Patents by Inventor Joo-Yeon Won
Joo-Yeon Won has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11215883Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.Type: GrantFiled: July 9, 2020Date of Patent: January 4, 2022Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Chong-Guk Lee, Joo-Yeon Won, Se-Hul Jang, Su-Mi Moon, Dong-Wook Lee
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Publication number: 20200341320Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.Type: ApplicationFiled: July 9, 2020Publication date: October 29, 2020Inventors: CHONG-GUK LEE, JOO-YEON WON, SE-HUL JANG, SU-MI MOON, DONG-WOOK LEE
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Patent number: 10747074Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.Type: GrantFiled: July 23, 2018Date of Patent: August 18, 2020Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Chong-Guk Lee, Joo-Yeon Won, Se-Hul Jang, Su-Mi Moon, Dong-Wook Lee
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Publication number: 20180329253Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.Type: ApplicationFiled: July 23, 2018Publication date: November 15, 2018Inventors: Chong-Guk Lee, Joo-Yeon Won, Se-Hul Jang, Su-Mi Moon, Dong-Wook Lee
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Patent number: 10031385Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.Type: GrantFiled: May 25, 2017Date of Patent: July 24, 2018Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Chong-Guk Lee, Joo-Yeon Won, Se-Hui Jang, Su-Mi Moon, Dong-Wook Lee
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Publication number: 20170261799Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.Type: ApplicationFiled: May 25, 2017Publication date: September 14, 2017Inventors: CHONG-GUK LEE, JOO-YEON WON, SE-HUI JANG, SU-Ml MOON, DONG-WOOK LEE
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Patent number: 9664964Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.Type: GrantFiled: April 3, 2015Date of Patent: May 30, 2017Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Chong-Guk Lee, Joo-Yeon Won, Se-Hui Jang, Su-Mi Moon, Dong-Wook Lee
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Patent number: 9354468Abstract: A liquid crystal display according to an exemplary embodiment of the present invention includes a first display panel and a second display panel which are opposite to each other, a driving unit connection line which is formed in the first display panel, a driving circuit portion which is connected to the driving unit connection line, a backlight unit which is disposed so as to be adjacent to the first display panel, a polarizer which is disposed on a surface of the second display panel and overlaps the driving unit connection line and the driving circuit portion, and a reinforcement unit that overlaps the driving unit connection line, and the polarizer may be disposed on the reinforcement unit.Type: GrantFiled: October 23, 2014Date of Patent: May 31, 2016Assignee: Samsung Display Co., Ltd.Inventors: Sang Hwan Lee, Young Dae Song, Jae-Hwan Jeon, Yong Woo Kim, Sung-Dong Park, Hyeok-Tae Kwon, Joo-Yeon Won, Chong Guk Lee, Byung Goo Jung
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Publication number: 20160062172Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate, The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line, The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.Type: ApplicationFiled: April 3, 2015Publication date: March 3, 2016Inventors: Chong-Guk Lee, Joo-Yeon Won, Se-Hui Jang, Su-Mi Moon, Dong-Wook Lee
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Patent number: 9261742Abstract: A display substrate includes a circuit mounted part that has a driving IC mounted thereon. The circuit mounted part includes an input pad part connected to an input terminal of the driving IC and an output pad part connected to an output terminal of the driving IC. A flexible pad part connected to a terminal of a FPCB includes a driving pad part to receive a drive signal of the driving IC. A driving line part is connected to the driving pad part to be extended along a length direction of the circuit mounted part within the circuit mounted part. Connection lines are extended from the driving line part disposed within the circuit mounted part toward the output pad part. The connection lines are partially removed in a trimming area defined between the driving line and the output pad part.Type: GrantFiled: June 15, 2012Date of Patent: February 16, 2016Assignee: Samsung Display Co., Ltd.Inventors: Chong-Guk Lee, Sung-Dong Park, Seok-Hyun Jung, Bon-Yong Koo, Joo-Yeon Won
