Abstract: An adhesive film for semiconductor is disclosed. The present invention provides an adhesive film for semiconductor used in semiconductor packaging, comprising an adhesive layer, wherein the adhesive layer has surface tension of 19 to 52 erg/cm at 60 ° C. Accordingly, the adhesive film for semiconductor according to the present invention may prevent bubbles from being formed between the adhesive film and a supporting member by controlling surface tension in an optimum condition, and also obtain higher reliability in use of the adhesive film in the semi-conductor packaging by controlling tackiness and adhesive force in an optimum condition.

Abstract: The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2 or more at normal temperature after the die attaching.

Abstract: A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Abstract: The present invention relates to an attach paste composition for a semiconductor package. The attach paste composition for a semiconductor package includes a mixed resin, or a blend of an elastic resin and an epoxy resin as a basic resin. At this time, preferably the basic resin includes 50 to 95 weight % of the elastic resin and 5 to 50 weight % of the epoxy resin. The present invention enables a conventional semiconductor packaging method using a die adhesive to eliminate a pre-drying process performed after application of a die adhesive through screen printing and a thermal hardening process performed after an encapsulation process, maintains the properties of the die adhesive, ensures reliability of semiconductor products, and realizes a simple process.

Abstract: The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2 or more at normal temperature after the die attaching.

Abstract: A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.

Abstract: Disclosed is a squeeze for a screen printer. The present invention provides a squeeze for a screen printer, which coats a printed circuit board with an adhesive paste while moving parallel over a metal mask on the printed circuit board, the printed circuit board being open through an opening of the metal mask, the squeeze including a solvent storage unit for storing solvents; and solvent discharging holes for discharging the solvents, stored in the solvent storage unit, to an adhesive paste. Accordingly, the squeeze for a screen printer of the present invention may be useful to prevent a dog ear phenomenon, namely that an adhesive paste layer is asymmetrically formed in an indented manner, by controlling a viscosity of an adhesive paste by discharging a solvent onto an adhesive paste layer that comes in contact with the squeeze when the adhesive paste layer is formed in the printed circuit board.

Abstract: Disclosed are a die-attaching paste composition and a method for hardening the same. The present invention provides the die-attaching paste composition applied at a thickness of 200 ?m or less on a printed circuit board (PCB), including liquid or solid epoxy, acrylate, a flexing agent, an organic filler and a UV-initiator. The method for hardening a die-attaching paste of the present invention includes carrying out a B-staging process by irradiating a UV-ray to the die-attaching paste composition. According to the present invention, a processing time may be more shortened and storage of the die-attaching paste may be more significantly improved when a B-staging process using UV rays is applied than when a conventional thermal crosslinking method is used, and therefore a manufacturing cost in the conventional assembly industries may be decreased.

Abstract: A dual printing mask is used for coating a die adhering paste of a predetermined pattern on a substrate uniformly during a semiconductor packaging process. This dual printing mask includes a metal mask layer having a predetermined pattern of openings so as to receive a paste for adhering a semiconductor die onto a substrate, and a mesh layer integrally attached on the metal mask layer.

Abstract: A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.