Patents by Inventor Joohan Lee
Joohan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070052791Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: November 7, 2006Publication date: March 8, 2007Applicant: GSI Lumonics CorporationInventors: James Cordingley, Jonathan Ehrmann, David Filgas, Shepard Johnson, Joohan Lee, Donald Smart, Donald Svetkoff
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Publication number: 20060216927Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: May 26, 2006Publication date: September 28, 2006Applicant: GSI Lumonics CorporationInventors: James Cordingley, Jonathan Ehrmann, Joseph Griffiths, Joohan Lee, Donald Smart, Donald Svetkoff
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Publication number: 20060192845Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: May 2, 2006Publication date: August 31, 2006Applicant: GSI Lumonics CorporationInventors: James Cordingley, Jonathan Ehrmann, Shepard Johnson, Joohan Lee, Donald Smart, Donald Svetkoff
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Patent number: 6987786Abstract: A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam.Type: GrantFiled: December 13, 2001Date of Patent: January 17, 2006Assignee: GSI Group CorporationInventors: James J. Cordingley, Donald V. Smart, Michael Plotkin, Joohan Lee, William Lauer, Jonathan S. Ehrmann
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Publication number: 20050212906Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: May 9, 2005Publication date: September 29, 2005Applicant: GSI Lumonics CorporationInventors: James Cordingley, Roger Dowd, Jonathan Ehrmann, Joseph Griffiths, Joohan Lee, Donald Smart, Donald Svetkoff
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Publication number: 20050150879Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.Type: ApplicationFiled: December 3, 2004Publication date: July 14, 2005Applicant: GSI Lumonics CorporationInventors: Bo Gu, Donald Smart, James Cordingley, Joohan Lee, Donald Svetkoff, Shepard Johnson, Jonathan Ehrmann
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Publication number: 20050150880Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.Type: ApplicationFiled: December 3, 2004Publication date: July 14, 2005Applicant: GSI Lumonics CorporationInventors: Bo Gu, Donald Smart, James Cordingley, Joohan Lee, Donald Svetkoff, Shepard Johnson, Jonathan Ehrmann
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Publication number: 20050115937Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.Type: ApplicationFiled: December 3, 2004Publication date: June 2, 2005Applicant: GSI Lumonics CorporationInventors: Bo Gu, Donald Smart, James Cordingley, Joohan Lee, Donald Svetkoff, Shepard Johnson, Jonathan Ehrmann
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Publication number: 20050115936Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.Type: ApplicationFiled: December 3, 2004Publication date: June 2, 2005Applicant: GSI Lumonics CorporationInventors: Bo Gu, Donald Smart, James Cordingley, Joohan Lee, Donald Svetkoff, Shepard Johnson, Jonathan Ehrmann
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Publication number: 20050092720Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.Type: ApplicationFiled: December 3, 2004Publication date: May 5, 2005Applicant: GSI Lumonics CorporationInventors: Bo Gu, Donald Smart, James Cordingley, Joohan Lee, Donald Svetkoff, Shepard Johnson, Jonathan Ehrmann
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Publication number: 20040134894Abstract: A laser-based system for processing target material within a microscopic region without causing undesirable changes in electrical or physical characteristics of at least one material surrounding the target material, the system includes a seed laser, an optical amplifier, and a beam delivery system. The seed laser for generating a sequence of laser pulses having a first pre-determined wavelength. The optical amplifier for amplifying at least a portion of the sequence of pulses to obtain an amplified sequence of output pulses. The beam delivery system for delivering and focusing at least one pulse of the amplified sequence of pulses onto the target material. The at least one output pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond. The pulse duration being within a thermal processing range.Type: ApplicationFiled: October 10, 2003Publication date: July 15, 2004Inventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
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Publication number: 20040134896Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.Type: ApplicationFiled: October 10, 2003Publication date: July 15, 2004Inventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
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Publication number: 20020167581Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: March 27, 2002Publication date: November 14, 2002Inventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20020162973Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: March 27, 2002Publication date: November 7, 2002Inventors: James J. Cordingley, Roger D. Dowd, Jonathan S. Ehrmann, Joseph J. Griffiths, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20020141473Abstract: A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam.Type: ApplicationFiled: December 13, 2001Publication date: October 3, 2002Applicant: General Scanning, Inc.Inventors: James J. Cordingley, Donald V. Smart, Michael Plotkin, Joohan Lee, William Lauer, Jonathan S. Ehrmann