Abstract: A 3D nanopore device for characterizing biopolymer molecules includes a first selecting layer having a first axis of selection. The device also includes a second selecting layer disposed adjacent the first selecting layer and having a second axis of selection orthogonal to the first axis of selection. The device further includes an third electrode layer disposed adjacent the second selecting layer, such that the first selecting layer, the second selecting layer, and the third electrode layer form a stack of layers along a Z axis and define a plurality of nanopore pillars.

Abstract: Disclosed are a redistribution layer structure, a method of forming a redistribution layer structure, a semiconductor package device including a redistribution layer structure, and a method of manufacturing a semiconductor package device including a redistribution layer structure. The semiconductor package device may include a redistribution layer structure, wherein the redistribution layer structure may include a first insulating layer having one or more openings open to a target region and an unetched portion configured to improve the flatness of the redistribution layer structure in the remaining region excluding the one or more openings in the space corresponding to the target region and a first wiring member layer disposed on the first insulating layer so as to at least partially fill the one or more openings.

Abstract: Disclosed are a chip bonding apparatus for semiconductor packaging and a semiconductor packaging method using the same. The chip bonding apparatus may include a bonding head, wherein the bonding head may include a plurality of chip holding units, each of which is configured to individually hold a chip, and the bonding head may be configured to adjust the interval between the plurality of chip holding units. The chip bonding apparatus may be configured to bond a plurality of chips to a given target surface at controlled intervals using the plurality of chip holding units according to a multi-chip bonding method. The semiconductor packaging method may include bonding chips to a target surface of a carrier substrate at controlled intervals using the plurality of chip holding units according to the multi-chip bonding method.

Abstract: A semiconductor memory device includes a first structure on a substrate and including core regions and a first peripheral circuit region, and a second structure on the first structure and including cell array regions and a second peripheral circuit region. The second structure includes a first active pattern in each of the cell array regions and perpendicular to an upper surface of the first structure, a word line adjacent to one side of the first active pattern and extending in a first direction parallel to the upper surface of the first structure, a bit line in contact with a lower surface of the first active pattern and extending in a second direction intersecting the first direction, a second active pattern in the second peripheral circuit region and perpendicular to the upper surface of the first structure, and an anti-fuse gate electrode on one side of the second active pattern.

Abstract: A water-repellent coating lens for a camera has enhanced abrasion resistance performance and chemical resistance performance of the water-repellent coating. The water-repellent coating lens includes a lens base layer and a plurality of coating layers deposited on the lens base layer. The plurality of coating layers include a first water-repellent coating layer containing a fluorine-based compound and a second water-repellent coating layer positioned on the bottom surface of the first water-repellent coating layer and containing an inorganic oxide.

Abstract: Proposed are a substrate processing apparatus and a substrate processing method capable of efficiently preventing contamination of a substrate and a processing space caused by a reverse flow of purge gas.

Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a cup providing a processing space; a support unit provided in the processing space, and for supporting a substrate; a support unit provided in the processing space, and for supporting a substrate; a liquid supply unit including a nozzle for discharging a liquid to the substrate; a position adjuster coupled to the nozzle and for adjusting a position of the nozzle; and an adjustment unit coupled to the support unit, and for detecting pressure data when the liquid discharged from the nozzle meets the adjustment unit and position information at which the pressure data is generated.

Abstract: A facial verification method and apparatus is disclosed. The facial verification method includes detecting a face region in an input image, determining whether the detected face region represents a partial face, in response to a determination that the detected face region represents the partial face, generating a synthesized image by combining image information of the detected face region and reference image information, performing a verification operation with respect to the synthesized image and predetermined first registration information, and indicating whether facial verification of the input image is successful based on a result of the performed verification operation.

Abstract: A medical liquid discharge assembly includes: a driving part configured to move in a preset direction, a rotating part configured to come into contact with the driving part, and to rotate in one direction in response to the movement of the driving part, a tube part disposed adjacent to the rotating part and including a flexible material, a pressure-applying part configured to come into contact with the rotating part, and to come into contact with and apply pressure to the tube part in response to the rotation of the rotating part, and a locking part configured to move in a preset direction, and to fix a position of the pressure-applying part by coming into contact with and supporting one surface of the pressure-applying part while the pressure-applying part applies pressure to the tube part.

Abstract: A system for holding a first set of die during a first placement operation onto a substrate and placing a second set of additional die onto the same substrate during a second placement operation. The first set of die have a different height than the second set of die and the sets of die may comprise an entire wafer of die. A stretchable mounting film has an adhesive to which a set of die and a frame attach. The frame has an open center portion formed by two or more outer support rail sections that are expandable to an expanded position. An optional frame lock may secure the frame in the expanded position. The frame and mounting tape can be expanded along a first axis, a second axis, or both, which separates the die adhesively attached to the mounting film.

Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.

