Abstract: A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor package also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor package additionally includes a stack of second semiconductor dies mounted on the second surface of the interposer. The semiconductor package further includes a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer.

Abstract: A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor package also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor package additionally includes a stack of second semiconductor dies mounted on the second surface of the interposer. The semiconductor package further includes a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer.

Abstract: A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor device also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor device additionally includes a stack of second semiconductor dies mounted on the second surface of the interposer. The semiconductor package further includes a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer.

Abstract: A semiconductor package and or method of fabricating a semiconductor package may be provided. The semiconductor package may include a package substrate. The semiconductor package may include a first semiconductor die coupled to the package substrate by first interconnectors. The semiconductor package may include a second semiconductor die coupled to the first semiconductor die by second interconnectors. The second semiconductor die may be coupled to the substrate.