphasize at least one input signal in response to the input signal. The output circuit controls the output impedance and pre-emphasizes the input signal in response to the resistor control signals, and outputs the output signal.

Abstract: A memory system includes a memory controller and a plurality of first memory components. The memory controller has a plurality of I/O channels, each of the I/O channels including a command/address bus and a data bus. The plurality of the first memory components are respectively coupled to the memory controller through the plurality of I/O channels. The memory controller respectively transmits commands/addresses and data to the plurality of first memory components through the plurality of I/O channels in order to independently control the plurality of first memory components.

Abstract: A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.

Abstract: A memory controller controlling a plurality of semiconductor memory devices includes a refresh control circuit controlling refresh operations of the semiconductor memory devices. The refresh control circuit classifies the semiconductor memory devices into first and second groups and sets an auto refresh interval of the semiconductor memory devices belong to the first group and an auto refresh interval of the semiconductor memory devices belong to the second group different from each other.

Abstract: A memory device includes a memory cell array, a row decoding section, a K-bit prefetch section and an output buffer section. The row decoding section decodes a row address in response to a first clock, to activate one of the word lines corresponding to the decoded row address. The K-bit prefetch section decodes a column address in response to a second clock and prefetches K data from K memory cells connected to the activated word line and corresponds to the decoded column address, in response to a second clock, where a frequency of the second clock is 1/M of that of the first clock. The output buffer section outputs the K prefetched data as a data stream in response to a third clock. Therefore, a burden from the physical limit of the access speed may be alleviated when the data I/O speed is increased.

Abstract: In a memory system and a memory module having a large capacity and operating at high speed, the memory module includes a module board, a primary memory component that is mounted on the module board, accessed as a master, and has a first column access latency, and a secondary memory component that is mounted on the module board, accessed as a slave, and has a second column access latency, which is shorter than the first column access latency. The memory system operates at high speed regardless of a repetition delay in a repeated link configuration in which the memory components are linked as hierarchy.

Abstract: A memory module includes a port configured to receive write data and command/address signals and multiple memory devices. The multiple memory devices include a first set of the memory devices, each memory device of the first set coupled to the port, and a second set of the memory devices, each memory device of the second set configured to receive associated write data and associated command/address signals for the memory device through at least one of the other memory devices of the first set and the second set.