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Publication number: 20150230337Abstract: A display device includes a display panel including a display area and a non-display area, a plurality of driver integrated circuits mounted on the non-display area of the display panel by a COG method, a printed circuit board (PCB) configured to provide a signal to the plurality of driver integrated circuits, and a flexible printed circuit (FPC) configured to transfer the signal from the PCB to the plurality of driver integrated circuits. The FPC has a first end portion and a second end portion opposite to the first end portion. The first end portion is attached on the non-display area of the display panel by a FOG method, and the second end portion is attached on the PCB. A width of the second end portion is different from a width of the first end portion.Type: ApplicationFiled: October 29, 2014Publication date: August 13, 2015Inventors: DONG-IN KIM, Hyun-Seok Hong, Sang-Min Jeon, Joo-Yeon Won, Chong-Guk Lee
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Patent number: 9087748Abstract: A thin film transistor substrate includes: first and second driving chips; a plurality of signal lines respectively connected to the first and second driving chips; a plurality of first and second branch repair lines extended across the plurality of signal lines connected to the first driving chip; a plurality of third and fourth branch repair lines extended across the plurality of signal lines connected to the second driving chip; an insulating layer between the plurality of first and second branch repair lines and the plurality of signal lines connected to the first driving chip, and between the plurality of third and fourth branch repair lines and the plurality of signal lines connected to the second driving chip; a first repair line connecting the first and second branch repair lines to each other; and a second repair line connecting the third and fourth branch repair lines to each other.Type: GrantFiled: July 17, 2014Date of Patent: July 21, 2015Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Joo-Yeon Won, Yun Hee Kwak, Sung-Dong Park, Chong Guk Lee, Byung Goo Jung
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Patent number: 9029710Abstract: A tape package includes a base substrate, an input lead line disposed on the base substrate, the input lead line including a main input lead line and a sub input lead line, the sub input lead line branching off and extending from the main input lead line, an integrated circuit chip electrically connected to the sub input lead line, and a sealing part fixing the integrated circuit chip on the base substrate and overlapping a portion of the main input lead line.Type: GrantFiled: December 6, 2012Date of Patent: May 12, 2015Assignee: Samsung Display Co., Ltd.Inventors: Byung-Goo Jung, Joo-Yeon Won, Chong-Guk Lee, Sung-Dong Park
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Publication number: 20150124180Abstract: A liquid crystal display according to an exemplary embodiment of the present invention includes a first display panel and a second display panel which are opposite to each other, a driving unit connection line which is formed in the first display panel, a driving circuit portion which is connected to the driving unit connection line, a backlight unit which is disposed so as to be adjacent to the first display panel, a polarizer which is disposed on a surface of the second display panel and overlaps the driving unit connection line and the driving circuit portion, and a reinforcement unit that overlaps the driving unit connection line, and the polarizer may be disposed on the reinforcement unit.Type: ApplicationFiled: October 23, 2014Publication date: May 7, 2015Inventors: Sang Hwan LEE, Young Dae SONG, Jae-Hwan JEON, Yong Woo KIM, Sung-Dong PARK, Hyeok-Tae KWON, Joo-Yeon WON, Chong Guk LEE, Byung Goo JUNG
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Publication number: 20150054165Abstract: A thin film transistor substrate includes: first and second driving chips; a plurality of signal lines respectively connected to the first and second driving chips; a plurality of first and second branch repair lines extended across the plurality of signal lines connected to the first driving chip; a plurality of third and fourth branch repair lines extended across the plurality of signal lines connected to the second driving chip; an insulating layer between the plurality of first and second branch repair lines and the plurality of signal lines connected to the first driving chip, and between the plurality of third and fourth branch repair lines and the plurality of signal lines connected to the second driving chip; a first repair line connecting the first and second branch repair lines to each other; and a second repair line connecting the third and fourth branch repair lines to each other.Type: ApplicationFiled: July 17, 2014Publication date: February 26, 2015Inventors: Joo-Yeon WON, Yun Hee KWAK, Sung-Dong PARK, Chong Guk LEE, Byung Goo JUNG
