Abstract: A seatback entertainment display system for a vehicle is provided having a support member extending from a seatback frame, and an adjustment mechanism coupled to the support member, and a display device coupled to the adjustment mechanism. The support member may be a cantilever type beam or frame extending upwardly from the seatback at a position behind and adjacent to a headrest. The support member may also be a pair of rods arranged to fixedly receive the display device and movably receive the headrest. The adjustment device may include any one or more of a forward-rearward tilting mechanism, a side to side pivoting mechanism and an up-down translation mechanism. The seatback entertainment display system is adaptable to optimize a viewing angle for a rear seat occupant of the vehicle, throughout a normal adjustment range of the seat.

Abstract: A seatback entertainment display system for a vehicle is provided having a support member extending from a seatback frame, and an adjustment mechanism coupled to the support member, and a display device coupled to the adjustment mechanism. The support member may be a cantilever type beam or frame extending upwardly from the seatback at a position behind and adjacent to a headrest. The support member may also be a pair of rods arranged to fixedly receive the display device and movably receive the headrest. The adjustment device may include any one or more of a forward-rearward tilting mechanism, a side to side pivoting mechanism and an up-down translation mechanism. The seatback entertainment display system is adaptable to optimize a viewing angle for a rear seat occupant of the vehicle, throughout a normal adjustment range of the seat.

Abstract: A lead frame for a semiconductor device used in a vertically surface-mounted package which has internal leads gathered on one side thereof includes separately formed dummy leads attached to a semiconductor chip on the opposite side of the lead frame to avoid an inconsistent inflow pressure of a molding material during a package molding process caused by gathering of the internal leads on only one side, thereby enhancing reliability of the semiconductor package. There is also no need to separately form a heat sink structure for eliminating heat of the semiconductor chip since the dummy leads function as the heat sink.

Abstract: A semiconductor chip package comprises leads which protrude from one side of a package body, and support portions which are formed at both ends of the package body on either side of the leads for firmly mounting the package on a printed circuit board (PCB). The support portions are made of a same material as the package body. At the package body, a slot is formed to further protect the leads, and the leads are alternately formed to mount the packages close by. Thus, there is no additional process step for forming holes in the PCB to mount the support portions of the semiconductor package, so the mounting process of the package becomes simpler. The support portions which protrude from the package body permit the package to be mounted on the PCB firmly. The slot and support portions protect the leads and prevent the leads from being deformed by external forces, thereby improving the reliability of the semiconductor package.

Abstract: A door condition sensing apparatus for a microwave oven includes a mechanical switch and a photodetector, each of which is separately responsive to the closing of the door. A microprocessor receives signals from both the switch and the photo-detector to determine whether the door is closed. The photo-detector is actuated by a lever which is swung by the door as it closes. The lever comprises an actuator arm of a second switch connected to the microprocessor.