Abstract: Disclosed are an interconnection module substrate for a semiconductor package, a semiconductor package device including the same, and manufacturing methods thereof. The interconnection module substrate includes a plurality of via-defining structures disposed spaced apart from each other in a horizontal direction, each of the plurality of via-defining structures including a substrate material unit and a conductive via element extending through the substrate material unit in a vertical direction, at least one interconnection bridge member disposed spaced apart from or adjacent to the plurality of via-defining structures in the horizontal direction, and a substrate material layer embedded in the space between and around the plurality of via-defining structures and the interconnection bridge member to form a single substrate shape together therewith, the substrate material layer being configured to expose the plurality of via-defining structures and the interconnection bridge member.

Abstract: A system for holding multiple semiconductor die during a single placement operation onto a substrate. The system includes a stretchable mounting film having an adhesive to which two or more semiconductor die and a frame attaches. The frame has an open center portion formed by two or more outer support rail sections that are expandable to an expanded position. An optional frame lock may secure the frame in the expanded position. The frame may have four sections allowing expansion along two axis. The frame sections may have connection points configured to releasably attach the frame to a position control device that expands the sections to the expanded position. The frame and mounting tape can be expanded by stretching along a first axis, a second axis, or both, which separates the two or more dies adhesively attached to the mounting film while the dies are attached to the mounting film.

Abstract: A pattern electrode structure for an electrowetting device is laminated between a base material and a dielectric layer of the electrowetting device, and the pattern electrode structure includes first branch electrodes formed in a direction perpendicular to any plane perpendicular to a plane defined by the pattern electrode structure, and a basal pattern electrode formed in an area below lower ends of the first branch electrodes and connected to an electrode connection portion configured to receive a voltage, in which a sum of an interval between the first branch electrode and the basal pattern electrode and a width of the basal pattern electrode is larger than a diameter of a droplet to be removed, thereby preventing the droplet from stagnating without falling at the terminal end of the pattern in a structure that uses the vertical pattern.

Abstract: A Liquid medicine injection apparatus includes: a needle portion having one or more needle bodies configured to be injected into a user's body, a reservoir portion configured to accommodate a medical liquid and receive power from a driving portion to deliver the medical liquid to the needle portion, a base portion on which the reservoir portion, the needle portion, and the driving portion are installed, a cover portion covering the base portion, and a sensor portion configured to measure blood sugar. In the cover portion, an insertion groove which has one side open and has a preset depth is formed, and the sensor portion is insertable into the insertion groove and is spatially separable from the base portion.

Abstract: Disclosed is a fan-out package in which two or more dies are integrated in a fan-out packaging process, wherein the fan-out package includes a bridge structure including a bridge substrate formed on one side of the fan-out package, a redistribution layer formed on the bridge substrate, the redistribution layer including at least one trace, the redistribution layer being configured to electrically connect the dies to each other, and a passive element formed in the redistribution layer by patterning. The routing density of the trace is relieved, and electrical performance is improved by the provision of the passive element.

Abstract: An embodiment pattern electrode structure for an electrowetting device includes a first branch electrode disposed in a direction perpendicular to any plane that is perpendicular to a plane defined by the pattern electrode structure and a basal pattern electrode disposed in an area above an upper end of the first branch electrode and connected to an electrode connection portion configured to receive a voltage, wherein an interval between the first branch electrode and the basal pattern electrode is equal to or larger than a diameter of a droplet to be removed.

Abstract: A cleaning wipe case according to an embodiment includes a case main body provided in a cylinder shape, a case lid connected to one upper side of the case main body, a sub cover provided on one upper inner side of the case main body, a withdrawal part penetrating a central portion of the sub cover, a withdrawal member having one side connected to an upper portion of the case main body through a tear portion, and a storage part provided on one side of an edge of the sub cover.

Abstract: A dielectrically-enhanced polyethylene formulation made from (A) a polyethylene-nucleation agent, a dielectrically-enhanced (B) a multimodal ultra-high density polyethylene (multimodal uHDPE) composition, and, optionally, (C) a low density polyethylene (LDPE) polymer. A method of making same, an insulated electrical device comprising same, and a method of using same.

Abstract: A method of manufacturing and using a nanofluidic NAND transistor sensor array scheme including a plurality of nanopore channel pillars, a plurality of respective fluidic channels, a plurality of gate electrodes, a top chamber, and a bottom chamber includes placing a sensor substrate in an electrolyte solution comprising biomolecules and DNA. The method also includes placing first and second electrodes in the electrolyte solution (Vpp and Vss of the nanofluidic NAND transistor); forming the nanopore channel pillars; placing the gate electrodes and gate insulators in respective walls of the nanopore channel pillars; applying an electrophoretic bias in the first and second electrodes; applying a bias in the gate electrodes; detecting a change in an electrode current in the electrolyte solution caused by a change in a gate voltage; and detecting a change in a surface charge in nanopore channel electrodes in the respective fluidic channels.