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Publication number: 20140078442Abstract: A liquid crystal display device may include a liquid crystal display panel. The liquid crystal display device may further include a printed circuit board configured to provide control signals for the liquid crystal display panel. The liquid crystal display device may further include a connector configured to electrically connect the printed circuit board with an external device that is external to the liquid crystal display device. The liquid crystal display device may further include a connector support overlapping the connector. A portion of the printed circuit board may overlap the connector and may be disposed between the connector and the connector support.Type: ApplicationFiled: January 23, 2013Publication date: March 20, 2014Applicant: Samsung Display Co., Ltd.Inventors: Joo-Yeon WON, Sung-Dong PARK, Chong Guk LEE, Byung Goo JUNG
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Publication number: 20140036456Abstract: A tape package includes a base substrate, an input lead line disposed on the base substrate, the input lead line including a main input lead line and a sub input lead line, the sub input lead line branching off and extending from the main input lead line, an integrated circuit chip electrically connected to the sub input lead line, and a sealing part fixing the integrated circuit chip on the base substrate and overlapping a portion of the main input lead line.Type: ApplicationFiled: December 6, 2012Publication date: February 6, 2014Applicant: SAMSUNG DISPLAY CO., LTD.Inventors: Byung-Goo JUNG, Joo-Yeon WON, Chong-Guk LEE, Sung-Dong PARK
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Publication number: 20130170151Abstract: A display substrate includes a circuit mounted part that has a driving IC mounted thereon. The circuit mounted part includes an input pad part connected to an input terminal of the driving IC and an output pad part connected to an output terminal of the driving IC. A flexible pad part connected to a terminal of a FPCB includes a driving pad part to receive a drive signal of the driving IC. A driving line part is connected to the driving pad part to be extended along a length direction of the circuit mounted part within the circuit mounted part. Connection lines are extended from the driving line part disposed within the circuit mounted part toward the output pad part. The connection lines are partially removed in a trimming area defined between the driving line and the output pad part.Type: ApplicationFiled: June 15, 2012Publication date: July 4, 2013Applicant: Samsung Display Co., Ltd.Inventors: Chong-Guk LEE, Sung-Dong PARK, Seok-Hyun JUNG, Bon-Yong KOO, Joo-Yeon WON
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Patent number: 8408928Abstract: A connector is used to transmit a signal from a flexible board to an external device. The connector includes an actuator, a supporter, contact terminals, and an outer cover. The actuator includes a body having a slit opened to a front surface and extended in a longitudinal direction of the slit, and a pivot positioned at opposing longitudinal ends of the body. The slit receives the flexible board inserted from the front surface direction. The actuator is rotated with reference to the pivot. The supporter extends in the longitudinal direction and is adjacent to the front surface of the actuator. The contact terminals extend through the supporter and the body, and protrude into the slit. The actuator receives the flexible board when at a first position, and each contact terminal makes contact with the flexible board when the actuator is at a second position different from the first position.Type: GrantFiled: April 14, 2011Date of Patent: April 2, 2013Assignee: Samsung Display Co., Ltd.Inventors: Joo-Yeon Won, YongSoon Lee, Seunghwan Moon
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Patent number: 8303341Abstract: A connector includes female and male connectors. The female connector includes a housing having a groove recessed from a front surface of the housing, a signal terminal including a signal contact section provided at a first wall of the groove and an external connection section connected with the signal contact section and protruding out of the housing through a rear surface of the housing, and a grounding terminal including a grounding contact section provided at an opposing wall facing the first wall of the groove and a grounding connection section connected with the grounding contact section, the grounding connection section extending out of the groove at the front surface of the housing.Type: GrantFiled: December 12, 2011Date of Patent: November 6, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Joo-Yeon Won, OckJin Kim