Patents by Inventor Joon-Dong Kim

Joon-Dong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230187432
    Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
    Type: Application
    Filed: November 18, 2022
    Publication date: June 15, 2023
    Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
  • Patent number: 11508712
    Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: November 22, 2022
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
  • Patent number: 11101394
    Abstract: Provided are a method of transferring a tin sulfide film and a photoelectric device using the tin sulfide film. The method includes: forming a first tin sulfide film on a first substrate; placing a second substrate on the first tin sulfide film; and forming a second tin sulfide film bonded to a surface of the second substrate by transferring a portion of the first tin sulfide film to the second substrate through a rapid thermal process (RTP).
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: August 24, 2021
    Assignee: INU RESEARCH & BUSINESS FOUNDATION
    Inventors: Joon Dong Kim, Malkeshkumar Patel
  • Patent number: 11094645
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 17, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • Publication number: 20210175222
    Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
    Type: Application
    Filed: December 14, 2020
    Publication date: June 10, 2021
    Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
  • Patent number: 10867984
    Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: December 15, 2020
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
  • Publication number: 20190371739
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 7, 2019
    Publication date: December 5, 2019
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • Publication number: 20190341511
    Abstract: Provided are a method of transferring a tin sulfide film and a photoelectric device using the tin sulfide film. The method includes: forming a first tin sulfide film on a first substrate; placing a second substrate on the first tin sulfide film; and forming a second tin sulfide film bonded to a surface of the second substrate by transferring a portion of the first tin sulfide film to the second substrate through a rapid thermal process (RTP).
    Type: Application
    Filed: May 2, 2019
    Publication date: November 7, 2019
    Inventors: Joon Dong KIM, Malkeshkumar Patel
  • Publication number: 20190312021
    Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
    Type: Application
    Filed: May 14, 2019
    Publication date: October 10, 2019
    Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
  • Patent number: 10381313
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: August 13, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • Publication number: 20190189566
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: November 20, 2018
    Publication date: June 20, 2019
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • Patent number: 10290621
    Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: May 14, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
  • Patent number: 10134687
    Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: November 20, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
  • Patent number: 10037949
    Abstract: A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: July 31, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Hee Sung Kim, Yeoung Beom Ko, Dae Byoung Kang, Jae Jin Lee, Joon Dong Kim, Dong Jean Kim
  • Publication number: 20180158971
    Abstract: A transparent photoelectric element and a method for fabricating the same are provided. The method includes providing a transparent substrate, forming a transparent conductive film on the transparent substrate at room temperature, forming an n-type oxide semiconductor film on the transparent conductive film and forming a p-type nickel oxide film having a quantum dot structure on the n-type oxide semiconductor film through reactive sputtering at room temperature, the reactive sputtering including oxygen and argon, a ratio of oxygen being smaller than a ratio of argon.
    Type: Application
    Filed: November 30, 2017
    Publication date: June 7, 2018
    Inventors: Joon Dong Kim, Malkeshkumar PATEL
  • Publication number: 20170373051
    Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
    Type: Application
    Filed: August 22, 2017
    Publication date: December 28, 2017
    Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
  • Patent number: 9741701
    Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: August 22, 2017
    Assignee: Amkor Technology, Inc.
    Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
  • Publication number: 20160056079
    Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
    Type: Application
    Filed: August 18, 2015
    Publication date: February 25, 2016
    Inventors: Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
  • Patent number: 8791394
    Abstract: The present invention is to provide a heating substrate equipped with a conductive thin film and electrodes. The heating substrate includes a transparent substrate, a plurality of electrodes formed on a first face of the substrate, and a conductive thin film formed on the first face of the substrate and including a plurality of regions electrically connected each other in parallel by the plurality of electrodes. Furthermore, a method of manufacturing a heating substrate equipped with a conductive thin film and electrodes according to an exemplary embodiment of the present invention includes forming the conductive thin film on a substrate, forming main electrodes so as to extend on the substrate while being adjacent to edges of the conductive thin film, and forming branched electrodes that are extended from the conductive thin film across one side of the conductive thin film while coming in contact with the conductive thin film.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: July 29, 2014
    Assignee: Korea Institute of Machinery & Materials
    Inventors: Chang-Soo Han, Jin-Won Song, Joon-Dong Kim, Yu-Hwan Yoon
  • Patent number: 8749300
    Abstract: Disclosed is a DC voltage conversion circuit of a liquid crystal display apparatus, including: a main pumping circuit including a plurality of thin film transistors and configured to output voltage for driving a liquid crystal display apparatus when the plurality of thin film transistors are alternately turned on or off; and a switch control signal generator configured to control voltages applied to gates of the plurality of thin film transistors by inversion of a clock signal, in which each thin film transistor is turned on when positive gate-source voltage is applied thereto, and turned off when negative gate-source voltage is applied thereto.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: June 10, 2014
    Assignees: Electronics and Telecommunications Research Institute, Konkuk University Industrial Cooperation Corp.
    Inventors: Jae Eun Pi, Kee Chan Park, Hong Kyun Leem, Joon Dong Kim, Youn Kyung Kim, Ji Sun Kim, Byoung Gon Yu, Sang Hee Park, Him Chan Oh, Min Ki Ryu, Chi Sun Hwang