Abstract: A super-resolution video processing method and system for effective video compression can include receiving a low-resolution training video and training a neural network using a video, which is output by applying the low-resolution training video to the neural network and differentiable units included in a video encoding module, and a high-resolution training video to convert a low-resolution video into a high-resolution video.

Abstract: Proposed are a smart distribution vehicle and a control method for the smart distribution vehicle. The smart distribution vehicle includes a fork arm, a fork which is coupled to the fork arm and which extends toward a front side of the fork arm, an electromagnet mounted on the front side of the fork arm, and a control part configured to control whether to supply a current to the electromagnet by determining whether an object has a magnetic property when the object is seated on the fork arm.

Abstract: A cooling module comprising a porous media that is at least partially inserted into a coolant channel of a heatsink. Generally the coolant is a liquid, though in some instances it may be a gas. More specific, a cooling module for providing enhanced localized cooling of a heatsink comprising a porous media having a volume and a seal plate connected to the porous media, wherein a portion of the volume of the porous media extends through a wall and/or a heatframe of the heatsink into a coolant channel such that coolant flows through the porous media extending into the coolant channel. The seal plate provides a seal for the wall and/or the heatframe so that the coolant does not flow out the wall and/or the heatframe. The seal plate provides enhanced localized cooling to a heat producing device that is at least in partial contact with the seal plate.

Abstract: A heatsink having enhanced localized cooling. The heatsink comprises a wall; a heatframe; a coolant channel between the wall and the heatframe, wherein a bulk coolant flows through the coolant channel; and one or more nozzles that extend into the coolant channel and proximate the wall and/or the heatframe, wherein a high-pressure coolant flows through the one or more nozzles, mixes with the bulk coolant in the coolant channel, and impinges on a cooling area of the wall and/or the heatframe proximate an outlet of the one or more nozzles to provide enhanced localized cooling to at least a portion of a heat producing device that is proximate to or in partial contact with the wall and/or the heatframe proximate to the cooling area of the wall and/or the heatframe.

Abstract: A cooling module comprising a porous media that is at least partially inserted into a coolant channel of a heatsink. Generally the coolant is a liquid, though in some instances it may be a gas. More specific, a cooling module for providing enhanced localized cooling of a heatsink comprising a porous media having a volume and a seal plate connected to the porous media, wherein a portion of the volume of the porous media extends through a wall and/or a heatframe of the heatsink into a coolant channel such that coolant flows through the porous media extending into the coolant channel. The seal plate provides a seal for the wall and/or the heatframe so that the coolant does not flow out the wall and/or the heatframe. The seal plate provides enhanced localized cooling to a heat producing device that is at least in partial contact with the seal plate.

Abstract: A super-resolution video processing method and system for effective video compression can include receiving a low-resolution training video and training a neural network using a video, which is output by applying the low-resolution training video to the neural network and differentiable units included in a video encoding module, and a high-resolution training video to convert a low-resolution video into a high-resolution video.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: The present disclosure relates to a method for manufacturing an ultra-low-temperature, fast-curable epoxy resin and a powder coating composition comprising a resin manufactured thereby and, specifically, to a method for manufacturing an ultra-low-temperature, fast-curable epoxy resin and a powder coating composition comprising a resin manufactured thereby, wherein the epoxy resin is curable in conditions of 110-130° C./10 min and thus can be used even in a material, of which the temperature is difficult to raise or which is sensitive to heat.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: An electronic device according to various embodiments of the present invention comprises: a display panel; a biometric sensor module disposed on the back surface of the display panel; a processor electrically connected to the display panel and the biometric sensor module, and configured to acquire biometric information by using the biometric sensor module; a first adhesive member filling the gap formed between the back surface of the display panel and the biometric sensor module; and a second adhesive member applied on the first adhesive member, wherein the biometric sensor module can be attached to the back surface of the display panel by using the second adhesive member. In addition, other embodiments are possible.

Abstract: An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.

Abstract: An electronic device according to various embodiments of the present invention comprises: a display panel; a biometric sensor module disposed on the back surface of the display panel; a processor electrically connected to the display panel and the biometric sensor module, and configured to acquire biometric information by using the biometric sensor module; a first adhesive member filling the gap formed between the back surface of the display panel and the biometric sensor module; and a second adhesive member applied on the first adhesive member, wherein the biometric sensor module can be attached to the back surface of the display panel by using the second adhesive member. In addition, other embodiments are possible.

Abstract: Methods and apparatuses for cooling an electronic device assembly having a heat producing are described. An electronic device assembly includes a heat dissipation member and a dielectric two-phase heat transfer device. The dielectric heat transfer device has an evaporator region thermally attached to a hot region of the heat producing component and a condenser region thermally attached to the heat dissipation member. The dielectric two-phase heat transfer device is fabricated from a dielectric material.

Abstract: A component for an electrical machine is disclosed. The component is a stator and/or a rotor. The component includes a core, a magnetic field-generating component, and an oscillating heat pipe assembly. The core includes a plurality of slots and the magnetic field-generating component is disposed in at least one slot of the plurality of slots. The oscillating heat pipe assembly is disposed in the core and the at least one slot of the plurality of slots. The oscillating heat pipe assembly is in contact with the core and the magnetic field-generating component. The oscillating heat pipe assembly includes a dielectric material, and where the oscillating heat pipe assembly has an in-plane thermal conductivity higher than a through-plane thermal conductivity.