Abstract: A semiconductor package is provided. The semiconductor package includes a first semiconductor frame that includes a first lead frame and a first insulating layer disposed below the first lead frame; a second semiconductor frame that includes a second lead frame that faces the first lead frame and a second insulating layer disposed on the second lead frame; a semiconductor element that is disposed between the first semiconductor frame and the second semiconductor frame; and a molding portion that surrounds and seals at least a portion of the first semiconductor frame, at least a portion of the second semiconductor frame, and the semiconductor element.

Abstract: A semiconductor package is provided. The semiconductor package includes a first lead frame and a second lead frame that face each other; and a semiconductor element that is disposed between the first lead frame and the second lead frame, wherein the semiconductor element is connected to the first lead frame through a first contacting portion, and is connected to the second lead frame through a second contacting portion. The second lead frame includes a hole that overlaps the second contacting portion.

Abstract: A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.

Abstract: A camera for a vehicle includes: an imaging unit configured to image an exterior of the vehicle; and a controller configured to enlarge a region of interest of the imaging unit in response to a driving speed of the vehicle being higher than a reference speed, and reduce the region of interest of the imaging unit in response to the driving speed being lower than the reference speed.

Abstract: Provided are a driving assistance system and method. The driving assistance system is for interfacing with an individual vehicle and includes: a camera system that generates image information about the surroundings of the vehicle; a vehicle controller that generates driving information about the vehicle; and a communication port. The driving assistance system includes a driving assistance terminal and/or mobile device that are/is connected to the communication port, acquire(s) image information and/or driving information by using the communication port, and execute(s) at least a portion of a travel program for the driving assistance terminal and/or mobile device on the basis of an image and/or driving information for controlling the vehicle with respect to one or more of auxiliary travels and/or autonomous operations of the vehicle through a control signal generated by the driving assistance terminal or the mobile device and provided to the vehicle.

Abstract: A vehicle camera system includes: an around view camera device including a front camera, a left camera, a right camera, and a rear camera, and configured to vary a field of view of one or more of the cameras in response to a control signal; and a control device configured to control the field of view by generating the control signal, in response to an operating mode.

Abstract: A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.

Abstract: A vehicle camera system includes: an around view camera device including a front camera, a left camera, a right camera, and a rear camera, and configured to vary a field of view of one or more of the cameras in response to a control signal; and a control device configured to control the field of view by generating the control signal, in response to an operating mode.

Abstract: A camera for a vehicle includes: an imaging unit configured to image an exterior of the vehicle; and a controller configured to enlarge a region of interest of the imaging unit in response to a driving speed of the vehicle being higher than a reference speed, and reduce the region of interest of the imaging unit in response to the driving speed being lower than the reference speed.

Abstract: Provided are a driving assistance system and method. The driving assistance system is for interfacing with an individual vehicle and includes: a camera system that generates image information about the surroundings of the vehicle; a vehicle controller that generates driving information about the vehicle; and a communication port. The driving assistance system includes a driving assistance terminal and/or mobile device that are/is connected to the communication port, acquire(s) image information and/or driving information by using the communication port, and execute(s) at least a portion of a travel program for the driving assistance terminal and/or mobile device on the basis of an image and/or driving information for controlling the vehicle with respect to one or more of auxiliary travels and/or autonomous operations of the vehicle through a control signal generated by the driving assistance terminal or the mobile device and provided to the vehicle.

Abstract: A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.

Abstract: A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.

Abstract: There is provided a semiconductor module package including: a base substrate formed by mounting one or more first semiconductor devices thereon; a lead frame formed on a top surface of the first semiconductor device and having an inlet formed to inject a solder paste; and spaces inserted between the first semiconductor device and the lead frame to form a separation space, wherein the solder paste is filled in the separation space.

Abstract: There is provided a power module package. The power module package includes: a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil.

Abstract: Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection.

Abstract: There is provided a leadless package type power semiconductor module. According to an exemplary embodiment of the present disclosure, the leadless package type power semiconductor module includes: connection terminals of a surface mounting type (SMT) formed at edges at which respective sides of four surfaces meet each other; a first mounting area connected to the connection terminals through a bridge to be disposed at a central portion thereof and mounted with power devices or control ICs electrically connected to the power devices to control the power devices; and second mounting areas formed between the connection terminals and mounted with the power devices or the control ICs, wherein the first mounting area is disposed at a different height from the second mounting area through the bridge to generate a phase difference from the second mounting area.

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Abstract: Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.

Abstract: A heat radiation sheet for a board including: composite fillers including metal particles and ceramic particles disposed on surfaces of the metal particles; and a base resin, and a manufacturing method of a heat radiation sheet for a board may include: preparing metal particles and ceramic particles; disposing the ceramic particles on surfaces of the metal particles by mixing the metal particles and the ceramic particles with each other; forming oxidized layers on exposed surfaces of the metal particles; and forming a prepreg by mixing composite fillers including the metal particles and the ceramic particles and a base resin with each other.

Abstract: Disclosed herein is a power module package including an external connection terminal; a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is buried at a predetermined depth in a thickness direction; and a semiconductor chip mounted on one surface of the substrate.