Abstract: An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.

Abstract: A digital signal processing circuit includes an analog gain compensator that compensates for an analog gain of a baseband signal including a plurality of component carriers (CCs) to output a compensated baseband signal; an analog-to-digital converter (ADC) that converts the compensated baseband signal into a first digital signal; a plurality of filtering circuits that generate a second digital signal from the first digital signal; and a control circuit. Each filtering circuit sequentially filters the first digital signal so that a corresponding one of the second digital signals retains one CC among the CCs, compensates for a digital gain, and a performs down-sampling. The control circuit generates an analog gain control signal for controlling the analog gain based on the second digital signals and a digital gain control signal for controlling the digital gain.

Abstract: A digital signal processing circuit includes an analog gain compensator that compensates for an analog gain of a baseband signal including a plurality of component carriers (CCs) to output a compensated baseband signal; an analog-to-digital converter (ADC) that converts the compensated baseband signal into a first digital signal; a plurality of filtering circuits that generate a second digital signal from the first digital signal; and a control circuit. Each filtering circuit sequentially filters the first digital signal so that a corresponding one of the second digital signals retains one CC among the CCs, compensates for a digital gain, and a performs down-sampling. The control circuit generates an analog gain control signal for controlling the analog gain based on the second digital signals and a digital gain control signal for controlling the digital gain.

Abstract: A heatsink having enhanced localized cooling. The heatsink comprises a wall; a heatframe; a coolant channel between the wall and the heatframe, wherein a bulk coolant flows through the coolant channel; and one or more nozzles that extend into the coolant channel and proximate the wall and/or the heatframe, wherein a high-pressure coolant flows through the one or more nozzles, mixes with the bulk coolant in the coolant channel, and impinges on a cooling area of the wall and/or the heatframe proximate an outlet of the one or more nozzles to provide enhanced localized cooling to at least a portion of a heat producing device that is proximate to or in partial contact with the wall and/or the heatframe proximate to the cooling area of the wall and/or the heatframe.

Abstract: A semiconductor device includes a first ADC configured to sample an input signal based on a first clock signal, quantize the input signal with a first gain, and output a plurality of first output signals, and a second ADC configured to sample the input signal based on a second clock signal obtained by delaying the first clock signal, quantize the input signal with a second gain, and output a plurality of second output signals. The device includes a gain mismatch estimator configured to calculate first and second values which are averages of absolute values of the first output signals and the second output signals, and calculate first and second gain correction values using the first and second values. A gain mismatch compensator is configured to output a plurality of corrected first output signals and corrected second output signals, according to the first and second gain correction values.

Abstract: A super-resolution video processing method and system for effective video compression can include receiving a low-resolution training video and training a neural network using a video, which is output by applying the low-resolution training video to the neural network and differentiable units included in a video encoding module, and a high-resolution training video to convert a low-resolution video into a high-resolution video.

Abstract: A cooling module comprising a porous media that is at least partially inserted into a coolant channel of a heatsink. Generally the coolant is a liquid, though in some instances it may be a gas. More specific, a cooling module for providing enhanced localized cooling of a heatsink comprising a porous media having a volume and a seal plate connected to the porous media, wherein a portion of the volume of the porous media extends through a wall and/or a heatframe of the heatsink into a coolant channel such that coolant flows through the porous media extending into the coolant channel. The seal plate provides a seal for the wall and/or the heatframe so that the coolant does not flow out the wall and/or the heatframe. The seal plate provides enhanced localized cooling to a heat producing device that is at least in partial contact with the seal plate.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: A circuit card assembly comprising at least one electronic component that generates heat and a thermal management system the at least one electronic component is disclosed. The thermal management system comprises one or more phase change modules for distributing and storing heat; a metal frame in thermal contact with the at least one electronic component and having at least one opening for receiving the one or more phase change modules; and a heat transfer apparatus in thermal contact with one or more of the at least one electronic component and the metal frame. The heat transfer apparatus comprises at least one heat pipe and/or at least one heat spreader. The heat transfer apparatus provides a first heat transfer path during a period of reduced heat dissipation or cooling. The one or more phase change modules distributes and stores heat during the period of reduced heat dissipation or cooling.

Abstract: An electronics assembly having a substrate, a heat-conductive body spaced from the substrate, a temperature dependent electronic component mounted on the substrate, and a heating element in thermal contact between the temperature dependent electronic component and the heat-conductive body. Methods of making and using an electronics assembly are also provided.

Abstract: An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.

Abstract: The present disclosure relates to a method for manufacturing an ultra-low-temperature, fast-curable epoxy resin and a powder coating composition comprising a resin manufactured thereby and, specifically, to a method for manufacturing an ultra-low-temperature, fast-curable epoxy resin and a powder coating composition comprising a resin manufactured thereby, wherein the epoxy resin is curable in conditions of 110-130° C./10 min and thus can be used even in a material, of which the temperature is difficult to raise or which is sensitive to heat.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: An electronic device includes: an antenna; a communication circuit connected with the antenna; and one or more processors, wherein the one or more processors are configured to: identify a second amount of power corresponding to a second output signal outputted through the antenna for a second time using the communication circuit, the operation of identifying the second amount of power comprising an operation of identifying a second electromagnetic wave absorption rate corresponding to the second amount of power; determine a maximum output power for a third output signal to be outputted through the antenna according to a difference between a target electromagnetic wave absorption rate and the second electromagnetic absorption rate; and output the third output signal through the antenna based at least one the maximum output power.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: An electronic device according to various embodiments of the present invention comprises: a display panel; a biometric sensor module disposed on the back surface of the display panel; a processor electrically connected to the display panel and the biometric sensor module, and configured to acquire biometric information by using the biometric sensor module; a first adhesive member filling the gap formed between the back surface of the display panel and the biometric sensor module; and a second adhesive member applied on the first adhesive member, wherein the biometric sensor module can be attached to the back surface of the display panel by using the second adhesive member. In addition, other embodiments are possible.

Abstract: An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.