Abstract: A cordless charging apparatus is provided. The cordless charging apparatus includes a cordless power reception resonator including a feeding connector for electric feeding, and a ground connector for grounding. The ground connector is spaced apart from a connection terminal connecting the cordless power reception resonator to a circuit.

Abstract: A wireless charging method and apparatus are provided. A non-contact wireless local communication unit performs non-contact wireless local communication for wireless charging authentication through a non-contact wireless local communication antenna. A wireless power receiver receives supply power from a wireless power transmitter by using a resonator resonating on a resonance frequency equal to that of the wireless power transmitter after the wireless charging authentication. A charging controller performs wireless charging by using the supply power received by the wireless power receiver. One or more switches switch between a connection between the non-contact wireless local communication antenna and the non-contact wireless local communication unit, and a connection between the wireless power receiver and the charging controller.

Abstract: An internal antenna is provided that includes a first antenna having a first antenna pattern formed on a first dielectric layer, and a second antenna having a second antenna pattern formed on a second dielectric layer. The second dielectric layer has a higher dielectric constant than the first dielectric layer. The first and second antenna patterns are electrically connected to each other.

Abstract: An apparatus for controlling wireless power transmission includes a near-field wireless communication antenna for receiving wireless power transmission control signals from a power transmitting device at a communication frequency, a near-field wireless communication Integrated Circuit (IC) for delivering wireless power transmission control messages based on the wireless power transmission control signals received through the near-field wireless communication antenna to a power IC, a Wireless Power Transmission (WPT) coil for resonating at a frequency band corresponding to a resonant frequency of the power transmitting device, to receive power supplied from the power transmitting device, and the power IC for controlling output of a constant voltage, using the supply power received by the WPT coil, based on the wireless power transmission control messages from the near-field wireless communication IC.

Abstract: A wireless power transmission controlling apparatus and method are provided. The apparatus includes a power amplifier that receives a source power, amplifies the received source power, and outputs a wireless power transmission signal from the amplified received source power, a band pass filter that filters the wireless power transmission signal, and passes a harmonic wave corresponding to a communication frequency band, and a communication unit that transmits a wireless power transmission control signal using the harmonic wave corresponding to the communication frequency band.

Abstract: A manufacturing method of a semiconductor chip package includes molding a semiconductor chip and a number of passive devices after arranging on a film the semiconductor chip and the passive devices located in a vacant space around the periphery of the semiconductor chip; removing the film, forming an adhesive layer in a film-removed area, and attaching a conductive layer to the adhesive layer; etching a conductive layer to thereby form a conductive circuit pattern; and providing one or more conductive pads, which electrically connect the conductive circuit pattern to the semiconductor chip and to the passive devices.

Abstract: Described is a method for fabricating ceramic chip packages in which an epoxy resin containing fine ceramic particles is applied on a ceramic substrate provided with chip packages respectively having a plurality of chips mounted thereon, thereby improving reliability and endurance of the package and miniaturizing the size of the package. The epoxy resin is applied on the ceramic substrate provided with a plurality of the chips mounted thereon except a designated region, thereby minimizing the deformation of the substrate. The epoxy resin layer is formed on the substrate by two steps including a first step for forming a first epoxy resin layer serving as a dam and a second step for forming a second epoxy resin layer, thereby reducing the amount of the used epoxy resin and improving reliability and endurance of the package against temperature and humidity.