Patents by Inventor Joon Kook Kwon

Joon Kook Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microneedle probe device for measuring sap flow rate of plant, and method for measuring sap flow rate of plant by using same
    Patent number: 11143534
    Abstract: According to an exemplary embodiment, a microneedle probe device for measuring a sap flow rate of a plant includes: a substrate, of which at least a part is inserted into a plant, and a thickness and a width are microscales; a single metal wire provided on the substrate; a power source, which applies a current to the metal wire for a predetermined time and heats the metal wire; and a processor, which calculates a flow rate of sap through a movement of heat generated in the metal wire according to a flow of the sap within the plant.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: October 12, 2021
    Assignees: Seoul National University R&DB Foundation, Republic Of Korea Rural Development Administration
    Inventors: Jung Hoon Lee, Sang Woong Baek, Eun Yong Jeon, Seung Yul Choi, Kyoung Sub Park, Joon Kook Kwon, Kyung Hwan Yeo, In Ho Yu, Jae Han Lee
  • Microneedle Probe Device For Measuring Sap Flow Rate Of Plant, And Method For Measuring Sap Flow Rate Of Plant By Using Same
    Publication number: 20190257681
    Abstract: According to an exemplary embodiment, a microneedle probe device for measuring a sap flow rate of a plant includes: a substrate, of which at least a part is inserted into a plant, and a thickness and a width are microscales; a single metal wire provided on the substrate; a power source, which applies a current to the metal wire for a predetermined time and heats the metal wire; and a processor, which calculates a flow rate of sap through a movement of heat generated in the metal wire according to a flow of the sap within the plant.
    Type: Application
    Filed: June 14, 2017
    Publication date: August 22, 2019
    Inventors: Jung Hoon Lee, Sang Woong Baek, Eun Yong Jeon, Seung Yul Choi, Kyoung Sub Park, Joon Kook Kwon, Kyung Hwan Yeo, In Ho Yu, Jae Han Lee