Patents by Inventor Joon Ryu

Joon Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060264595
    Abstract: A siloxane-based resin having a novel structure and a semiconductor interlayer insulating film using the same. The siloxane-based resins have a low dielectric constant in addition to excellent mechanical properties and are useful materials in an insulating film between interconnect layers of a semiconductor device.
    Type: Application
    Filed: May 11, 2006
    Publication date: November 23, 2006
    Inventors: Yi Lyu, Ki Song, Joon Ryu, Jong Seon
  • Publication number: 20050084689
    Abstract: A composition of (i) an organometallic precursor containing a hydrazine compound coordinating with a central metal thereof and (ii) an organometallic compound of a main group metal and a method of forming metal film or pattern using this composition.
    Type: Application
    Filed: June 24, 2004
    Publication date: April 21, 2005
    Inventors: Euk Hwang, Sang Lee, Young Byun, Joon Ryu, Hae Son
  • Publication number: 20050049382
    Abstract: A siloxane-based resin having a novel structure and a semiconductor interlayer insulating film using the same. The siloxane-based resins have a low dielectric constant in addition to excellent mechanical properties and are useful materials in an insulating film between interconnecting layers of a semiconductor device.
    Type: Application
    Filed: February 2, 2004
    Publication date: March 3, 2005
    Inventors: Yi Lyu, Jin Yim, Ki Song, Hyun Jeong, Joon Ryu
  • Publication number: 20050003681
    Abstract: A siloxane-based resin having a novel structure and a semiconductor interlayer insulating film using the same. The siloxane-based resins have a low dielectric constant in addition to excellent mechanical properties and are useful materials in an insulating film between interconnect layers of a semiconductor device.
    Type: Application
    Filed: November 28, 2003
    Publication date: January 6, 2005
    Inventors: Yi Lyu, Ki Song, Joon Ryu, Jong Seon