Patents by Inventor Joon Seo Ki

Joon Seo Ki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing very low roughness electrodeposited copper foil and electrodeposited copper foil manufactured thereby
    Publication number: 20040104118
    Abstract: The present invention relates to a method for manufacturing a low roughness electrodeposited copper foil, and an electrodeposited copper foil manufactured thereby, and uses an electrolyte which basically consists of a sulfuric acid, a copper ion and a chloride ion is adapted with an additive which consists of a HEC (Hydroxyethyl Cellulose) of 0.05˜50 ppm, a SPS (bis(sodiumsulfopropyl)disulfide) of 0.05˜20 ppm, and a gelatin of 0.1˜100 ppm. The present invention is adapted to manufacture a low roughness electrodeposited copper foil using a conventional copper foil manufacture facility and the electrodeposited copper foil according to the present invention is adapted as a material for a copper clad laminate for a printed circuit substrate and an electrode material for a lithium ion battery.
    Type: Application
    Filed: November 24, 2003
    Publication date: June 3, 2004
    Applicant: LG CABLE LTD.
    Inventors: Sangyum Kim, Chang Hee Choi, Cha Jae Jo, Jeong Ik Kim, Kyung Nyung Woo, Joon Seo Ki, Hong Gi Moon